Joang 8 Layer Rigid Flex Board Tharollo Ho Ntlafatsa Ts'ebetso ea Likhalase tsa VR
Litlhoko tsa tekheniki | |
Mofuta oa sehlahisoa | PCB Rigid Flex |
Nomoro ea lera | 8 Mekhahlelo |
Bophara ba line le sebaka sa mela | 0.1mm/0.1mm |
Botenya ba boto | 1.2mm±10% |
Botenya ba Mokoti oa Koporo | 35um |
Bonyane Aperture | 0.15MM |
Surface Trestment Retardant | 94v0 |
Kalafo ea Bokaholimo | ENIG 2-3uin |
Warpage | ≦0.5% |
Mamello e Nepahetseng | ±0.1MM |
Layer Stackup | 2+4+2 |
Indasteri ea Kopo | Indasteri ea Smart Wearable |
Sesebelisoa sa Sesebelisoa | Likhalase tse bohlale tsa VR |
8 Layers Rigid Flex PCB Prototype
Likhalase tse bohlale tsa VR
A na u batla litharollo tse ka tšeptjoang le tse sebetsang hantle tsa 8-layer rigid flex board bakeng sa likhalase tsa hau tse bohlale tsa VR indastering e aparoang ka bohlale? Theknoloji ea rona ea li-multi-layer rigid flex pcb prototype ke khetho ea hau e ntle ka ho fetisisa, e etselitsoeng indasteri e aparoang ka ho khetheha.
Re hlahisa tharollo ea rona ea boto ea 8-layer rigid-flex e etselitsoeng ho fetola tšebetso ea likhalase tsa VR. Ha tlhoko ea boiphihlelo ba VR ea boleng bo holimo e ntse e phahama, liboto tsa rona tse thata-thata li entsoe ho fihlela litlhoko tse thata tsa likhalase tse bohlale tsa VR, ho netefatsa ts'ebetso e ke keng ea lekanngoa le ho ts'epahala. Liboto tsa rona tse thata-thata li phuthetsoe ka mekhahlelo ea 2 + 4 + 2 ka botenya ba 1.2mm± 10% le sebaka sa bonyane sa 0.15mm. Li entsoe ka hloko ho fana ka liphello tse babatsehang. Ebang ke 0.1mm/0.1mm bophara ba mola le sebaka, botenya ba lesoba la koporo la 35um, kapa kalafo ea bokaholimo ba ENIG 2-3uin, mapolanka a rona a na le boqhetseke bo tsoetseng pele le ho nepahala ha tekheniki, ho beha maemo a macha bakeng sa ts'ebetso ea likhalase tsa VR.
Tharollo ea boto ea 8-layer rigid-flex e etselitsoe ho ntlafatsa ts'ebetso ea likhalase tsa VR. E na le likarolo tse 8 tse entsoeng ka hloko, liboto tsena li fana ka phetoho e ke keng ea lekanngoa le ho tšepahala, e leng se etsang hore e be tse loketseng bakeng sa lisebelisoa tse thata tse kang likhalase tse bohlale tsa VR. The 2 + 4 + 2 layer stacking e netefatsa botšepehi bo nepahetseng ba matšoao le kabo ea matla, ha botenya ba 1.2mm± 10% bo otla ho leka-lekana ho phethahetseng pakeng tsa ho tšoarella le ho fetoha habonolo. Moralo ona o masene, o kopantsoeng le sebaka se tlase sa 0.15mm, se netefatsa hore liboto tsa rona tse sa fetoheng li fana ka ts'ebetso e holimo esita le maemong a boima haholo a VR.
