How HDI Second-Order 8 Layer Rigid Flex PCB e Fana ka Litharollo tse Tšepahalang Bakeng sa Koloi e Ncha ea Matla

Litlhoko tsa tekheniki
Mofuta oa sehlahisoa	HDI Second-Order Rigid Flex PCB
Nomoro ea lera	8 Mekhahlelo
Bophara ba line le sebaka sa mela	0.1mm/0.1mm
Botenya ba boto	1.0mm +/- 0.03mm
Mokoti o fokolang	0.1 limilimithara
Sekoti se foufetseng	L1-L2,L7-L8
Sekoti se epetsoeng	L2-L3,L4-L5,L6-L7
Kalafo ea Bokaholimo	INIG 2-3uin
Ho tlatsa lesoba ho tlatsa	Ee
Lintho tse bonahalang	PI, Koporo, sekhomaretsi, FR4
Teko e sebetsang	AOI/four-wire/continuity/copper slices
Mamello ea mamello	±0.1MM
Kopo	Koloi e Ncha ea Matla

HDI Second-Order 8 Layer Rigid Flex PCB Solutions For New Energy Vehicle

HDI Second-Order 8 layer Flex-Rigid PCB

Koloi e Ncha ea Matla (Indasteri ea EV)

Na u batla litharollo tse ka tšeptjoang le tsa boleng bo holimo bakeng sa litlhoko tsa hau tsa boto ea 2-layer flex ho indasteri ea lifofane?Liboto tsa rona tsa likarolo tse ngata tsa PCB ke khetho ea hau e ntle ka ho fetesisa, e etselitsoeng mefuta e bohlale ea lifofane.

Liboto tsa rona tsa 2-layer flex flex board li entsoe ka boqhetseke ho fihlela litlhoko tse batloang ke indasteri ea sepakapaka.Liboto tsa rona tsa PCB li na le bophara ba mela le sebaka sa mela ea 0.075/0.1mm, botenya ba boto ea 0.15mm, le botenya ba koporo ba 18um, tse fanang ka ts'ebetso e ntle haholo le ts'epahalo libakeng tse hlokang ka ho fetesisa.

Ntle le ho finyella litekanyetso tsa indasteri, liboto tsa rona tsa PCB tse nang le mekhahlelo e mengata li na le bophara ba lesoba la 0.15mm le tekanyo e thibelang lelakabe ea 94V0, ho netefatsa polokeho le ts'ebetso e nepahetseng.Phekolo ea khauta e qoelisoang ha e eketse feela botle ba boto ea potoloho, empa hape e fana ka solderability e ntle haholo le ho hanyetsa kutu.

Motheo oa liboto tsa rona tsa 2-layer flex circuit ke tšebeliso ea lisebelisoa tsa premium tse kang FR4 le PI, tse fanang ka ho satalla ho phahameng le ho tšoarella.Sena se lumella liboto tsa rona ho mamella mathata a ts'ebetso ea sepakapaka, ho netefatsa ts'epo le ts'ebetso ea nako e telele.

Ntle le litlhaloso tsa tekheniki, liboto tsa rona tse ngata tsa PCB li etselitsoe ho nolofatsa ts'ebetso le tlhokomelo.'Mala o mosehla oa ho hanyetsa welding o fana ka ponahalo e hlakileng, e leng ho nolofalletsang ho sebetsa le boto nakong ea kopano le ho lokisoa.

Liboto tsa rona tse ngata tsa PCB li etselitsoe lits'ebetso tsa indasteri ea sefofane moo ho nepahala le ho ts'epahala ho leng bohlokoa.Ebang e sebelisoa litsing tsa taolo ea sefofane, lisebelisoa tsa likhokahano, kapa lisebelisoa tse ling tsa bohlokoa, liboto tsa rona li etselitsoe ho fana ka ts'ebetso e phahameng le ho tšoarella nako e telele.

Ka bokhutšoanyane, liboto tsa rona tsa 2-layer flexible circuit li fana ka tharollo e tšepahalang bakeng sa indasteri ea lifofane, haholo-holo lebaleng la lifofane tse bohlale.Ka kaho ea bona e matsutla-tsutla, lisebelisoa tsa boleng bo holimo le litšoaneleho tse phahameng tsa ts'ebetso, liboto tsa rona tsa potoloho li hlomelloa hantle ho fihlela litlhoko tse ikhethang tsa lits'ebetso tsa sefofane.

