Kamoo Capel's HDI Rigid Flex PCB e nang le Layer e 4 e Fanang ka Litharollo Tse Tšepahalang Bakeng sa Li-Electronic Consumer Electronics
Litlhoko tsa tekheniki | |
Mofuta oa sehlahisoa | HDI Rigid Flex PCB |
Nomoro ea lera | 4 Mekhahlelo |
Bophara ba line le sebaka sa mela | 0.1mm/0.1mm |
Botenya ba boto | 0.45mm +/- 0.03mm |
Lisebelisoa | PI, Koporo, sekhomaretsi, FR4 |
Mokoti o fokolang | 0.1MM |
Mamello ea mamello | ±0.1MM |
Sekoti se foufetseng | L1-L2,L3-L4 |
Sekoti se epetsoeng | L2-L3 |
Ho tlatsa lesoba ho tlatsa | Ee |
Teko e sebetsang | AOI/four-wire/continuity/copper slices |
Phekolo ea Bokaholimo | ENIG 2-3uin |
Indasteri ea Kopo | Puisano Consumer Electronics |
Potoloho ea HDI e Rigid Flex e nang le Layer e 4
Puisano Consumer Electronics
Na u batla litharollo tse tšepahalang le tsa boleng bo holimo bakeng sa litlhoko tsa hau tsa 4-layer HDI rigid flex board indastering ea likhokahano le lisebelisoa tsa elektroniki tsa bareki? Liboto tsa rona tsa likarolo tse ngata tsa HDI PCB ke khetho ea hau e ntle ka ho fetisisa, e etselitsoeng lisebelisoa tsa elektroniki ka ho khetheha.
Re hlahisa Capel's 4-layer HDI rigid-flex PCB, tharollo ea morao-rao e etselitsoeng ho fihlela litlhoko tse boima tsa indasteri ea puisano le ea bareki. E tsepamisitse maikutlo ho thekenoloji e tsoetseng pele le boqapi ba litsebi, li-PCB tsa rona tsa HDI tse sa fetoheng li fana ka mefuta e mengata ea likarolo le mesebetsi e netefatsang ts'ebetso e tšepahalang le kopanyo e se nang moeli lits'ebetsong tse fapaneng. Ho tloha ho bophara bo nepahetseng ba mela le sebaka ho ea ho liphekolo tse nchafalitsoeng le tlhahlobo ea ts'ebetso, sehlahisoa sena se etselitsoe ho fana ka boleng bo holimo le ho tšoarella nako e telele. Kenyelletsong ena, re tla shebisisa litšobotsi tsa bohlokoa tsa Capel HDI rigid-flex PCB le ho hlahloba kamoo e fanang ka tharollo e tšepahalang litlhoko tse lulang li fetoha tsa liindasteri tsa likhokahano le lisebelisoa tsa elektroniki tsa bareki.
Ka pelong ea Capel HDI rigid flex PCBs ke moralo oa 4-layer o lumellang ho ntlafatsa ts'ebetso le ts'ebetso. Tlhophiso ena ea mekhahlelo e mengata e lumella ho kopanngoa ha lipotoloho tse rarahaneng le likaroloana, ho etsa hore e be se loketseng bakeng sa likopo moo sebaka se leng teng. Botenya ba boto ba 0.45mm +/- 0.03mm bo netefatsa sebopeho sa compact ntle le ho senya botšepehi ba sebopeho, ha tšebeliso ea lisebelisoa tsa premium tse kang PI, koporo, li-adhesives le FR4 li tiisa ho tiea le ho phela nako e telele. Likarolo tsena li etsa hore li-PCB tsa rona tsa HDI tse thata-thata li lokele mekhoa e fapaneng ea likhokahano le lisebelisoa tsa elektroniki tsa bareki, ho tloha ho li-smartphones le matlapa ho isa lisebelisoa tsa marang-rang le lisebelisoa tsa IoT.
