HDI bobeli-taelo 8 lera - HDI PCB - patoa foufetseng lesoba flex-thata pcb
Re hlahisa sehlahisoa sa rona sa morao-rao, boemo bo phahameng ba HDI boemong ba bobeli ba 8-layer - HDI PCB - e patoa e foufetse ka boto e thata-thata. Tharollo ena e ncha le e ka tšeptjoang e etselitsoe ka ho khetheha indasteri ea likoloi tsa motlakase.
-Capel o na le lilemo tse 15 tsa boiphihlelo ba botekgeniki-
Re hlahisa sehlahisoa sa rona sa morao-rao, boemo bo phahameng ba HDI boemong ba bobeli ba 8-layer - HDI PCB - e patoa e foufetse ka boto e thata-thata. Tharollo ena e ncha le e ka tšeptjoang e etselitsoe ka ho khetheha indasteri ea likoloi tsa motlakase.
E entsoe ka thepa e kang PI, Copper, Adhesives le FR4, li-PCB tsa rona li entsoe ho fihlela litlhoko tse boima tsa lits'ebetso tsa likoloi. Ka botenya ba 1.0mm +/- 0.03mm le bophara ba sekoti bo fokolang ba 0.1mm, liboto tsa rona tsa PCB li fana ka nako e telele le ho nepahala ho hlokahalang bakeng sa lisebelisoa tsa motlakase tsa likoloi.
E 'ngoe ea likarolo tsa bohlokoa tsa lihlahisoa tsa rona ke ho kenyelletsa li-vias tse foufetseng le tse patiloeng. Blind vias (L1-L2, L7-L8) le li-vias tse patiloeng (L2-L3, L4-L5, L6-L7) li nolofalletsa meralo e rarahaneng le e kopaneng, ha ho tlatsoa ha lesoba ho netefatsa botšepehi ba likhokahano ka har'a PCB.
Ntle le moo, li-PCB tsa rona li alafshoa ka ENIG 'me li botenya ba 2-3uin, li fana ka sebaka se sireletsehileng le se ts'epahalang. Bophara ba mela ea rona ea PCB le sebaka ke 0.1mm/0.1mm, e fana ka ho nepahala le ho nepahala ho hlokahalang ho lisebelisoa tsa elektronike tsa likoloi.
High Density HDI Second Order 8 Layer - HDI PCB - Buried Blind Via Soft Rigid PCB e etselitsoe ho fana ka tharollo e tšepahalang bakeng sa lits'ebetso tsa koloi ea motlakase. Ha likoloi tsa motlakase li ntse li tsoela pele ho hola indastering ea likoloi, tlhoko ea lisebelisoa tsa elektroniki tse tsoetseng pele, tse tšoarellang lia eketseha. Li-PCB tsa rona li etselitsoe ho fihlela litlhoko tsena, ho fana ka tharollo e tšepahalang le e sebetsang bakeng sa lits'ebetso tsa koloi ea motlakase.
Ntle le kaho e thata, li-PCB tsa rona li na le mamello ea ± 0.1mm, e netefatsang botsitso le ho nepahala ts'ebetsong ea tlhahiso. Boemo bona ba ho nepahala ke ba bohlokoa ho ts'ebetsong le ho ts'epahala ha litsamaiso tsa elektronike tsa likoloi.
Ka kakaretso, 8-layer ea rona e phahameng ea HDI ea 8-layer - HDI PCB - e patiloeng e foufetse ka rigid-flex board ke tharollo ea morao-rao bakeng sa indasteri ea likoloi tsa motlakase. Ka likarolo tsa eona tse tsoetseng pele le sebopeho se tšoarellang, e khona ho fihlela litlhoko tse fetohang tsa lisebelisoa tsa motlakase tsa likoloi le ho fana ka tharollo e tšepahalang le e sebetsang bakeng sa lits'ebetso tsa koloi ea motlakase.
