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10 Layer Rigid Flex PCB Ka 4+2+4 Stackup Bakeng sa Sesole

How High Density 10 Layer Rigid Flex PCB e Fana ka Litharollo tse Tšepahalang Bakeng sa Sesole

Litlhoko tsa tekheniki
Mofuta oa sehlahisoa PCB Rigid Flex
Nomoro ea lera 10 Mekhahlelo
Bophara ba line le
sebaka sa mela
0.1mm/0.1mm
Botenya ba boto 2.0MM+-10%
Botenya ba Mokoti oa Koporo 35um
Bonyane Aperture 0.2 limilimithara
Lelakabe le Retardant 94v0
Kalafo ea Bokaholimo ENIG 2-3uin
Tšitiso 50 ohms-+10%
Layer Stackup 4+2+4
Teko e sebetsang AOI/four-wire/continuity/copper slices
Warpage ≦0.5%
Indasteri ea Kopo Sesole&Tshireletso
10 Layer Rigid Flex PCB Ka 4+2+4 Stackup Bakeng sa Sesole

10 Layers Rigid Flex Board

10 Layer Rigid Flex PCB Ka 4+2+4 Stackup Bakeng sa Sesole

Sesole & Tšireletso

Na u batla litharollo tse tšepahalang le tsa boleng bo holimo bakeng sa litlhoko tsa hau tsa boto e hatisitsoeng ea 10-layer flex in indasteri ea sesole? Liboto tsa rona tse phahameng tsa PCB tse nang le likarolo tse ngata ke khetho ea hau e ntle ka ho fetisisa, e etselitsoeng ts'ireletso ka ho khetheha.

Ho hlahisa Capel's high-density 10-layer rigid-flex PCB: tharollo e tšepahalang bakeng sa lits'ebetso tsa sesole le ts'ireletso.

Capel e motlotlo ho hlahisa boqapi ba rona ba morao-rao ba theknoloji ea printed circuit board (PCB) - PCB ea high-density 10-layer rigid-flex PCB. Ka lilemo tse fetang 16 tsa boiphihlelo ba ho etsa li-PCB tsa sesole le ts'ireletso, re utloisisa tlhoko ea bohlokoa ea ho ts'epahala, ho tšoarella le ts'ebetso e phahameng tlasa maemo a feteletseng. PCB ea rona e ncha ea "high-density 10-layer rigid-flex" e etselitsoe ho kopana le ho feta litlhoko tse thata tsa indasteri ea sesole le ts'ireletso, e fana ka litharollo tse tšepahalang bakeng sa lits'ebetso tsa bohlokoahali.

Lintlha tse ka sehloohong le litlhaloso

Li-PCB tsa rona tsa "high density 10-layer rigid-flex" li fana ka mefuta e mengata e tsoetseng pele le litlhaloso, tse li etsang hore e be tse loketseng lits'ebetso tsa sesole le ts'ireletso:

- Li-Layers tse 10: Li-PCB tsa rona li na le likarolo tse ngata ho fana ka ho rarahana ho hlokahalang le ts'ebetso e hlokoang ke litsamaiso tse tsoetseng pele tsa sesole le ts'ireletso.

- Bophara ba mela le sebaka: PCB e na le bophara ba mela ea 0.1mm/0.1mm le sebaka ho netefatsa phetiso e nepahetseng ea mats'oao lits'ebetsong tsa maqhubu a holimo.

- Botenya ba poleiti: 2.0mm botenya ba poleiti bo nang le mamello ea ± 10%, bo fana ka botsitso bo hlokahalang le ho tšoarella libakeng tse thata tsa sesole.

- Botenya ba lesoba la koporo: Botenya ba rona ba lesoba la koporo la PCB ke 35um, bo fana ka ts'ebetso e ntle haholo le ts'epahalo bakeng sa lits'ebetso tse batloang.