Haeba o hloka tharollo ea FPC e tšepahalang bakeng sa liboto tsa potoloho tse tenyetsehang tse 2 ka mefuta e bohlale ea lifofane, joale liboto tsa rona tsa boleng bo holimo tsa PCB tse ngata ke khetho ea hau e ntle ka ho fetisisa.Ka ts'ebetso ea bona e hlahelletseng, ho tšoarella le likarolo tsa polokeho, liboto tsa rona tsa potoloho li loketse lits'ebetso tsa sefofane.Eba le phapang ka liboto tsa rona tsa multilayer PCB 'me u nke merero ea hau ea sefofane ho ea holimo.

KE HOBANE'NG HA RE KHETHA KAPALE

Shenzhen Capel Technology Co., Ltdliboto tsa potoloho tse maemong a holimo, tse nepahetseng haholo ho tloha ka 2009.

Re na le Lilemo tse 15 tsa setsebile botekgenikiphihlelo'me u be le batho ba holileng, ba khabane, 'me ba tsoetse pelebokgoni ba ho etsa thepa.

Re khona ho fana ka customized1-30 lera tenyetsehang potoloho mapolanka,Li-PCB tsa 2-32 tse thata-flex, le1-60 mekhahlelo e thata PCBs ho bareki baTsa makoloiIndasteri.

Tšebeletso ea Capel:

Tšehetsa Tloaelo1-30 Layer FPC Flexible PCB,2-32 Layer Rigid-Flex Circuit Boards,1-60 Layer Rigid PCB,Maboto a HDI a Phahameng ka ho Fetisisa,Reliable Quick Turn PCB Prototyping,Seboka se potlakileng sa SMT PCB

Indasteri eo re e sebeletsang:

Lisebelisoa tsa Bongaka,IOT, TLHOKOMELO, UAV, Sefofane, Tsa makoloi, Mehala ea puisano, Electronics ea bareki, Sesole, Sepakapaka, Taolo ea Liindasteri, Bohlale ba maiketsetso,EV, joalo-joalo...

Sehlopha	Bokhoni ba Ts'ebetso	Sehlopha	Bokhoni ba Ts'ebetso
Mofuta oa Tlhahiso	FPC e le 'ngoe / Mekhahlelo e habeli FPC Multi-layer FPC / Aluminium PCBs Regid-Flex PCB	Layer Number	Likarolo tse 1-30FPC Flexible PCB Likarolo tse 2-32E thata-FlexPCB1-60 mekhahleloPCB e thataHDIMaboto
Max Manufacture size	FPC e le 'ngoe ea 4000mm Mekhahlelo e habeli FPC 1200mm Multi-layer FPC 750mm Regid-Flex PCB 750mm	Insulating LayerBotenya	27.5um / 37.5/ 50um / 65/ 75um / 100um / 125um / 150um
Botenya ba Boto	FPC 0.06mm - 0.4mm Rigid-Flex PCB 0.25 - 6.0mm	Mamello ea PTHBoholo	± 0.075mm
Surface Finish	Ho qoelisoa ka Khauta / Ho qoelisoa Silver/Gold Plating/Tin Plating/OSP	Stiffener	FR4 / PI / PET / SUS / PSA/Alu
Semicircle Orifice Size	Ka tlase ho 0.4mm	Min Line Space/ bophara	0.045mm/0.045mm
Botenya Mamello	± 0.03 limilimithara	Tšitiso	50Ω-120Ω
Botenya ba Koporo ea Foil	9um/12um/18um/35um/70um/100um	TšitisoLaolwaMamello	±10%
Mamello ea NPTHBoholo	± 0.05 limilimithara	The Min Flush Width	0.80 limilimithara
Min Via Hole	0.1 limilimithara	PhethahatsaStandard	GB / IPC-650 / IPC-6012 / IPC-6013II / IPC-6013III
Khauta ea ho qoelisoa	AU 0.025-0.075UM /NI1-4UM	Electro nickel khauta	AU 0.025-25.4UM / NI 1-25.4UM
Setifikeiti	UL le ROHS ISO 14001:2015 ISO 9001:2015 IATF16949:2016	Patents	dipatente tsa mohlala boiqapelo dipatente

8 lera HDI Flexible PCBs bakeng sa Bongaka 10 layer Rigid-Flex Circuit Boards bakeng sa Aerospace

4 layer Flex PCB Circuits for Industry Control 16 lera Rigid Flexible PCBs bakeng sa Likoloi

Lisebelisoa tse tsoetseng pele:

Re na le lisebelisoa tsa morao-rao le tsa morao-rao tse tsoetseng pele ka ho fetisisa tsa tlhahiso le theknoloji, ho kenyelletsa le mechine e nepahetseng ea photolithography, mechine ea etching, lisebelisoa tsa kopano,etc.Tsena

lisebelisoa li netefatsa ho nepahala, ho sebetsa hantle le botsitso ba ts'ebetso ea tlhahiso, ka hona ho fa bareki lihlahisoa tsa boleng bo holimo.sehlahisoa sa boleng.Lihlahisoa tsa boleng bo phahameng tse feto-fetohang tsa boto ea potoloho.

