4-Layer PCB Stackups Ho Nepaha ha ho Cheka le Boleng ba Lerako la Leso : Malebela a Setsebi sa Capel

Tsebisa:

Ha ho etsoa liboto tsa potoloho tse hatisitsoeng (PCBs), ho netefatsa ho nepahala ha ho cheka le boleng ba lebota la lesoba ka har'a stack ea PCB ea 4 ho bohlokoa ho ts'ebetso e akaretsang le ts'epahalo ea sesebelisoa sa elektroniki.Capel ke k'hamphani e etelletseng pele e nang le boiphihlelo ba lilemo tse 15 indastering ea PCB, e nang le taolo ea boleng e le sepheo sa eona sa mantlha.Blog ena e ikemiselitse ho u fa leseli la bohlokoa mabapi le mokhoa oa ho fihlela ho nepahala ho sa tsitsang ha ho cheka le boleng ba lebota la lesoba ka har'a sethala sa 4-layer PCB, ha e ntse e totobatsa boiphihlelo ba Capel le tharollo e tšepahalang ea PCB.

1. Bohlokoa ba ho cheka ho nepahala le boleng ba lebota la lesoba ho 4-layer PCB stack-up:

Ho nepahala ha ho cheka le boleng ba lebota la lesoba ke lintlha tsa bohlokoa tse amang ts'ebetso ea 4-layer PCB stack. Ho fosahetse ho cheka ho ka lebisa tlhokomelong e fosahetseng ea likaroloana, mathata a ho thibela, le litaba tsa botšepehi ba matšoao. Ka mokhoa o ts'oanang, boleng bo sa lekaneng ba lebota la lesoba bo ka ama ts'ebetso ea likhokahano tsa "plated through hole" (PTH), tse lebisang litabeng tsa ts'epahalo le ts'ebetso ea motlakase e fokotsehileng.

2. Khetha lisebelisoa tse nepahetseng tsa ho cheka le theknoloji:

Ho etsa bonnete ba hore ho cheka ho nepahetse, tsetela ho lisebelisoa tsa boleng bo holimo tse u lumellang ho laola lebelo la ho cheka ka nepo, botebo le tekano. Mechini ea ho cheka e ikemetseng e nang le likarolo tse tsoetseng pele joalo ka ho phunya ka thuso ea laser le ho nepahala ho laoloang ke komporo li khothaletsoa haholo. Ho feta moo, nahana ka li-microvias tse entsoeng ka laser bakeng sa liboto tsa multilayer tse tsoetseng pele kaha li fana ka ho nepahala le ho ts'epahala.

3. Moralo o motle ka ho fetisisa oa stacking:

Moralo o nepahetseng oa li-stack-up o phetha karolo ea bohlokoa ho finyelleng ho nepahala ha ho cheka le boleng ba lebota la lesoba. Ka kopo, nahana ka malebela a latelang:
- Fokotsa palo ea likarolo tsa matšoao ho fokotsa ho rarahana ha ho cheka.
- Boloka junifomo ea botenya ba mantlha ho thibela mekoti ea ho cheka hore e se ke ea thekesela.
- Sebelisa kabo e leka-lekaneng ea koporo ho qoba ho kobeha le ho khopama nakong ea ho cheka.
- Beha mats'oao a lebelo le holimo le likarolo tse bobebe hole le sebaka se chekang ho fokotsa kotsi ea tšitiso ea motlakase.

4. Mokhoa o nepahetseng oa ho etsa PCB:

Capel o na le boiphihlelo ba lilemo tse 15 mme o latela lits'ebetso tse tiileng tsa tlhahiso ho netefatsa ho nepahala ha ho cheka le mabota a masoba a boleng bo holimo ho li-stack-ups tsa PCB tse 4. Ka meaho ea morao-rao le basebetsi ba nang le litsebo, ba sebelisa mekhoa e tsoetseng pele e kang Laser Direct Imaging (LDI) le Automated Optical Inspection (AOI) bakeng sa ho hokahanya le ho hlahloba boleng nakong ea ts'ebetso ea tlhahiso. Boitseanape bona bo tiisa li-PCB tse tšepahalang, tse matla bakeng sa bareki.

5. Mehato e felletseng ea taolo ea boleng:

Boitlamo ba Capel ho taolo ea boleng bo bonahala mekhoeng ea eona ea tlhahlobo e matla. Ba sebelisa mekhoa e tsoetseng pele ea tlhahlobo, ho kenyelletsa tlhahlobo ea motlakase, tlhahlobo ea ho ts'epahala le tlhahlobo ea botsofali ba mocheso. Ka ho beha leihlo ka nako ea sebele le ho latela litekanyetso tsa boleng ba machaba, Capel e etsa bonnete ba hore PCB e 'ngoe le e 'ngoe eo ba e etsang e kopana kapa e feta litebello tsa bareki.

6. Litšebeletso tsa prototyping tsa PCB tsa Capel le likopano:

Joaloka mofani oa litharollo tsa PCB tse emeng, Capel ha e sebetse feela ka ho etsa li-stack-ups tsa PCB tsa 4-layer, empa hape e fana ka prototyping e potlakileng ea PCB le lits'ebeletso tse sebetsang hantle tsa kopano ea SMT PCB. Mokhoa ona o nolofalitsoeng o felisa tlhokahalo ea bafani ba thepa e mengata 'me o etsa bonnete ba ho kopanya ka mokhoa o se nang moeli oa mekhahlelo eohle ea tlhahiso ea PCB, kahoo e boloka nako le ho fokotsa litšenyehelo bakeng sa bareki ba eona ba bohlokoa.

Ha re phethela:

Ha ho tluoa tabeng ea ho finyella ho nepahala ha ho phunya le boleng ba lerako la lesoba ka har'a stackup ea PCB ea 4-layer, ho sebetsa le moetsi oa PCB ea nang le phihlelo le ea tšepahalang joaloka Capel ho bohlokoa.Capel e hlahella indastering ka ho totobatsa taolo ea boleng, theknoloji e tsoetseng pele le tharollo e felletseng ea PCB ea turnkey. Ka ho etelletsa pele ho nepahala ha ho cheka le boleng ba lebota la lesoba, o ka netefatsa ts'ebetso e phahameng le bophelo bo bolelele ba lisebelisoa tsa hau tsa elektroniki.