FR4 Printed Circuit Boards Custom Multilayer Flex PCB Fabrication for Smartphone

Tlhaloso e Khutšoanyane:

Mohlala: Mapolanka a Potoloho a Hatisitsoeng a FR4

Sesebelisoa sa sehlahisoa: Smartphone

Mekhahlelo ea Boto: Multilayer

Lintho tsa motheo: Polyimide(PI)

Botenya ba Cu ka hare: 18um

Botenya ba Quter Cu: 35um

'Mala oa filimi ea sekoahelo: Yellow

'Mala oa mask oa solder: O mosehla

Silkscreen: E tšoeu

Phekolo ea sefahleho: ENIG

FPC botenya: 0.26 +/-0.03mm

Mofuta oa Stiffener: FR4, PI

Min Line bophara/sebaka: 0.1/0.1mm

Min lesoba: 0.15mm

Sekoti se foufetseng:/

Mokoti o epetsoeng:/

Ho mamellana ha lesoba(nm): PTH: 士 lintho tse bonahalang: 士0.05

lBoard Layers:/

Re romelle lengolo-tsoibila

Lintlha tsa Sehlahisoa

Li-tag tsa Sehlahisoa

Tlhaloso

Sehlopha	Bokhoni ba Ts'ebetso	Sehlopha	Bokhoni ba Ts'ebetso
Mofuta oa Tlhahiso	FPC e le 'ngoe / Mekhahlelo e habeli FPC Mefuta e mengata ea FPC / Aluminium PCBs Li-PCB tse thata-Flex	Layer Number	1-16 mekhahlelo FPC 2-16 mekhahlelo e Rigid-FlexPCB HDI Printed Pota Boards
Max Manufacture size	FPC e le 'ngoe ea 4000mm Likarolo tsa Doulbe FPC 1200mm Mefuta e mengata ea FPC 750mm Regid-Flex PCB 750mm	Insulating Layer Botenya	27.5um / 37.5/ 50um / 65/ 75um / 100um / 125um / 150um
Botenya ba Boto	FPC 0.06mm - 0.4mm Rigid-Flex PCB 0.25 - 6.0mm	Mamello ea PTH Boholo	± 0.075mm
Surface Finish	Ho qoelisoa ka Khauta/ Ho qoelisoa Silver/Gold Plating/Tin Plat ing/OSP	Stiffener	FR4 / PI / PET / SUS / PSA/Alu
Semicircle Orifice Size	Ka tlase ho 0.4mm	Min Line Space/ bophara	0.045mm/0.045mm
Botenya Mamello	± 0.03 limilimithara	Tšitiso	50Ω-120Ω
Botenya ba Koporo ea Foil	9um/12um/18um/35um/70um/100um	Tšitiso Laolwa Mamello	±10%
Mamello ea NPTH Boholo	± 0.05 limilimithara	The Min Flush Width	0.80 limilimithara
Min Via Hole	0.1 limilimithara	Phethahatsa Standard	GB / IPC-650 / IPC-6012 / IPC-6013II / IPC-6013III

Re etsa multilayer flex PCB ka boiphihlelo ba lilemo tse 15 ka botsebi ba rona

3 lera Flex PCBs

8 lera Rigid-Flex PCBs

8 lera HDI Printed Circuit Boards

Lisebelisoa tsa Teko le Tlhahlobo

Teko ea microscope

Tlhahlobo ea AOI

Teko ea 2D

Teko ea Impedance

Teko ea RoHS

Flying Probe

Horizontal Tester

Ho Kobeha Teste

Tšebeletso ea rona ea multilayer flex PCB

. Fana ka tšehetso ea tekheniki Pele ho thekiso le ka mor'a thekiso;
. Tloaelo ho fihla ho mekhahlelo e 40, 1-2days Phetoho e potlakileng ea prototyping, Theko ea likarolo, Kopano ea SMT;
. E fana ka lisebelisoa tse peli tsa Bongaka, Taolo ea Liindasteri, Likoloi, Lifofane, Lisebelisoa tsa Bareki, IOT, UAV, Lipuisano joalo-joalo.
. Lihlopha tsa rona tsa baenjiniere le bafuputsi ba ikemiselitse ho phethahatsa litlhoko tsa hau ka ho nepahala le ka botsebi.

Multilayer flexible PCBs e rarollotse mathata a mang ho li-smartphone

1. Ho boloka sebaka: PCB e feto-fetohang e nang le mefuta e mengata e ka rala le ho kopanya lipotoloho tse rarahaneng sebakeng se lekanyelitsoeng, ho etsa hore li-smartphone li be tšesaane ebile li kopane.

2. Botšepehi ba pontšo: Flex PCB e ka fokotsa tahlehelo ea matšoao le tšitiso, ho netefatsa hore phetiso ea data e tsitsitseng le e ka tšeptjoang pakeng tsa likarolo.

3. Ho tenyetseha le ho kobeha: Li-PCB tse tenyetsehang li ka kobeha, tsa menwa kapa tsa kobeha hore li lekane libaka tse thata kapa li lumellane le sebopeho sa smartphone. Ho feto-fetoha ha maemo ho kenya letsoho ho moralo o akaretsang le ts'ebetso ea sesebelisoa.

4. Tšepahala: Multi-layer flexible PCB e fokotsa palo ea li-interconnections le manonyeletso a solder, e leng ho ntlafatsang ho tšepahala, ho fokotsa kotsi ea ho hlōleha le ho ntlafatsa boleng ba sehlahisoa ka kakaretso.