Taolo ea boleng bo thata:

Khampani ea rona e beha taolo ea boleng pele 'me e sebelisa letoto la mehato e tiileng ea ho laola boleng ho pholletsa le ts'ebetso eohle ea tlhahiso.Mohato o mong le o mong ho tsoa ho khetho le ho reka

ea lihlahisoa tse tala bakeng sa tlhahiso le ho paka e hlahlojoa ka botlalo le ho lekoa ho netefatsa hore sehlahisoa se seng le se seng sa boto ea potoloho se feto-fetohang se kopana le maemo a holimo.

Tsamaiso e sebetsang hantle ea tlhahiso:

Re na le mokhoa o sebetsang oa tsamaiso ea tlhahiso ho ntlafatsa ts'ebetso ea tlhahiso, ho ntlafatsa katleho ea tlhahiso le ho fokotsa litšenyehelo.Ka phihlelo e ruileng ea tlhahiso, re ka potlakela ho arabela litlhoko tsa bareki le ho netefatsa ho fana ka nako ka nako.

Tšebeletso e phethahetseng ka mor'a thekiso:

Re tsepame ho bareki 'me re fana ka tšebeletso e phethahetseng ka mor'a thekiso.Ebang ke ho rarolla mathata nakong ea tšebeliso ea sehlahisoa kapa ho fana ka ts'ehetso ea tekheniki le lits'ebeletso tsa tokiso, re ka arabela ka nako le ho fana ka tharollo.Ka ho sebelisa lipoleloana tsena, u ka bontša ka katleho matla le melemo ea k'hamphani ka mokhoa o bonolo oa tlhahiso ea boto ea potoloho, kahoo u fumana tšepo le kananelo ea bareki.

Re ka fa bareki boleng ba boleng bo holimoprototyping e potlakileng, e tšepahalang ka potlakotlhahiso ka bongata, lephano e potlakilengto thusa merero ea bona ho kena 'marakeng kapele le ka thelelo le ho fumana melemo ea tlholisano.

Tsamaiso e matla ea phepelo ea thepa:

Re thehile likamano tsa nako e telele tsa ts'ebelisano 'moho le barekisi ba bangata ba boleng bo holimo ho netefatsa phihlello e nakong ea thepa e tala ea boleng bo holimo.Ka nako e ts'oanang, re na le sehlopha se sebetsang hantle sa taolo ea phepelo se ka laolang ka botlalo boemo ba phepelo ea thepa e tala, ho netefatsa hore thepa e teng ka nako, le ho ts'ehetsa tlhahiso le phano e potlakileng.

Moralo oa tlhahiso o feto-fetohang:

Re sebelisa mokhoa o tsoetseng pele oa moralo oa tlhahiso o ka fetolang kapele le ho hlophisa ho latela litlhoko tsa bareki.Ebang ke tlhahiso ea prototype kapa tlhahiso e kholo, re ka fana ka lisebelisoa ka mokhoa o bonolo ho phethahatsa tlhahiso ka nako e khuts'oane le ho netefatsa ho tsamaisoa ka nako.

Phallo e sebetsang hantle:

Re na le ts'ebetso e sebetsang ea tlhahiso 'me re rera ka thata le ho laola ts'ebetso eohle ho tloha ho resiti ea odara ho isa ho thomello ea lihlahisoa.Ka ho ntlafatsa ts'ebetso ea tlhahiso, ho ntlafatsa katleho ea tlhahiso, le ho kenya ts'ebetsong mehato ea taolo ea boleng, re ka etsa le ho fana ka lihlahisoa ka potlako ho netefatsa qalo e ntle ea merero ea bareki ba rona.

Karabo e potlakileng:

Re hokela bohlokoa bo boholo ho litlhoko tsa bareki mme re khona ho arabela kapele le ho lokisa tlhahiso le kemiso ka nepo.Ebang ke taelo e potlakileng kapa ke boemo bo sa lebelloang, re ka etsa liqeto kapele le ho nka mehato e nepahetseng ho netefatsa hore re fihla ka nako.

Tsamaiso e tšepahalang ea thepa:

Re sebelisana 'moho le lik'hamphani tse ngata tsa profeshenale tsa thepa ho netefatsa hore thepa e tlisoa ho bareki ka mokhoa o sireletsehileng le ka nako.Re na le ts'ebetso e felletseng ea taolo ea thepa le sistimi ea polokelo e ka latellang maemo a lipalangoang ka nepo le ho netefatsa ho tsamaisoa ka nako.