Kamoo 8 Layer Rigid Flexible PCB Ka 3+2+3 Stackup Solutions e Ntlafatsang Tshebetso ea IOT 5G Communication

Litlhoko tsa tekheniki
Mofuta oa sehlahisoa	Rigid Flex Printed Circuit Board
Nomoro ea lera	8 Mekhahlelo
Bophara ba line le sebaka sa mela	0.075MM/0.075MM
Botenya ba boto	2.0MM+-10%
Layer Stackup	3+2+3
Bonyane Aperture	0.1MM
Botenya ba Mokoti oa Koporo	12-15um
Phekolo ea Bokaholimo	ENIG 2-3uin
Warpage	≦0.5%
Mamello e Nepahetseng	±0.1MM
Teko e sebetsang	AOI/four-wire/continuity/copper slices
Indasteri ea Kopo	Indasteri ea Inthanete ea Lintho (IOT).
Sesebelisoa sa Sesebelisoa	Puisano 5G 64G

8 Layer Rigid Flex PCB E nang le 3+2+3 Stackup Solutions bakeng sa Puisano ea IOT 5G

8 Layers Rigid Flex PCB board

Puisano ea 5G Lefapheng la IOT

Na u batla litharollo tse ka tšeptjoang le tsa boleng bo holimo bakeng sa litlhoko tsa hau tsa boto ea "8-layer rigid flex" indastering ea Internet Of Things (IOT)? Li-circuits tsa rona tse ngata tse thata tse tenyetsehang ke khetho ea hau e ntle ka ho fetisisa, e etselitsoeng IOT 5G Communication.

Ka lilemo tse 16 tsa boiphihlelo ba indasteri, Capel e motlotlo ho hlahisa boqapi ba rona ba morao-rao ho thekenoloji ea boto ea potoloho e hatisitsoeng - PCB ea 8-layer rigid flex PCB e nang le tharollo ea 3+2+3 stacking. Sehlahisoa sena sa maemo a holimo se etselitsoe ho ntlafatsa haholo ts'ebetso ea lisebelisoa tsa Marang-rang a Lintho (IoT) le liindasteri tsa puisano tsa 5G. Ka ho kopanya likarolo tse tsoetseng pele joalo ka 3+2+3 layer stacking, bophara bo nepahetseng ba mela le sebaka, le kalafo ea bokaholimo ba ENIG, li-PCB tsa rona tse thata tse feto-fetohang li fana ka ts'epo le ts'ebetso e ke keng ea lekanngoa bakeng sa lits'ebetso tse boima haholo.

PCB ea 8-layer rigid-flex e nang le tharollo ea 3 + 2 + 3 ea stacking e etselitsoe ka ho khetheha ho finyella litlhoko tse thata tsa indasteri ea puisano ea IoT le 5G. Botenya ba boto ea PCB ke 2.0mm mme sebaka se tlase sa ho bula ke 0.1mm, se ka tšehetsang lits'ebetso tsa lebelo le phahameng le maqhubu a phahameng. The 3+2+3 layer stacking e fana ka sets'oants'o se matlafalitsoeng sa lets'oao le taolo ea impedance, ho netefatsa ts'ebetso e nepahetseng bakeng sa lisebelisoa tsa puisano tse sebetsang ka lebelo la 5G.

E 'ngoe ea likarolo tsa bohlokoa tsa li-PCB tsa rona tse thata-thata ke bophara bo nepahetseng ba mela le sebaka sa 0.075mm, e lumellang phetisetso e nepahetseng ea matšoao le ho fokotsa tahlehelo ea matšoao. Ntle le moo, kalafo ea bokaholimo ba ENIG e nang le botenya ba 2-3uin e netefatsa hore ho na le solderability e ntle le ho hanyetsa kutu, ho etsa hore li-PCB tsa rona e be tse loketseng ho sebelisoa libakeng tse thata tsa ts'ebetso.

E le ho etsa bonnete ba ho tšepahala le boleng ba liboto tse thata-thata, re etsa tlhahlobo e tiileng ea ts'ebetso, ho kenyelletsa le AOI, tlhahlobo ea terata e mene, tlhahlobo ea ho tsoelapele le tlhahlobo ea koporo ea maqephe. Ts'ebetso ena e felletseng ea tlhahlobo e netefatsa hore PCB ka 'ngoe e kopana le litekanyetso tse phahameng ka ho fetisisa tsa ts'ebetso le ho tšoarella, e fa bareki ba rona khotso ea kelello le kholiseho lits'ebetsong tsa bona.

PCB ea 8-layer rigid-flex e nang le tharollo ea stacking ea 3 + 2 + 3 e etselitsoe ho finyella litlhoko tse fetohang tsa IoT le liindasteri tsa puisano tsa 5G. Ebang ke lisebelisoa tse bohlale, litsamaiso tsa likhokahano tse se nang mohala kapa lisebelisoa tsa phetisetso ea data tsa lebelo le holimo, li-PCB tsa rona li fana ka ts'ebetso le ts'epahalo e hlokahalang ho tsamaisa boqapi mafapheng ana a matla. Ka boitlamo ba Capel ba bokhabane le boqapi, li-PCB tsa rona tse sa fetoheng li loketse ho matlafatsa moloko o latelang oa lisebelisoa le mahlale a puisano.

