Lekola lefatše la 10-layer fpc flexible PCB prototyping le ho etsa ka Capel. Ho tloha ho lintlha tsa tekheniki le lits'ebetso tsa tlhahiso ho isa ho bohlokoa ba li-FPC tsa maemo a holimo a 10 indastering ea lisebelisoa tsa elektroniki, sengoloa sena se felletseng se kenella ka har'a theknoloji e tsoetseng pele le boiphihlelo boo Capel a fanang ka bona joalo ka moetsi ea nang le boiphihlelo.
Tsebisa
Lefapheng la tlhahiso ea lisebelisoa tsa elektroniki, tlhokahalo ea theknoloji e tsoetseng pele le boqapi e eketsehile haholo ho theosa le lilemo. Li-circuits tse hatisitsoeng tse feto-fetohang (FPCs) li fetohile likarolo tsa bohlokoa, tse fanang ka ho feto-fetoha ha maemo le ho tšepahala ho hlokahalang bakeng sa mefuta e sa tšoaneng ea lisebelisoa tsa elektronike. Sengoliloeng sena ke tlhahlobo e felletseng ea thekenoloji ea 10-layer FPC, e tsepamisitseng maikutlo ho prototyping le bokhoni ba tlhahiso bo fanoeng ke Capel. Re tla shebisisa lintlha tsa tekheniki tsa FPC ea boleng bo holimo ea 10-layer, ts'ebetso ea eona ea tlhahiso, le bohlokoa ba eona indastering ea lisebelisoa tsa elektroniki.
Bohlokoa baPrototypingle Tlhahiso ka Indastering ea Elektronike
Prototyping le tlhahiso ke likarolo tsa bohlokoa tsa nts'etsopele le tlhahiso ea lihlahisoa tsa elektroniki. Prototyping e lumella meralo hore e lekoe le ho netefatsoa, ho netefatsa hore sehlahisoa sa ho qetela se fihlela litlhoko tse boletsoeng. Ka lehlakoreng le leng, tlhahiso ke mokhoa oa ho fetola meralo hore e be lihlahisoa tse tšoarehang tse ka hlahisoang ka bongata. Mekhahlelo ena e bohlokoa ho netefatsa ts'ebetso, ts'ebetso le ts'epahalo ea likarolo tsa elektroniki.
Kakaretso ea Capel joalo kamoetsi ea nang le boiphihlelotšimong
Capel e na le nalane e telele ea boitseanape le boqapi ba tlhahiso ea PCB e tenyetsehang. E tsepamisitse maikutlo ho faneng ka lihlahisoa le litšebeletso tsa boleng bo phahameng, Capel e iketselitse botumo bo matla ba ho ba moetsi ea ka tšeptjoang le ea nang le phihlelo. Boitlamo ba bona ba bokhabane le khotsofalo ea bareki bo ba khetholla indastering ea tlholisano ea elektronike.
Ho utloisisa 10-Layer Flexible PCB Technology: Thuto ea Taba
Lintlha tsa mofuta oa sehlahisoa: 10-layer rigid-flex board
10-layer rigid-flex PCB e bonts'a tsoelo-pele le ho rarahana ha likarolo tsa sejoale-joale tsa elektroniki. Sehlahisoa sena se ikhethileng se etselitsoe ho amohela lipotoloho tse rarahaneng tsa elektroniki, tse fanang ka maemo a bonolo le a thata a hlokahalang.
Litlhaloso le lintlha tsa tekheniki
Ho utloisisa bokhoni ba boto ea 10-layer rigid-flex-flex, motho o tlameha ho hlahlobisisa lintlha tsa eona tsa tekheniki: - Bophara ba mela le sebaka sa mela: 0.1mm / 0.1mm - Botenya ba boto: 1.2mm - Sebaka se tlase: 0.15mm - Botenya ba koporo: 18um, 35um - Phekolo ea bokaholimo: khauta e qoelisoang - ts'ebetso e khethehileng: NiPdAu
Prototyping le tlhahiso ea 10-layer flexible PCB
Bohlokoa ba prototyping ntlafatsong ea sehlahisoa
Prototyping e bapala karolo ea bohlokoa ntlafatsong ea lihlahisoa tsa elektroniki. E lumella mehopolo ea moralo hore e hlahlojoe, ho khethoe mefokolo, 'me ho netefatsoe ts'ebetso. Capel o utloisisa bohlokoa ba mohato ona mme o hatisa tlhokahalo ea prototyping ka botlalo molemong oa ho ipabola.