E 'ngoe ea likarolo tse hlahelletseng tsa boto ea Capel HDI e thata-thata ke bophara ba mela le sebaka se nepahetseng, se behiloeng ho 0.1mm/0.1mm. Boemo bona ba ho nepahala ke ba bohlokoa bakeng sa ho amohela lipotoloho tse teteaneng le phetisetso ea mats'oao a lebelo le holimo, ho netefatsa ts'ebetso e nepahetseng le botšepehi ba matšoao. Ntle le moo, boto e boetse e ts'ehetsa li-vias tse foufetseng lipakeng tsa L1-L2 le L3-L4, hammoho le li-vias tse patiloeng lipakeng tsa L2-L3, tse nolofalletsang khokahano e se nang moeli lipakeng tsa mekhahlelo e fapaneng ha e ntse e boloka moralo o kopaneng le o hlophisitsoeng. Bokhoni bona bo bohlokoa bakeng sa ho fihlela litlhoko tse lulang li fetoha tsa likhokahano tsa sejoale-joale le lisebelisoa tsa elektroniki tsa bareki, moo li-PCB tse sebetsang hantle, tse sebetsang hantle li leng bohlokoa bakeng sa ho khanna boqapi le ts'ebetso.
Ntle le moralo le kaho e tsoetseng pele, li-PCB tsa Capel HDI rigid-flex PCB li sebelisa mefuta e mengata ea kalafo ea holim'a metsi le mekhoa ea tlhahlobo ea ts'ebetso ho ntlafatsa ts'epo le ts'ebetso ea tsona. Tšebeliso ea ENIG (Electroless Nickel Immersion Gold) e nang le botenya ba 2-3uin e fana ka khanyetso e ntle ea kutu, ho solderability le ho ts'epahala ka kakaretso, ho netefatsa hore PCB e khona ho mamella mathata a ts'ebeliso ea 'nete. Ho feta moo, mekhoa ea tlhahlobo ea ts'ebetso e kenyelletsang AOI (Automated Optical Inspection), tlhahlobo ea terata e mene, tlhahlobo e tsoelang pele le tlhahlobo ea maqephe a koporo e netefatsa hore PCB ka 'ngoe e fihlela maemo a holimo ka ho fetisisa pele e romelloa mecheng ea likhokahano le lisebelisoa tsa elektroniki tsa bareki.
Ha liindasteri tsa likhokahano le lisebelisoa tsa elektronike tsa bareki li ntse li tsoela pele ho sutumelletsa meeli ea boqapi, tlhokahalo ea litharollo tsa PCB tse tšepahalang, tse sebetsang hantle haholo ha e so ka e ba kholo ho feta. Li-PCB tsa Capel tsa 4-layer HDI rigid-flex PCBs li etselitsoe ho kopana le ho feta litlhoko tsena, li fana ka motsoako oa theknoloji e tsoetseng pele, litsebi tsa mesebetsi ea matsoho le likarolo tse matla tse etsang hore li tšoanelehe bakeng sa mefuta e fapaneng ea lisebelisoa. Hore na e nolofalletsa khokahanyo e se nang moeli ho li-smartphones, ho ntlafatsa phetisetso ea mats'oao ho lisebelisoa tsa marang-rang, kapa ho matlafatsa moloko o latelang oa lisebelisoa tsa IoT, li-PCB tsa rona tsa HDI rigid-flex PCB li fana ka ts'epo le ts'ebetso e hlokahalang lefatšeng la kajeno le tsamaisoang ke theknoloji.
Ka kakaretso, PCB ea Capel ea 4-layer HDI rigid-flex PCB e bonts'a boitlamo ba rona ba ho fana ka litharollo tsa maemo a holimo indastering ea likhokahano le lisebelisoa tsa elektroniki tsa bareki. Ka moralo oa eona o tsoetseng pele, kaho e nepahetseng le tlhahlobo e felletseng, sehlahisoa sena se fana ka sethala se tšepahalang, se sebetsang hantle sa ho khanna boqapi le ho fihlela litlhoko tse tsoelang pele tsa theknoloji ea sejoale-joale. Ha re sheba bokamoso, Capel e ntse e ikemiseditse ho sututsa meedi ya thekenoloji ya PCB, mme di-PCB tsa rona tsa HDI tse sa fetoheng ke mohlala o kganyang wa boinehelo bona.
KE HOBANE'NG HA RE KHETHA KAPALE
Shenzhen Capel Technology Co., Ltdliboto tsa potoloho tse maemong a holimo, tse nepahetseng haholo ho tloha ka 2009.
Re na le Lilemo tse 15 tsa setsebile botekgenikiphihlelo'me u be le batho ba holileng, ba khabane, 'me ba tsoetse pelebokgoni ba ho etsa thepa.