Ka kakaretso, tharollo ea stacking ea Capel ea 8-layer rigid-flex 3+2+3 e emela ho tlōla tekhenoloji ea PCB, e fana ka ts'ebetso e ke keng ea lekanngoa le ho tšepahala bakeng sa indasteri ea puisano ea IoT le 5G. Ka likarolo tse tsoetseng pele, lits'ebetso tse matla tsa tlhahlobo le lilemo tsa boiphihlelo, re motlotlo ho fa bareki ba rona lihlahisoa tse fihlelang litekanyetso tse phahameng ka ho fetisisa tsa boleng le ts'ebetso. Ha indasteri e ntse e tsoela pele ho fetoha, Capel e ntse e le ka pele ho mekhoa e mecha, ho khanna tsoelo-pele le ho nolofalletsa theknoloji e tsoetseng pele hore e kopane ka mokhoa o tsitsitseng le lesela la lefats'e la rona le hokahaneng.

KE HOBANE'NG HA RE KHETHA KAPALE

Shenzhen Capel Technology Co., Ltdliboto tsa potoloho tse maemong a holimo, tse nepahetseng haholo ho tloha ka 2009.

Re na le Lilemo tse 15 tsa setsebile botekgenikiphihlelo'me u be le batho ba holileng, ba khabane, 'me ba tsoetse pelebokgoni ba ho etsa thepa.

Re khona ho fana ka customized1-30 lera tenyetsehang potoloho mapolanka,Li-PCB tsa 2-32 tse thata-flex, le1-60 mekhahlelo e thata PCBs ho bareki baTsa makoloiIndasteri.

Tšebeletso ea Capel:

Tšehetsa Tloaelo1-30 Layer FPC Flexible PCB,2-32 Layer Rigid-Flex Circuit Boards,1-60 Layer Rigid PCB,Maboto a HDI a Phahameng ka ho Fetisisa,Reliable Quick Turn PCB Prototyping,Seboka se potlakileng sa SMT PCB

Litšebeletso tsa Indasteri:

Lisebelisoa tsa Bongaka,IOT, TLHOKOMELO, UAV, Sefofane, Tsa makoloi, Mehala ea puisano, Electronics ea bareki, Sesole, Sepakapaka, Taolo ea Liindasteri, Bohlale ba maiketsetso,EV, joalo-joalo...

Sehlopha	Bokhoni ba Ts'ebetso	Sehlopha	Bokhoni ba Ts'ebetso
Mofuta oa Tlhahiso	FPC e le 'ngoe / Mekhahlelo e habeli FPC Multi-layer FPC / Aluminium PCBs Regid-Flex PCB	Layer Number	Likarolo tse 1-30FPC Flexible PCB Likarolo tse 2-32E thata-FlexPCB1-60 mekhahleloPCB e thataHDIMaboto
Max Manufacture size	FPC e le 'ngoe ea 4000mm Mekhahlelo e habeli FPC 1200mm Multi-layer FPC 750mm Regid-Flex PCB 750mm	Insulating LayerBotenya	27.5um / 37.5/ 50um / 65/ 75um / 100um / 125um / 150um
Botenya ba Boto	FPC 0.06mm - 0.4mm Rigid-Flex PCB 0.25 - 6.0mm	Mamello ea PTHBoholo	± 0.075mm
Surface Finish	Ho qoelisoa ka Khauta/ Ho qoelisoa Silver/Gold Plating/Tin Plating/OSP	Stiffener	FR4 / PI / PET / SUS / PSA/Alu
Semicircle Orifice Size	Ka tlase ho 0.4mm	Min Line Space/ bophara	0.045mm/0.045mm
Botenya Mamello	± 0.03 limilimithara	Tšitiso	50Ω-120Ω
Botenya ba Koporo ea Foil	9um/12um/18um/35um/70um/100um	TšitisoLaolwaMamello	±10%
Mamello ea NPTHBoholo	± 0.05 limilimithara	The Min Flush Width	0.80 limilimithara
Min Via Hole	0.1 limilimithara	PhethahatsaStandard	GB / IPC-650 / IPC-6012 / IPC-6013II / IPC-6013III
Khauta ea ho qoelisoa	AU 0.025-0.075UM /NI1-4UM	Electro nickel khauta	AU 0.025-25.4UM / NI 1-25.4UM
Setifikeiti	UL le ROHS ISO 14001:2015 ISO 9001:2015 IATF16949:2016	Patents	dipatente tsa mohlala boiqapelo dipatente

8 lera HDI Flexible PCBs bakeng sa Bongaka 10 layer Rigid-Flex Circuit Boards bakeng sa Aerospace

4 layer Flex PCB Circuits for Industry Control 16 lera Rigid Flexible PCBs bakeng sa Likoloi

Lisebelisoa tse tsoetseng pele:

Re na le lisebelisoa tsa morao-rao le tsa morao-rao tse tsoetseng pele ka ho fetisisa tsa tlhahiso le theknoloji, ho kenyelletsa le mechine e nepahetseng ea photolithography, mechine ea etching, lisebelisoa tsa kopano,etc.Tsena

lisebelisoa li netefatsa ho nepahala, ho sebetsa hantle le botsitso ba ts'ebetso ea tlhahiso, ka hona ho fa bareki lihlahisoa tsa boleng bo holimo. sehlahisoa sa boleng. Lihlahisoa tsa boleng bo phahameng tse feto-fetohang tsa boto ea potoloho.