- Nako e fokolang ea ho bula: Sebaka se fokolang sa 0.2mm se tiisa ho behoa ka nepo ha likarolo le likhokahano, e leng ntho ea bohlokoa bakeng sa meralo e phahameng haholo.

- Li-Flame Retardant: Li-PCB tsa rona li thibela lelakabe la 94v0, li fana ka tšireletso e eketsehileng le tšireletso maemong a feteletseng.

- Phekolo ea holim'a metsi: ENIG (Electroless Nickel Immersion Gold) kalafo ea holim'a metsi e nang le botenya ba 2-3uin e tiisa hore ho na le solderability e ntle le ho hanyetsa kutu, ho lelefatsa bophelo ba ts'ebeletso ea PCB.

- Taolo ea Impedance: Li-PCB tsa rona li na le mamello ea ± 10% ho boloka maemo a tsitsitseng a impedance, e leng bohlokoa bakeng sa botšepehi ba matšoao a lebelo le phahameng.

- Layer stacking: 4 + 2 + 4 layer stacking e fana ka motsoako o leka-lekaneng oa likarolo tse thata le tse tenyetsehang, tse fanang ka phetoho e hlokahalang le ho tšepahala bakeng sa litsamaiso tse rarahaneng tsa sesole le tšireletso.

- Teko ea Ts'ebetso: Li-PCB tsa rona li etsa liteko tse matla tsa ts'ebetso, ho kenyeletsoa Automatic Optical Inspection (AOI), tlhahlobo ea mehala e mene, tlhahlobo e tsoelang pele le tlhahlobo ea maqephe a koporo, ho netefatsa boemo bo holimo ba boleng le ho ts'epahala.

- Warpage: Li-PCB tsa rona li na le ≤0.5% warpage, ho boloka flatness le botsitso esita le tlas'a maemo a thata a tikoloho.

- Liindasteri tsa Likopo: Li-PCB tsa rona tse phahameng tsa 10-layer rigid-flex flex li etselitsoe likopo tsa sesole le ts'ireletso ho fihlela litlhoko tse ikhethang tsa indasteri ena e boima.

Ho tšepahala le ho tšoarella

Ho Capel, re utloisisa boemo ba bohlokoa ba ts'ebetso ea sesole le ts'ireletso moo ho ts'epahala le ho tšoarella ho sa buisanoeng. Li-PCB tsa rona tse phahameng tsa 10-layer rigid-flex flex li hahiloe ho mamella maemo a thata ka ho fetesisa, ho kenyeletsoa mocheso o feteletseng, ho thothomela, ho thothomela le mongobo. Motsoako oa lihlopha tse thata le tse tenyetsehang li lumella ho fetoha ha moralo o moholo ha ho ntse ho boloka boemo bo phahameng ka ho fetisisa ba ho tšepahala. Ebang ke litsamaiso tsa likhokahano, litsamaiso tsa radar, li-avionics kapa likoloi tsa sefofane tse sa sebetsoang (li-UAV), li-PCB tsa rona li fana ka motheo o tiileng o hlokahalang bakeng sa katleho ea thomo.

Tlhahiso e tsoetseng pele le Tiisetso ea Boleng

Liboto tsa rona tse phahameng tsa 10-layer rigid-flex board li etsoa ka mekhoa ea morao-rao le lisebelisoa ho netefatsa boemo bo phahameng ka ho fetisisa ba ho nepahala le boleng. Ho tloha mohatong oa pele oa moralo ho isa tlhahiso ea ho qetela, re latela mehato e tiileng ea taolo ea boleng ho netefatsa ts'epo le ts'ebetso ea PCB. Bokhoni ba rona ba tlhahiso e tsoetseng pele, hammoho le boiphihlelo ba rona bo pharaletseng lekaleng la sesole le ts'ireletso, li re thusa ho fana ka lihlahisoa tse fihlelang le ho feta maemo a thata a indasteri.