Re khona ho fana ka customized1-30 lera tenyetsehang potoloho mapolanka,Li-PCB tsa 2-32 tse thata-flex, le1-60 mekhahlelo e thata PCBs ho bareki baTsa makoloiIndasteri.
Tšehetsa Tloaelo1-30 Layer FPC Flexible PCB,2-32 Layer Rigid-Flex Circuit Boards,1-60 Layer Rigid PCB,Maboto a HDI a Phahameng ka ho Fetisisa,Reliable Quick Turn PCB Prototyping,Seboka se potlakileng sa SMT PCB
Lisebelisoa tsa Bongaka,IOT, TLHOKOMELO, UAV, Sefofane, Tsa makoloi, Mehala ea puisano, Electronics ea bareki, Sesole, Sepakapaka, Taolo ea Liindasteri, Bohlale ba maiketsetso,EV, joalo-joalo...
Sehlopha | Bokhoni ba Ts'ebetso | Sehlopha | Bokhoni ba Ts'ebetso |
Mofuta oa Tlhahiso | FPC e le 'ngoe / Mekhahlelo e habeli FPC Multi-layer FPC / Aluminium PCBs Regid-Flex PCB | Layer Number | Likarolo tse 1-30FPC Flexible PCB Likarolo tse 2-32E thata-FlexPCB1-60 mekhahleloPCB e thataHDIMaboto |
Max Manufacture size | FPC e le 'ngoe ea 4000mm Mekhahlelo e habeli FPC 1200mm Multi-layer FPC 750mm Regid-Flex PCB 750mm | Insulating LayerBotenya | 27.5um / 37.5/ 50um / 65/ 75um / 100um / 125um / 150um |
Botenya ba Boto | FPC 0.06mm - 0.4mm Rigid-Flex PCB 0.25 - 6.0mm | Mamello ea PTHBoholo | ± 0.075mm |
Surface Finish | Ho qoelisoa ka Khauta / Ho qoelisoa Silver/Gold Plating/Tin Plating/OSP | Stiffener | FR4 / PI / PET / SUS / PSA/Alu |
Semicircle Orifice Size | Ka tlase ho 0.4mm | Min Line Space/ bophara | 0.045mm/0.045mm |
Botenya Mamello | ± 0.03 limilimithara | Tšitiso | 50Ω-120Ω |
Botenya ba Koporo ea Foil | 9um/12um/18um/35um/70um/100um | TšitisoLaolwaMamello | ±10% |
Mamello ea NPTHBoholo | ± 0.05 limilimithara | The Min Flush Width | 0.80 limilimithara |
Min Via Hole | 0.1 limilimithara | PhethahatsaStandard | GB / IPC-650 / IPC-6012 / IPC-6013II / IPC-6013III |
Khauta ea ho qoelisoa | AU 0.025-0.075UM /NI1-4UM | Electro nickel khauta | AU 0.025-25.4UM / NI 1-25.4UM |
Setifikeiti | UL le ROHS ISO 14001:2015 ISO 9001:2015 IATF16949:2016 | Patents | dipatente tsa mohlala boiqapelo dipatente |
8 lera HDI Flexible PCBs bakeng sa Bongaka 10 layer Rigid-Flex Circuit Boards bakeng sa Aerospace
4 layer Flex PCB Circuits for Industry Control 16 lera Rigid Flexible PCBs bakeng sa Likoloi
Lisebelisoa tse tsoetseng pele:
Re na le lisebelisoa tsa morao-rao le tsa morao-rao tse tsoetseng pele ka ho fetisisa tsa tlhahiso le theknoloji, ho kenyelletsa le mechine e nepahetseng ea photolithography, mechine ea etching, lisebelisoa tsa kopano,etc.Tsena
lisebelisoa li netefatsa ho nepahala, ho sebetsa hantle le botsitso ba ts'ebetso ea tlhahiso, ka hona ho fa bareki lihlahisoa tsa boleng bo holimo. sehlahisoa sa boleng. Lihlahisoa tsa boleng bo phahameng tse feto-fetohang tsa boto ea potoloho.