Taolo ea boleng bo thata:

Khampani ea rona e beha taolo ea boleng pele 'me e sebelisa letoto la mehato e tiileng ea ho laola boleng ho pholletsa le ts'ebetso eohle ea tlhahiso. Mohato o mong le o mong ho tsoa ho khetho le ho reka

ea lihlahisoa tse tala bakeng sa tlhahiso le ho paka e hlahlojoa ka botlalo le ho lekoa ho netefatsa hore sehlahisoa se seng le se seng sa boto ea potoloho se feto-fetohang se kopana le maemo a holimo.

Tsamaiso e sebetsang hantle ea tlhahiso:

Re na le mokhoa o sebetsang oa tsamaiso ea tlhahiso ho ntlafatsa ts'ebetso ea tlhahiso, ho ntlafatsa katleho ea tlhahiso le ho fokotsa litšenyehelo. Ka phihlelo e ruileng ea tlhahiso, re ka potlakela ho arabela litlhoko tsa bareki le ho netefatsa ho fana ka nako.

Tšebeletso e phethahetseng ka mor'a thekiso:

Re tsepame ho bareki 'me re fana ka tšebeletso e phethahetseng ka mor'a thekiso. Ebang ke ho rarolla mathata nakong ea tšebeliso ea sehlahisoa kapa ho fana ka ts'ehetso ea tekheniki le lits'ebeletso tsa tokiso, re ka arabela ka nako le ho fana ka tharollo. Ka ho sebelisa lipoleloana tsena, u ka bontša ka katleho matla le melemo ea k'hamphani ka mokhoa o bonolo oa tlhahiso ea boto ea potoloho, kahoo u fumana tšepo le kananelo ea bareki.

Re ka fa bareki boleng ba boleng bo holimoprototyping e potlakileng, e tšepahalang ka potlakotlhahiso ka bongata, lephano e potlakilengto thusa merero ea bona ho kena 'marakeng kapele le ka thelelo le ho fumana melemo ea tlholisano.

Tsamaiso e matla ea phepelo ea thepa:

Re thehile likamano tsa nako e telele tsa ts'ebelisano 'moho le barekisi ba bangata ba boleng bo holimo ho netefatsa phihlello e nakong ea thepa e tala ea boleng bo holimo. Ka nako e ts'oanang, re na le sehlopha se sebetsang hantle sa taolo ea phepelo se ka laolang ka botlalo boemo ba phepelo ea thepa e tala, ho netefatsa hore thepa e teng ka nako, le ho ts'ehetsa tlhahiso le phano e potlakileng.

Moralo oa tlhahiso o feto-fetohang:

Re sebelisa mokhoa o tsoetseng pele oa moralo oa tlhahiso o ka fetolang kapele le ho hlophisa ho latela litlhoko tsa bareki. Ebang ke tlhahiso ea prototype kapa tlhahiso e kholo, re ka fana ka lisebelisoa ka mokhoa o bonolo ho phethahatsa tlhahiso ka nako e khuts'oane le ho netefatsa ho tsamaisoa ka nako.

Phallo e sebetsang hantle:

Re na le ts'ebetso e sebetsang ea tlhahiso 'me re rera ka thata le ho laola ts'ebetso eohle ho tloha ho resiti ea odara ho isa ho thomello ea lihlahisoa. Ka ho ntlafatsa ts'ebetso ea tlhahiso, ho ntlafatsa katleho ea tlhahiso, le ho kenya ts'ebetsong mehato ea taolo ea boleng, re ka etsa le ho fana ka lihlahisoa ka potlako ho netefatsa qalo e ntle ea merero ea bareki ba rona.

Karabo e potlakileng:

Re hokela bohlokoa bo boholo ho litlhoko tsa bareki mme re khona ho arabela kapele le ho lokisa tlhahiso le kemiso ka nepo. Ebang ke taelo e potlakileng kapa ke boemo bo sa lebelloang, re ka etsa liqeto kapele le ho nka mehato e nepahetseng ho netefatsa hore re fihla ka nako.

Tsamaiso e tšepahalang ea thepa:

Re sebelisana 'moho le lik'hamphani tse ngata tsa profeshenale tsa thepa ho netefatsa hore thepa e tlisoa ho bareki ka mokhoa o sireletsehileng le ka nako. Re na le ts'ebetso e felletseng ea taolo ea thepa le sistimi ea polokelo e ka latellang maemo a lipalangoang ka nepo le ho netefatsa ho tsamaisoa ka nako.