Mokhoa oa ho etsa prototyping le tlhahiso ea Capel
Capel e na le mokhoa o phethahetseng le o hlophisitsoeng hantle oa prototyping le mokhoa oa tlhahiso o koahelang ho nepahala, ho ts'epahala le ho sebetsa hantle. Mokhoa oa bona o nolofalitsoeng o netefatsa hore 10-layer FPC ha e sebetse hantle feela ka botekgeniki empa hape e sebetsa hantle moruong.
Joang Capele netefatsa tlhahiso le tlhahiso ea boleng bo holimo ea 10-layer FPC
THEKNOLOJI E TSOANG LE MACHINE: Capel e tsetela ho lisebelisoa le mahlale a morao-rao a ba lumellang ho etsa li-FPC tse rarahaneng le tse matla, tse nepahetseng le tse nepahetseng tsa 10-layer.
Mosebetsi le Tsebo ea Tsebo: Basebetsi ba Capel ba na le tsebo le bokhoni bo bongata, ho netefatsa hore mohato o mong le o mong oa ts'ebetso ea tlhahiso o etsoa ka bokhabane le ho ela hloko lintlha.
Mehato ea Taolo ea Boleng: Capel e sebelisa mehato e tiileng ea taolo ea boleng ho beha leihlo le ho lekola mohato o mong le o mong oa prototyping le ts'ebetso ea tlhahiso ho netefatsa ho latela litekanyetso tsa indasteri le litlhaloso tsa bareki.
Melemo le ts'ebeliso ea 10-layer FPC
Melemo ea ho sebelisa 10-layer flexible PCB lisebelisoa tsa elektroniki
10-layer FPC e fana ka melemo e mengata ho feta li-PCB tsa setso tse thata, ho kenyelletsa le ho feto-fetoha ha maemo, boima bo fokotsehileng le litlhoko tsa sebaka, taolo e ntlafalitsoeng ea mocheso, le ts'epo e phahameng. Mehaho ena e etsa hore e be khetho ea pele bakeng sa mefuta e fapaneng ea lisebelisoa tsa elektroniki.
Likopo liindastering tse fapaneng
Aerospace: Indasteri ea sepakapaka e sebelisa thepa e bobebe le e tenyetsehang ea FPC ea 10-layer ho fihlela litlhoko tse batloang ke litsamaiso tsa sejoale-joale tsa sefofane le sefofane.
Thepa ea bongaka: Lefapheng la bongaka, 10-layer FPC e sebelisoa haholo lisebelisoa tsa bongaka tse nkehang habonolo, mekhoa ea ho hlahloba mokuli le lisebelisoa tsa ho hlahloba, moo ho fetoha ha maemo le ho tšepahala ho leng bohlokoa.
Consumer Electronics: Ho tloha ho tse roaloang ho ea ho li-smartphone le matlapa, indasteri ea lisebelisoa tsa elektroniki e itšetleha ka FPC ea 10-layer ho nolofalletsa meralo e kopaneng le e ncha ha e ntse e boloka ts'ebetso e phahameng.
10 Layer Flexible PCB Fabrication Process
Ha re phethela
Bohlokoa ba prototyping ea boleng ba 10-layer FPC le tlhahiso e ke ke ea fetisoa, haholo indastering e hlokang ho nepahala, ho ts'epahala le ho sebetsa hantle. Capel ke moetsi ea tšepahalang le ea nang le boiphihlelo lefapheng la li-PCB tse tenyetsehang. Boitlamo ba bona ba theknoloji e tsoetseng pele, boqapi bo nang le boiphihlelo le boleng bo sa sekisetseng bo ba khetholla ho sebeletseng litlhoko tse fapaneng tsa indasteri ea lisebelisoa tsa elektroniki. Ha tlhokahalo ea litharollo tse rarahaneng tsa elektronike e ntse e hōla, Capel e ka pele-pele, e fana ka litšebeletso tse phahameng tsa 10-layer FPC prototyping le tlhahiso ea litšebeletso.
Ka kakaretso, 10-layer FPC e na le tšepiso e kholo bakeng sa bokamoso ba likarolo tsa elektronike, 'me tsebo ea Capel e etsa hore e be matla a ka sehloohong ho nts'etsopele ea theknoloji ena.
Nako ea poso: Mar-02-2024
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