Khampani ea rona e beha taolo ea boleng pele 'me e sebelisa letoto la mehato e tiileng ea ho laola boleng ho pholletsa le ts'ebetso eohle ea tlhahiso. Mohato o mong le o mong ho tsoa ho khetho le ho reka
ea lihlahisoa tse tala bakeng sa tlhahiso le ho paka e hlahlojoa ka botlalo le ho lekoa ho netefatsa hore sehlahisoa se seng le se seng sa boto ea potoloho se feto-fetohang se kopana le maemo a holimo.
Tsamaiso e sebetsang hantle ea tlhahiso:
Re na le mokhoa o sebetsang oa tsamaiso ea tlhahiso ho ntlafatsa ts'ebetso ea tlhahiso, ho ntlafatsa katleho ea tlhahiso le ho fokotsa litšenyehelo. Ka phihlelo e ruileng ea tlhahiso, re ka potlakela ho arabela litlhoko tsa bareki le ho netefatsa ho fana ka nako ka nako.
Tšebeletso e phethahetseng ka mor'a thekiso:
Re tsepame ho bareki 'me re fana ka tšebeletso e phethahetseng ka mor'a thekiso. Ebang ke ho rarolla mathata nakong ea tšebeliso ea sehlahisoa kapa ho fana ka ts'ehetso ea tekheniki le lits'ebeletso tsa tokiso, re ka arabela ka nako le ho fana ka tharollo. Ka ho sebelisa lipoleloana tsena, u ka bontša ka katleho matla le melemo ea k'hamphani ka mokhoa o bonolo oa tlhahiso ea boto ea potoloho, kahoo u fumana tšepo le kananelo ea bareki.
Re ka fa bareki boleng ba boleng bo holimoprototyping e potlakileng, e tšepahalang ka potlakotlhahiso ka bongata, lephano e potlakilengto thusa merero ea bona ho kena 'marakeng kapele le ka thelelo le ho fumana melemo ea tlholisano.
Tsamaiso e matla ea phepelo ea thepa:
Re thehile likamano tsa nako e telele tsa ts'ebelisano 'moho le barekisi ba bangata ba boleng bo holimo ho netefatsa phihlello e nakong ea thepa e tala ea boleng bo holimo. Ka nako e ts'oanang, re na le sehlopha se sebetsang hantle sa taolo ea phepelo se ka laolang ka botlalo boemo ba phepelo ea thepa e tala, ho netefatsa hore thepa e teng ka nako, le ho ts'ehetsa tlhahiso le phano e potlakileng.
Moralo oa tlhahiso o feto-fetohang:
Re sebelisa mokhoa o tsoetseng pele oa moralo oa tlhahiso o ka fetolang kapele le ho hlophisa ho latela litlhoko tsa bareki. Ebang ke tlhahiso ea prototype kapa tlhahiso e kholo, re ka fana ka lisebelisoa ka mokhoa o bonolo ho phethahatsa tlhahiso ka nako e khuts'oane le ho netefatsa ho tsamaisoa ka nako.
Phallo e sebetsang hantle:
Re na le ts'ebetso e sebetsang ea tlhahiso 'me re rera ka thata le ho laola ts'ebetso eohle ho tloha ho resiti ea odara ho isa ho thomello ea lihlahisoa. Ka ho ntlafatsa ts'ebetso ea tlhahiso, ho ntlafatsa katleho ea tlhahiso, le ho kenya ts'ebetsong mehato ea taolo ea boleng, re ka etsa le ho fana ka lihlahisoa ka potlako ho netefatsa qalo e ntle ea merero ea bareki ba rona.
Karabo e potlakileng:
Re hokela bohlokoa bo boholo ho litlhoko tsa bareki mme re khona ho arabela kapele le ho lokisa tlhahiso le kemiso ka nepo. Ebang ke taelo e potlakileng kapa ke boemo bo sa lebelloang, re ka etsa liqeto kapele le ho nka mehato e nepahetseng ho netefatsa hore re fihla ka nako.
Tsamaiso e tšepahalang ea thepa:
Re sebelisana 'moho le lik'hamphani tse ngata tsa profeshenale tsa thepa ho netefatsa hore thepa e tlisoa ho bareki ka mokhoa o sireletsehileng le ka nako. Re na le ts'ebetso e felletseng ea taolo ea thepa le sistimi ea polokelo e ka latellang maemo a lipalangoang ka nepo le ho netefatsa ho tsamaisoa ka nako.
Nako ea poso: Mar-25-2024
Morao