boleng bo phahameng 2 lera likoloi flex pcb prototyping bakeng sa RCTA
Re hlahisa prototyping ea rona ea boleng bo holimo ea 2 layer flexible PCB bakeng sa RCTA
-Capel o na le lilemo tse 15 tsa boiphihlelo ba botekgeniki-
Re hlahisa prototyping ea rona ea boleng bo holimo ea 2 layer flexible PCB bakeng sa RCTA. Lihlahisoa tsa rona li etselitsoe ka ho khetheha indasteri ea likoloi tse shebaneng le ho tšepahala le ts'ebetso. PCB ena e tenyetsehang ea 2-layer e entsoe ka thepa e tšoarellang joalo ka PI, koporo le likhomaretsi, ho netefatsa hore e khona ho mamella maemo a thata a tikoloho ea likoloi.
Bophara ba mela e tenyetsehang ea PCB le sebaka sa mela ke 0.2mm/0.2mm, e fana ka likhokahano tse nepahetseng bakeng sa lits'ebetso tsa hau tsa koloi. Botenya ba boto ba 0.2mm +/- 0.03mm bo netefatsa hore e bobebe empa e le matla ka ho lekana bakeng sa tšebeliso ea likoloi. Ho feta moo, bophara ba bonyane ba 0.1 mm bo thusa meralo e rarahaneng le e qaqileng.
Phekolo ea bokaholimo ba ENIG 2-3uin ha e fane feela ka ts'ebetso e ntle ea motlakase, empa hape e netefatsa hore PCB ha e na kutu ebile e loketse tšebeliso ea nako e telele lits'ebetsong tsa likoloi. Ka mamello ea ± 0.1mm, u ka ba le kholiseho ea ho tšepahala le ho tsitsa ha lihlahisoa tsa rona.
Li-PCB tsa rona tsa 2-layer automotive flexible li loketse lits'ebetso tse joalo ka RCTA (Rear Cross Traffic Alert) ka har'a likoloi. Ho tenyetseha ha li-PCB ho li lumella hore li hokahane habonolo tikolohong e kopaneng le e nang le sebaka se sengata sa lisebelisoa tsa elektroniki tsa likoloi. Kaho ea eona ea boleng bo holimo e tiisa hore e khona ho mamella ho thothomela, liphetoho tsa mocheso le mathata a mang a hlahang tšebelisong ea likoloi.
Hore na o etsa mohlala oa sistimi e ncha ea likoloi kapa o batla tharollo e tšepahalang bakeng sa ts'ebetsong ea RCTA, li-PCB tsa rona tse 2-layer tse tenyetsehang ke khetho e nepahetseng. Kaho ea eona ea boleng bo holimo, litlhaloso tse nepahetseng le ho tšoarella ha eona li etsa hore e tšoanelehe bakeng sa lisebelisoa tsa likoloi.
Khamphani ea rona, re utloisisa bohlokoa ba boleng le ts'ebetso indastering ea likoloi. Ke ka lebaka leo re entseng PCB ena e khethehileng ea 2-layer flexible PCB ho fihlela litlhoko tse ikhethang tsa lisebelisoa tsa elektroniki tsa likoloi. Re ikemiselitse ho fa bareki ba rona lihlahisoa tsa maemo a holimo tse fanang ka ts'ebetso e ikhethang le ts'epahalo, 'me li-PCB tsa rona tse 2-layer tse feto-fetohang le tsona le tsona.
Ka kakaretso, prototyping ea rona ea boleng bo holimo ea 2-layer flex PCB bakeng sa RCTA ke tharollo e phethahetseng bakeng sa litlhoko tsa hau tsa elektronike tsa koloi. Ka kaho ea eona e tšoarellang, litlhaloso tse nepahetseng le ts'ebetso e tšepahalang, e loketse lits'ebetso tsa likoloi. Tšepa lihlahisoa tsa rona ho fana ka boleng le ts'ebetso eo litsamaiso tsa hau tsa likoloi li li hlokang.