Mabapi le litlhaloso tsa tekheniki, tharollo ea boto ea rona ea 8-layer rigid-flex e hlahella tlholisanong. Ka bophara ba mela ea 0.1mm/0.1mm le sebaka, liboto tsena li fana ka mokhoa o nepahetseng oa ho tsamaisa mats'oao le ts'ebetso e phahameng ea motlakase, e leng bohlokoa bakeng sa ts'ebetso e se nang moeli ea likhalase tsa VR. Botenya ba lesoba la koporo la 35um bo eketsa ts'ebetso le ts'epahalo ea boto ea potoloho, ho netefatsa hore ba ka fihlela litlhoko tse thata tsa lits'ebetso tsa VR. Ntle le moo, kalafo ea bokaholimo ka ENIG 2-3uin e fana ka khanyetso e ntle ea kutu le ho solderability, e etsa hore mapolanka a rona a thata-thata a phethahale bakeng sa tharollo ea likhalase tsa VR tsa nako e telele.
Tharollo ea rona ea 8-layer rigid-flex board e sebelisa mekhoa ea batho ba hōlileng tsebong le ho phehella ho nepahala ho sa khaotseng ho fana ka ho nepahala ho ke keng ha bapisoa le mamello. Ka mamello e nepahetseng ea ± 0.1mm, mapolanka ana a etselitsoe ho finyella litlhoko tse thata ka ho fetisisa tsa likhalase tsa VR, ho netefatsa ho kopanngoa ha seamless le ts'ebetso e tšepahalang. Ho phaella moo, boto e na le warpage ea ≤0.5%, e netefatsang ts'ebetso e tsitsitseng le e tsitsitseng esita le libakeng tse matla tsa VR. Boemo bona ba ho nepahala le ho ts'epahala bo arola liboto tsa rona tse thata, ho ba etsa khetho ea pele ea ho ntlafatsa ts'ebetso ea likhalase tsa VR.
Ka bokhutšoanyane, tharollo ea boto ea rona ea 8-layer rigid-flex e emela tsoelo-pele ea ho ntlafatsa ts'ebetso ea likhalase tsa VR. Ka moralo o matla oa boenjiniere, theknoloji e nepahetseng le boqapi bo holileng, liboto tsena li etselitsoe ho fihlela litlhoko tse thata tsa likhalase tse bohlale tsa VR. Ho tloha ho 2+4+2 layer stacking ho isa ho 0.1mm/0.1mm bophara ba mola le sebaka, karolo e 'ngoe le e 'ngoe ea liboto tsa rona tse thata-thata e ntlafatsoa ho fana ka ts'ebetso e phahameng le ho ts'epahala. Ebang ke botenya ba lesoba la koporo, phekolo ea holim'a metsi kapa ho nepahala ha mamello, liboto tsa rona tsa potoloho li beha litekanyetso tse ncha tsa tharollo ea likhalase tsa VR. Haeba u batla ho ntlafatsa ts'ebetso ea likhalase tsa hau tsa VR, tharollo ea boto ea rona ea 8-layer rigid-flex ke khetho e nepahetseng.
KE HOBANE'NG HA RE KHETHA KAPALE
Shenzhen Capel Technology Co., Ltdliboto tsa potoloho tse maemong a holimo, tse nepahetseng haholo ho tloha ka 2009.
Re na le Lilemo tse 15 tsa setsebile botekgenikiphihlelo'me u be le batho ba holileng, ba khabane, 'me ba tsoetse pelebokgoni ba ho etsa thepa.
Re khona ho fana ka customized1-30 lera tenyetsehang potoloho mapolanka,Li-PCB tsa 2-32 tse thata-flex, le1-60 mekhahlelo e thata PCBs ho bareki baTsa makoloiIndasteri.
Tšehetsa Tloaelo1-30 Layer FPC Flexible PCB,2-32 Layer Rigid-Flex Circuit Boards,1-60 Layer Rigid PCB,Maboto a HDI a Phahameng ka ho Fetisisa,Reliable Quick Turn PCB Prototyping,Seboka se potlakileng sa SMT PCB
Indasteri eo re e sebeletsang:
Lisebelisoa tsa Bongaka,IOT, TLHOKOMELO, UAV, Sefofane, Tsa makoloi, Mehala ea puisano, Electronics ea bareki, Sesole, Sepakapaka, Taolo ea Liindasteri, Bohlale ba maiketsetso,EV, joalo-joalo...