Customization le tšehetso botekgeniki

Rea utloisisa hore ts'ebeliso e 'ngoe le e' ngoe ea sesole le ts'ireletso e ikhethile 'me hangata e hloka litharollo tsa moetlo ho fihlela litlhoko tse ikhethang. Ho Capel, re fana ka likhetho tse felletseng bakeng sa li-PCB tsa 10-layer rigid-flex, tse lumellang bareki ba rona ho rala meralo, lisebelisoa le litlhaloso ho latela litlhoko tsa bona tse ikhethileng. Sehlopha sa rona sa baenjiniere ba nang le boiphihlelo le litsebi tsa tekheniki ba fana ka ts'ehetso e inehetseng le tataiso nakong eohle ea moralo le ts'ebetsong, ho netefatsa hore li-PCB tsa rona li hokahana ka mokhoa o tsitsitseng le lits'ebetso tsa bareki ba rona.

Kobamelo le Setifikeiti

Boitlamo ba rona ba boleng le botshepehi bo bonahala ho latela maemo a indasteri le disetifikeiti. Li-PCB tsa rona tsa maemo a phahameng a 10-layer rigid-flex-flex li lumellana le litlhaloso tse amehang tsa sesole le ts'ireletso, ho netefatsa hore li fihlela litlhoko tse thata tsa ts'ebetso, polokeho le maemo a tikoloho. Ho feta moo, lits'ebeletso tsa rona tsa tlhahiso li netefalitsoe ho latela maemo a phahameng ka ho fetisisa a taolo, ho netefatsa hore bareki ba rona ba fumana lihlahisoa tsa boleng bo holimo.

Ha re phethela

Lefatšeng le potlakileng, le phahameng la theknoloji ea sesole le tšireletso, ho tšepahala, ho tšoarella le ts'ebetso ke tsa bohlokoa. Li-PCB tsa Capel tse boima bo phahameng ba 10-layer rigid-flex flex li emela sehlohlolo sa botsebi ba rona le boitlamo ba ho fana ka litharollo tsa morao-rao bakeng sa lits'ebetso tse batloang haholo. Ka likarolo tse tsoetseng pele, liteko tse matla le ho tsepamisa maikutlo holima boleng, li-PCB tsa rona li fana ka motheo o tšepahalang bakeng sa moloko o latelang oa sesole le litsamaiso tsa ts'ireletso. Ikopanye le rona kajeno ho ithuta haholoanyane mabapi le hore na li-PCB tsa rona tsa 10-layer rigid-flex flex li ka isa lits'ebetso tsa hau tsa sesole le ts'ireletso maemong a macha a ts'ebetso le ho ts'epahala.

 

 

                                               KE HOBANE'NG HA RE KHETHA KAPALE

Shenzhen Capel Technology Co., Ltdliboto tsa potoloho tse maemong a holimo, tse nepahetseng haholo ho tloha ka 2009.

Re na le Lilemo tse 15 tsa setsebile botekgenikiphihlelo'me u be le batho ba holileng, ba khabane, 'me ba tsoetse pelebokgoni ba ho etsa thepa.

Re khona ho fana ka customized1-30 lera tenyetsehang potoloho mapolanka,Li-PCB tsa 2-32 tse thata-flex, le1-60 mekhahlelo e thata PCBs ho bareki baTsa makoloiIndasteri.

 

Tšebeletso ea Capel:

Tšehetsa Tloaelo1-30 Layer FPC Flexible PCB,2-32 Layer Rigid-Flex Circuit Boards,1-60 Layer Rigid PCB,Maboto a HDI a Phahameng ka ho Fetisisa,Reliable Quick Turn PCB Prototyping,Seboka se potlakileng sa SMT PCB

Indasteri eo re e sebeletsang:

Lisebelisoa tsa Bongaka,IOT, TLHOKOMELO, UAV, Sefofane, Tsa makoloi, Mehala ea puisano, Electronics ea bareki, Sesole, Sepakapaka, Taolo ea Liindasteri, Bohlale ba maiketsetso,EV, joalo-joalo...