Capel Flexible PCB & Rigid-Flex PCB Mokhoa oa Ts'ebetso ea Matla
Sehlopha | Bokhoni ba Ts'ebetso | Sehlopha | Bokhoni ba Ts'ebetso |
Mofuta oa Tlhahiso | FPC e le 'ngoe / Mekhahlelo e habeli FPC Multi-layer FPC / Aluminium PCBs Regid-Flex PCB | Layer Number | 1-30likarolo FPC 2-32likarolo Rigid-FlexPCB1-60likarolo Rigid PCB HDIMaboto |
Max Manufacture size | FPC e le 'ngoe ea 4000mm Mekhahlelo e habeli FPC 1200mm Mefuta e mengata ea FPC 750mm Regid-Flex PCB 750mm | Insulating Layer Botenya | 27.5um / 37.5/ 50um / 65/ 75um / 100um / 125um / 150um |
Botenya ba Boto | FPC 0.06mm - 0.4mm Rigid-Flex PCB 0.25 - 6.0mm | Mamello ea PTH Boholo | ± 0.075mm |
Surface Finish | Ho qoelisoa ka Khauta/ Ho qoelisoa Silver/Gold Plating/Tin Plating/OSP | Stiffener | FR4 / PI / PET / SUS / PSA/Alu |
Semicircle Orifice Size | Ka tlase ho 0.4mm | Min Line Space/ bophara | 0.045mm/0.045mm |
Botenya Mamello | ± 0.03 limilimithara | Tšitiso | 50Ω-120Ω |
Botenya ba Koporo ea Foil | 9um/12um/18um/35um/70um/100um | Tšitiso Laolwa Mamello | ±10% |
Mamello ea NPTH Boholo | ± 0.05 limilimithara | The Min Flush Width | 0.80 limilimithara |
Min Via Hole | 0.1 limilimithara | Phethahatsa Standard | GB / IPC-650 / IPC-6012 / IPC-6013II / IPC-6013III |
Capel e etsa Boto ea Potoloho ea Rigid Flexible / Flexible PCB / HDI PCB e nang le boiphihlelo ba lilemo tse 15 ka botsebi ba rona.
2 Layer Flexible PCB Boards Stackup
4 Layer Rigid-Flex PCB Stackup
8 lera HDI PCBs
Lisebelisoa tsa Teko le Tlhahlobo
Teko ea microscope
Tlhahlobo ea AOI
Teko ea 2D
Teko ea Impedance
Teko ea RoHS
Flying Probe
Horizontal Tester
Ho Kobeha Teste
Capel e fa bareki tšebeletso ea PCB e hlophisitsoeng ka lilemo tse 15 tsa boiphihlelo
- Ho rua 3lifeme bakeng sa Flexible PCB&Rigid-Flex PCB, Rigid PCB, DIP/SMT Assembly;
- 300+Baenjiniere ba Fana ka tšehetso ea tekheniki bakeng sa thekiso ea pele le ka mor'a thekiso inthaneteng;
- 1-30likarolo tsa FPC,2-32likarolo Rigid-FlexPCB,1-60likarolo Rigid PCB
- HDI Boards, Flexible PCB (FPC), Rigid-Flex PCBs, Multilayer PCBs, Single-sided PCB, Double-Sided Circuit Boards, Hollow Boards, Rogers PCB, rf PCB, Metal Core PCB, Special Process Boards, Ceramic PCB, Aluminium PCB , Kopano ea SMT & PTH, Tšebeletso ea Prototype ea PCB.
- Fana ka24-horaTs'ebeletso ea Prototyping ea PCB, Lihlopha tse Nyenyane tsa liboto tsa potoloho li tla tlisoa ka hareMatsatsi a 5-7, Tlhahiso ea 'Misa ea liboto tsa PCB e tla fanoa kaLibeke tse 2-3;
- Liindasteri tseo re li sebeletsang:Lisebelisoa tsa Bongaka, IOT, TUT, UAV, Lifofane, Likoloi, Khokahano ea Mohala, Consumer Electronics, Sesole, Sefofane, Taolo ea Liindasteri, Intelligence ea Maiketsetso, EV, joalo-joalo…
- Bokhoni ba rona ba Tlhahiso:
Matla a tlhahiso ea FPC le Rigid-Flex PCB a ka fihla ho feta150000sqmka khoeli,
Bokhoni ba tlhahiso ea PCB bo ka fihla80000sqmka khoeli,
PCB Ho bokella bokhoni ho150,000,000likarolo ka khoeli.
- Lihlopha tsa rona tsa baenjiniere le bafuputsi ba ikemiselitse ho phethahatsa litlhoko tsa hau ka ho nepahala le ka botsebi.