5. Boima bo fokotsehileng: Li-PCB tse feto-fetohang li bobebe ho feta li-PCB tsa setso tse thata, li thusa ho fokotsa boima ba li-smartphone, ho etsa hore ho be bonolo ho basebelisi ho li jara le ho li sebelisa.

6. Ho tšoarella: Li-PCB tse feto-fetohang li etselitsoe ho mamella ho kobeha khafetsa le ho kobeha ntle le ho ama ts'ebetso ea tsona, ho etsa hore li se ke tsa hlola li e-ba le khatello ea kelello ea mochine le ho matlafatsa ho tšoarella ha li-smartphone.

FR4 multilayer flexible PCBs tse sebelisoang ho li-smartphone

1. FR4 ke eng?
FR4 ke laminate e thibelang malakabe e sebelisoang hangata ho li-PCB. Ke thepa ea fiberglass e nang le lelakabe la epoxy retardant.
FR4 e tsejoa ka thepa ea eona e ntle ea ho kenya motlakase le matla a phahameng a mochini.

2. "multilayer" e bolela'ng ho latela flex PCB?
"Multilayer" e bolela palo ea lihlopha tse etsang PCB. Multilayer flexible PCBs e na le mekhahlelo e 'meli kapa ho feta ea mesaletsa ea conductive e arohaneng ka likarolo tse sireletsang, tseo kaofela li fetohang ka tlhaho.

3. Li-board tsa multilayer flexible li ka sebelisoa joang ho li-smartphone?
Li-PCB tse feto-fetohang tsa Multilayer li sebelisoa ho li-smartphones ho hokahanya likarolo tse fapaneng tse kang li-microprocessors, li-memory chips, lipontšo, lik'hamera, li-sensor le likarolo tse ling tsa elektroniki. Li fana ka tharollo e kopanetsoeng le e tenyetsehang bakeng sa ho hokahanya likarolo tsena, e nolofalletsang ho sebetsa ha smartphone.

4. Ke hobane'ng ha multilayer tenyetseha PCBs molemo ho feta PCBs thata?
Multilayer flexible PCBs fana ka melemo e mengata ho feta li-PCB tse thata bakeng sa li-smartphone. Li ka kobeha le ho mena hore li kene libakeng tse thata, joalo ka ka har'a mokotla oa mohala kapa ho potoloha mats'oafo a kobehileng. Li boetse li fana ka khanyetso e ntle ea ho ts'oha le ho thothomela, e leng ho li etsang hore li tšoanelehe hamolemo bakeng sa lisebelisoa tse nkehang joaloka li-smartphone. Ho feta moo, li-PCB tse tenyetsehang li thusa ho fokotsa boima bo akaretsang ba sesebelisoa.

5. Liphephetso tsa tlhahiso ea multilayer flexible PCB ke life?
Ho etsa li-PCB tsa multilayer flex ho thata ho feta li-PCB tse thata. Li-substrates tse feto-fetohang li hloka ho tšoaroa ka hloko nakong ea tlhahiso ho thibela tšenyo. Mehato ea tlhahiso e kang lamination e hloka taolo e nepahetseng ho etsa bonnete ba hore ho na le kamano e nepahetseng pakeng tsa lihlopha. Ho feta moo, ho tlameha ho lateloe mamello e tiileng ea moralo ho boloka botsitso ba matšoao le ho qoba tahlehelo ea mats'oao kapa crosstalk.

6. Na li-PCB tse ngata tse tenyetsehang li turu ho feta li-PCB tse thata?
Multilayer flex PCBs hangata li theko e boima ho feta li-PCB tse thata ka lebaka la ho rarahana ho eketsehileng ho amehang le lisebelisoa tse khethehileng tse hlokahalang. Leha ho le joalo, litšenyehelo li ka fapana ho itšetlehile ka ho rarahana ha moralo, palo ea lihlopha le litlhaloso tse hlokahalang.

7. Na FPC e nang le mekhahlelo e mengata e ka lokisoa?
Ho lokisa kapa ho lokisa bocha ho ka ba thata ka lebaka la sebopeho se rarahaneng le sebopeho se feto-fetohang sa li-PCB tsa multilayer flex. Haeba ho na le phoso kapa tšenyo, hangata ho boloka chelete e ngata ho nkela PCB sebaka kaofela ho feta ho leka ho e lokisa. Leha ho le joalo, litokiso tse nyane kapa mosebetsi oa bocha o ka etsoa ho latela bothata bo itseng le boiphihlelo bo teng.

8. Na ho na le mefokolo leha e le efe kapa bofokoli ba ho sebelisa multilayer flex PCB ka smartphone?
Le hoja li-PCB tsa multilayer flex li na le melemo e mengata, li boetse li na le mefokolo e itseng. Hangata li theko e boima ho feta li-PCB tse thata. Ho feto-fetoha ha maemo ho phahameng ho ka baka mathata nakong ea kopano, e hlokang ho tšoaroa ka hloko le lisebelisoa tse khethehileng. Ho feta moo, mokhoa oa moralo le menahano ea sebopeho e ka ba thata ho feta bakeng sa li-PCB tse tenyetsehang tsa multilayer ha li bapisoa le li-PCB tse thata.

E fetileng: Moetsi oa Li-PCB tsa Layer Flexible bakeng sa Taolo ea Indasteri

E 'ngoe: 4 Layer Flexible PCBs PI Multilayer FPCs bakeng sa Libui

Ngola molaetsa wa hao mona mme o re romele wona