 

 

Sehlopha Bokhoni ba Ts'ebetso Sehlopha Bokhoni ba Ts'ebetso
Mofuta oa Tlhahiso FPC e le 'ngoe / Mekhahlelo e habeli FPC
Multi-layer FPC / Aluminium PCBs
Regid-Flex PCB
Layer Number Likarolo tse 1-30FPC Flexible PCB
Likarolo tse 2-32E thata-FlexPCB1-60 mekhahleloPCB e thataHDIMaboto
Max Manufacture size FPC e le 'ngoe ea 4000mm
Mekhahlelo e habeli FPC 1200mm
Multi-layer FPC 750mm
Regid-Flex PCB 750mm
Insulating LayerBotenya 27.5um / 37.5/ 50um / 65/ 75um / 100um /
125um / 150um
Botenya ba Boto FPC 0.06mm - 0.4mm
Rigid-Flex PCB 0.25 - 6.0mm
Mamello ea PTHBoholo ± 0.075mm
Surface Finish Ho qoelisoa ka Khauta/ Ho qoelisoa
Silver/Gold Plating/Tin Plating/OSP
Stiffener FR4 / PI / PET / SUS / PSA/Alu
Semicircle Orifice Size Ka tlase ho 0.4mm Min Line Space/ bophara 0.045mm/0.045mm
Botenya Mamello ± 0.03 limilimithara Tšitiso 50Ω-120Ω
Botenya ba Koporo ea Foil 9um/12um/18um/35um/70um/100um TšitisoLaolwaMamello ±10%
Mamello ea NPTHBoholo ± 0.05 limilimithara The Min Flush Width 0.80 limilimithara
Min Via Hole 0.1 limilimithara PhethahatsaStandard GB / IPC-650 / IPC-6012 / IPC-6013II /
IPC-6013III
Khauta ea ho qoelisoa AU 0.025-0.075UM /NI1-4UM Electro nickel khauta AU 0.025-25.4UM / NI 1-25.4UM
Setifikeiti UL le ROHS
ISO 14001:2015
ISO 9001:2015
IATF16949:2016
Patents dipatente tsa mohlala
boiqapelo dipatente

moralo oa pcb

 

             8 lera HDI Flexible PCBs bakeng sa Bongaka                                    10 layer Rigid-Flex Circuit Boards bakeng sa Aerospace

 

tenyetsehang pcb moralo

                                    4 layer Flex PCB Circuits for Industry Control                              16 lera Rigid Flexible PCBs bakeng sa Likoloi

 

 

Lisebelisoa tse tsoetseng pele:

Re na le lisebelisoa tsa morao-rao le tsa morao-rao tse tsoetseng pele ka ho fetisisa tsa tlhahiso le theknoloji, ho kenyelletsa le mechine e nepahetseng ea photolithography, mechine ea etching, lisebelisoa tsa kopano,etc.Tsena

lisebelisoa li netefatsa ho nepahala, ho sebetsa hantle le botsitso ba ts'ebetso ea tlhahiso, ka hona ho fa bareki lihlahisoa tsa boleng bo holimo. sehlahisoa sa boleng. Lihlahisoa tsa boleng bo phahameng tse feto-fetohang tsa boto ea potoloho.

Mokhoa oa Tlhahiso ea Rigid-Flex PCB

Taolo ea boleng bo thata:

Khampani ea rona e beha taolo ea boleng pele 'me e sebelisa letoto la mehato e tiileng ea ho laola boleng ho pholletsa le ts'ebetso eohle ea tlhahiso. Mohato o mong le o mong ho tsoa ho khetho le ho reka

ea lihlahisoa tse tala bakeng sa tlhahiso le ho paka e hlahlojoa ka botlalo le ho lekoa ho netefatsa hore sehlahisoa se seng le se seng sa boto ea potoloho se feto-fetohang se kopana le maemo a holimo.