Sehlopha | Bokhoni ba Ts'ebetso | Sehlopha | Bokhoni ba Ts'ebetso |
Mofuta oa Tlhahiso | FPC e le 'ngoe / Mekhahlelo e habeli FPC Multi-layer FPC / Aluminium PCBs Regid-Flex PCB | Layer Number | Likarolo tse 1-30FPC Flexible PCB Likarolo tse 2-32E thata-FlexPCB1-60 mekhahleloPCB e thataHDIMaboto |
Max Manufacture size | FPC e le 'ngoe ea 4000mm Mekhahlelo e habeli FPC 1200mm Multi-layer FPC 750mm Regid-Flex PCB 750mm | Insulating LayerBotenya | 27.5um / 37.5/ 50um / 65/ 75um / 100um / 125um / 150um |
Botenya ba Boto | FPC 0.06mm - 0.4mm Rigid-Flex PCB 0.25 - 6.0mm | Mamello ea PTHBoholo | ± 0.075mm |
Surface Finish | Ho qoelisoa ka Khauta/ Ho qoelisoa Silver/Gold Plating/Tin Plating/OSP | Stiffener | FR4 / PI / PET / SUS / PSA/Alu |
Semicircle Orifice Size | Ka tlase ho 0.4mm | Min Line Space/ bophara | 0.045mm/0.045mm |
Botenya Mamello | ± 0.03 limilimithara | Tšitiso | 50Ω-120Ω |
Botenya ba Koporo ea Foil | 9um/12um/18um/35um/70um/100um | TšitisoLaolwaMamello | ±10% |
Mamello ea NPTHBoholo | ± 0.05 limilimithara | The Min Flush Width | 0.80 limilimithara |
Min Via Hole | 0.1 limilimithara | PhethahatsaStandard | GB / IPC-650 / IPC-6012 / IPC-6013II / IPC-6013III |
Khauta ea ho qoelisoa | AU 0.025-0.075UM /NI1-4UM | Electro nickel khauta | AU 0.025-25.4UM / NI 1-25.4UM |
Setifikeiti | UL le ROHS ISO 14001:2015 ISO 9001:2015 IATF16949:2016 | Patents | dipatente tsa mohlala boiqapelo dipatente |
8 lera HDI Flexible PCBs bakeng sa Bongaka 10 layer Rigid-Flex Circuit Boards bakeng sa Aerospace
4 layer Flex PCB Circuits for Industry Control 16 lera Rigid Flexible PCBs bakeng sa Likoloi
Lisebelisoa tse tsoetseng pele:
Re na le lisebelisoa tsa morao-rao le tsa morao-rao tse tsoetseng pele ka ho fetisisa tsa tlhahiso le theknoloji, ho kenyelletsa le mechine e nepahetseng ea photolithography, mechine ea etching, lisebelisoa tsa kopano,etc.Tsena
lisebelisoa li netefatsa ho nepahala, ho sebetsa hantle le botsitso ba ts'ebetso ea tlhahiso, ka hona ho fa bareki lihlahisoa tsa boleng bo holimo. sehlahisoa sa boleng. Lihlahisoa tsa boleng bo phahameng tse feto-fetohang tsa boto ea potoloho.
Khampani ea rona e beha taolo ea boleng pele 'me e sebelisa letoto la mehato e tiileng ea ho laola boleng ho pholletsa le ts'ebetso eohle ea tlhahiso. Mohato o mong le o mong ho tsoa ho khetho le ho reka
ea lihlahisoa tse tala bakeng sa tlhahiso le ho paka e hlahlojoa ka botlalo le ho lekoa ho netefatsa hore sehlahisoa se seng le se seng sa boto ea potoloho se feto-fetohang se kopana le maemo a holimo.