Capel Flexible PCB & Rigid-Flex PCB Mokhoa oa Ts'ebetso ea Matla
| Sehlopha | Bokhoni ba Ts'ebetso | Sehlopha | Bokhoni ba Ts'ebetso |
| Mofuta oa Tlhahiso | FPC e le 'ngoe / Mekhahlelo e habeli FPC Multi-layer FPC / Aluminium PCBs Regid-Flex PCB | Layer Number | 1-30likarolo FPC 2-32likarolo Rigid-FlexPCB1-60likarolo Rigid PCB HDIMaboto |
| Max Manufacture size | FPC e le 'ngoe ea 4000mm Mekhahlelo e habeli FPC 1200mm Mefuta e mengata ea FPC 750mm Regid-Flex PCB 750mm | Insulating Layer Botenya | 27.5um / 37.5/ 50um / 65/ 75um / 100um / 125um / 150um |
| Botenya ba Boto | FPC 0.06mm - 0.4mm Rigid-Flex PCB 0.25 - 6.0mm | Mamello ea PTH Boholo | ± 0.075mm |
| Surface Finish | Ho qoelisoa ka Khauta/ Ho qoelisoa Silver/Gold Plating/Tin Plating/OSP | Stiffener | FR4 / PI / PET / SUS / PSA/Alu |
| Semicircle Orifice Size | Ka tlase ho 0.4mm | Min Line Space/ bophara | 0.045mm/0.045mm |
| Botenya Mamello | ± 0.03 limilimithara | Tšitiso | 50Ω-120Ω |
| Botenya ba Koporo ea Foil | 9um/12um/18um/35um/70um/100um | Tšitiso Laolwa Mamello | ±10% |
| Mamello ea NPTH Boholo | ± 0.05 limilimithara | The Min Flush Width | 0.80 limilimithara |
| Min Via Hole | 0.1 limilimithara | Phethahatsa Standard | GB / IPC-650 / IPC-6012 / IPC-6013II / IPC-6013III |
Capel e etsa Boto ea Potoloho ea Rigid Flexible / Flexible PCB / HDI PCB e nang le boiphihlelo ba lilemo tse 15 ka botsebi ba rona.
2 Layer Flexible PCB Boards Stackup
4 Layer Rigid-Flex PCB Stackup
8 lera HDI PCBs
Lisebelisoa tsa Teko le Tlhahlobo
Teko ea microscope
Tlhahlobo ea AOI
Teko ea 2D
Teko ea Impedance
Teko ea RoHS
Flying Probe
Horizontal Tester
Ho Kobeha Teste
Capel e fa bareki tšebeletso ea PCB e hlophisitsoeng ka lilemo tse 15 tsa boiphihlelo
- Ho rua 3lifeme bakeng sa Flexible PCB&Rigid-Flex PCB, Rigid PCB, DIP/SMT Assembly;
- 300+Baenjiniere ba Fana ka tšehetso ea tekheniki bakeng sa thekiso ea pele le ka mor'a thekiso inthaneteng;
- 1-30likarolo tsa FPC,2-32likarolo Rigid-FlexPCB,1-60likarolo Rigid PCB
- HDI Boards, Flexible PCB (FPC), Rigid-Flex PCBs, Multilayer PCBs, Single-sided PCB, Double-Sided Circuit Boards, Hollow Boards, Rogers PCB, rf PCB, Metal Core PCB, Special Process Boards, Ceramic PCB, Aluminium PCB , Kopano ea SMT & PTH, Tšebeletso ea Prototype ea PCB.
- Fana ka24-horaTs'ebeletso ea Prototyping ea PCB, Lihlopha tse Nyenyane tsa liboto tsa potoloho li tla tlisoa ka hareMatsatsi a 5-7, Tlhahiso ea 'Misa ea liboto tsa PCB e tla fanoa kaLibeke tse 2-3;
- Liindasteri tseo re li sebeletsang:Lisebelisoa tsa Bongaka, IOT, TUT, UAV, Lifofane, Likoloi, Khokahano ea Mohala, Consumer Electronics, Sesole, Sefofane, Taolo ea Liindasteri, Intelligence ea Maiketsetso, EV, joalo-joalo…
- Bokhoni ba rona ba Tlhahiso:
Matla a tlhahiso ea FPC le Rigid-Flex PCB a ka fihla ho feta150000sqmka khoeli,
Bokhoni ba tlhahiso ea PCB bo ka fihla80000sqmka khoeli,
PCB Ho bokella bokhoni ho150,000,000likarolo ka khoeli.
- Lihlopha tsa rona tsa baenjiniere le bafuputsi ba ikemiselitse ho phethahatsa litlhoko tsa hau ka ho nepahala le ka botsebi.