Tsamaiso e sebetsang hantle ea tlhahiso:

Re na le mokhoa o sebetsang oa tsamaiso ea tlhahiso ho ntlafatsa ts'ebetso ea tlhahiso, ho ntlafatsa katleho ea tlhahiso le ho fokotsa litšenyehelo. Ka phihlelo e ruileng ea tlhahiso, re ka potlakela ho arabela litlhoko tsa bareki le ho netefatsa ho fana ka nako ka nako.

Tšebeletso e phethahetseng ka mor'a thekiso:

Re tsepame ho bareki 'me re fana ka tšebeletso e phethahetseng ka mor'a thekiso. Ebang ke ho rarolla mathata nakong ea tšebeliso ea sehlahisoa kapa ho fana ka ts'ehetso ea tekheniki le lits'ebeletso tsa tokiso, re ka arabela ka nako le ho fana ka tharollo. Ka ho sebelisa lipoleloana tsena, u ka bontša ka katleho matla le melemo ea k'hamphani ka mokhoa o bonolo oa tlhahiso ea boto ea potoloho, kahoo u fumana tšepo le kananelo ea bareki.

 

taolo ya boleng bakeng sa pcb

 

Re ka fa bareki boleng ba boleng bo holimoprototyping e potlakileng, e tšepahalang ka potlakotlhahiso ka bongata, lephano e potlakilengto thusa merero ea bona ho kena 'marakeng kapele le ka thelelo le ho fumana melemo ea tlholisano.

Tsamaiso e matla ea phepelo ea thepa:

Re thehile likamano tsa nako e telele tsa ts'ebelisano 'moho le barekisi ba bangata ba boleng bo holimo ho netefatsa phihlello e nakong ea thepa e tala ea boleng bo holimo. Ka nako e ts'oanang, re na le sehlopha se sebetsang hantle sa taolo ea phepelo se ka laolang ka botlalo boemo ba phepelo ea thepa e tala, ho netefatsa hore thepa e teng ka nako, le ho ts'ehetsa tlhahiso le phano e potlakileng.

Moralo oa tlhahiso o feto-fetohang:

Re sebelisa mokhoa o tsoetseng pele oa moralo oa tlhahiso o ka fetolang kapele le ho hlophisa ho latela litlhoko tsa bareki. Ebang ke tlhahiso ea prototype kapa tlhahiso e kholo, re ka fana ka lisebelisoa ka mokhoa o bonolo ho phethahatsa tlhahiso ka nako e khuts'oane le ho netefatsa ho tsamaisoa ka nako.

Phallo e sebetsang hantle:

Re na le ts'ebetso e sebetsang ea tlhahiso 'me re rera ka thata le ho laola ts'ebetso eohle ho tloha ho resiti ea odara ho isa ho thomello ea lihlahisoa. Ka ho ntlafatsa ts'ebetso ea tlhahiso, ho ntlafatsa katleho ea tlhahiso, le ho kenya ts'ebetsong mehato ea taolo ea boleng, re ka etsa le ho fana ka lihlahisoa ka potlako ho netefatsa qalo e ntle ea merero ea bareki ba rona.

Karabo e potlakileng:

Re hokela bohlokoa bo boholo ho litlhoko tsa bareki mme re khona ho arabela kapele le ho lokisa tlhahiso le kemiso ka nepo. Ebang ke taelo e potlakileng kapa ke boemo bo sa lebelloang, re ka etsa liqeto kapele le ho nka mehato e nepahetseng ho netefatsa hore re fihla ka nako.

Tsamaiso e tšepahalang ea thepa:

Re sebelisana 'moho le lik'hamphani tse ngata tsa profeshenale tsa thepa ho netefatsa hore thepa e tlisoa ho bareki ka mokhoa o sireletsehileng le ka nako. Re na le ts'ebetso e felletseng ea taolo ea thepa le sistimi ea polokelo e ka latellang maemo a lipalangoang ka nepo le ho netefatsa ho tsamaisoa ka nako.

nako ea thomello


Nako ea poso: Mar-25-2024
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