Tsamaiso e sebetsang hantle ea tlhahiso:
Re na le mokhoa o sebetsang oa tsamaiso ea tlhahiso ho ntlafatsa ts'ebetso ea tlhahiso, ho ntlafatsa katleho ea tlhahiso le ho fokotsa litšenyehelo. Ka phihlelo e ruileng ea tlhahiso, re ka potlakela ho arabela litlhoko tsa bareki le ho netefatsa ho fana ka nako ka nako.
Tšebeletso e phethahetseng ka mor'a thekiso:
Re tsepame ho bareki 'me re fana ka tšebeletso e phethahetseng ka mor'a thekiso. Ebang ke ho rarolla mathata nakong ea tšebeliso ea sehlahisoa kapa ho fana ka ts'ehetso ea tekheniki le lits'ebeletso tsa tokiso, re ka arabela ka nako le ho fana ka tharollo. Ka ho sebelisa lipoleloana tsena, u ka bontša ka katleho matla le melemo ea k'hamphani ka mokhoa o bonolo oa tlhahiso ea boto ea potoloho, kahoo u fumana tšepo le kananelo ea bareki.
Re ka fa bareki boleng ba boleng bo holimoprototyping e potlakileng, e tšepahalang ka potlakotlhahiso ka bongata, lephano e potlakilengto thusa merero ea bona ho kena 'marakeng kapele le ka thelelo le ho fumana melemo ea tlholisano.
Tsamaiso e matla ea phepelo ea thepa:
Re thehile likamano tsa nako e telele tsa ts'ebelisano 'moho le barekisi ba bangata ba boleng bo holimo ho netefatsa phihlello e nakong ea thepa e tala ea boleng bo holimo. Ka nako e ts'oanang, re na le sehlopha se sebetsang hantle sa taolo ea phepelo se ka laolang ka botlalo boemo ba phepelo ea thepa e tala, ho netefatsa hore thepa e teng ka nako, le ho ts'ehetsa tlhahiso le phano e potlakileng.
Moralo oa tlhahiso o feto-fetohang:
Re sebelisa mokhoa o tsoetseng pele oa moralo oa tlhahiso o ka fetolang kapele le ho hlophisa ho latela litlhoko tsa bareki. Ebang ke tlhahiso ea prototype kapa tlhahiso e kholo, re ka fana ka lisebelisoa ka mokhoa o bonolo ho phethahatsa tlhahiso ka nako e khuts'oane le ho netefatsa ho tsamaisoa ka nako.
Phallo e sebetsang hantle:
Re na le ts'ebetso e sebetsang ea tlhahiso 'me re rera ka thata le ho laola ts'ebetso eohle ho tloha ho resiti ea odara ho isa ho thomello ea lihlahisoa. Ka ho ntlafatsa ts'ebetso ea tlhahiso, ho ntlafatsa katleho ea tlhahiso, le ho kenya ts'ebetsong mehato ea taolo ea boleng, re ka etsa le ho fana ka lihlahisoa ka potlako ho netefatsa qalo e ntle ea merero ea bareki ba rona.
Karabo e potlakileng:
Re hokela bohlokoa bo boholo ho litlhoko tsa bareki mme re khona ho arabela kapele le ho lokisa tlhahiso le kemiso ka nepo. Ebang ke taelo e potlakileng kapa ke boemo bo sa lebelloang, re ka etsa liqeto kapele le ho nka mehato e nepahetseng ho netefatsa hore re fihla ka nako.
Tsamaiso e tšepahalang ea thepa:
Re sebelisana 'moho le lik'hamphani tse ngata tsa profeshenale tsa thepa ho netefatsa hore thepa e tlisoa ho bareki ka mokhoa o sireletsehileng le ka nako. Re na le ts'ebetso e felletseng ea taolo ea thepa le sistimi ea polokelo e ka latellang maemo a lipalangoang ka nepo le ho netefatsa ho tsamaisoa ka nako.
Nako ea poso: Mar-22-2024
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