Litheknoloji tse fapaneng tsa tlhahiso ea theknoloji ea HDI PCB

Selelekela:

Theknoloji ea High-density interconnect (HDI) Li-PCB li fetotse indasteri ea lisebelisoa tsa elektroniki ka ho etsa hore ho be le ts'ebetso e ngata ho lisebelisoa tse nyane, tse bobebe.Li-PCB tsena tse tsoetseng pele li etselitsoe ho ntlafatsa boleng ba matšoao, ho fokotsa tšitiso ea lerata le ho khothaletsa miniaturization.Ka poso ena ea blog, re tla hlahloba mekhoa e fapaneng ea tlhahiso e sebelisoang ho hlahisa li-PCB tsa theknoloji ea HDI.Ka ho utloisisa lits'ebetso tsena tse rarahaneng, u tla fumana temohisiso ea lefats'e le rarahaneng la tlhahiso ea boto ea potoloho e hatisitsoeng le hore na e kenya letsoho joang ntlafatsong ea theknoloji ea sejoale-joale.

1. Laser Direct Imaging (LDI) :

Laser Direct Imaging (LDI) ke theknoloji e tsebahalang e sebelisoang ho etsa li-PCB ka theknoloji ea HDI.E nkela sebaka sa mekhoa ea setso ea photolithography mme e fana ka bokhoni bo nepahetseng ba ho etsa mohlala.LDI e sebelisa laser ho pepesa photoresist ka kotloloho ntle le tlhoko ea mask kapa stencil.Sena se nolofalletsa bahlahisi ho fihlela boholo ba likarolo tse nyane, sekhahla se phahameng sa potoloho, le ho nepahala ho holimo ho ngolisoang.

Ho feta moo, LDI e lumella ho theoa ha li-circuits tse nang le molumo o motle, ho fokotsa sebaka pakeng tsa lipina le ho matlafatsa botšepehi ba matšoao ka kakaretso.E boetse e thusa li-microvias tse nepahetseng haholo, tse bohlokoa bakeng sa li-PCB tsa HDI tsa theknoloji.Li-Microvias li sebelisoa ho hokahanya likarolo tse fapaneng tsa PCB, ka hona li eketsa sekhahla sa ho tsamaisa le ho ntlafatsa ts'ebetso.

2. Sequential Building (SBU):

Kopano ea Sequential (SBU) ke theknoloji e 'ngoe ea bohlokoa ea tlhahiso e sebelisoang haholo tlhahiso ea PCB bakeng sa theknoloji ea HDI.SBU e kenyelletsa kaho ea PCB ka lera, e lumellang lipalo tse phahameng le litekanyo tse nyane.Theknoloji e sebelisa likarolo tse ngata tse tšesaane tse teteaneng, e 'ngoe le e' ngoe e na le likhokahano tsa eona le vias.

Li-SBU li thusa ho kopanya li-circuits tse rarahaneng ho etsa lintlha tse nyane, ho li etsa tse loketseng lisebelisoa tsa elektroniki tse kopaneng.Ts'ebetso ena e kenyelletsa ho sebelisa lesela la insulating dielectric ebe o theha potoloho e hlokahalang ka lits'ebetso tse joalo ka plating e eketsang, etching le ho cheka.Li-Vias li thehoa ka ho phunya laser, ho cheka ka mechine kapa ho sebelisa mokhoa oa plasma.

Nakong ea ts'ebetso ea SBU, sehlopha sa tlhahiso se hloka ho boloka taolo e tiileng ea boleng ho netefatsa teka-tekano le ngoliso ea mekhahlelo e mengata.Ho cheka ka laser hangata ho sebelisoa ho theha li-microvias tse nyane tsa bophara, ka hona ho eketsa ts'epo le ts'ebetso ea li-PCB tsa HDI tsa theknoloji.

3. Theknoloji ea tlhahiso ea Hybrid:

Ha theknoloji e ntse e tsoela pele ho fetoha, theknoloji ea tlhahiso ea lebasetere e fetohile tharollo e ratoang bakeng sa li-PCB tsa theknoloji tsa HDI.Theknoloji ena e kopanya mekhoa ea setso le e tsoetseng pele ho ntlafatsa maemo, ho ntlafatsa katleho ea tlhahiso le ho ntlafatsa tšebeliso ea lisebelisoa.

Mokhoa o mong oa lebasetere ke ho kopanya mahlale a LDI le SBU ho theha lits'ebetso tse tsoetseng pele haholo tsa tlhahiso.LDI e sebelisetsoa ho etsa lipaterone tse nepahetseng le li-circuits tse hlakileng, ha SBU e fana ka moaho o hlokahalang oa lera le ho kopanya lipotoloho tse rarahaneng.Motsoako ona o netefatsa tlhahiso e atlehileng ea li-PCB tse phahameng haholo, tse sebetsang hantle.

Ho feta moo, ho kopanngoa ha theknoloji ea khatiso ea 3D le mekhoa ea setso ea ho etsa li-PCB ho thusa ho hlahisa libopeho tse rarahaneng le likarolo tsa cavity ka har'a li-PCB tsa theknoloji tsa HDI.Sena se lumella tsamaiso e ntle ea mocheso, ho fokotsa boima ba 'mele le ho ntlafatsa botsitso ba mechine.

Qetello:

Theknoloji ea tlhahiso e sebelisoang ho HDI Technology PCBs e bapala karolo ea bohlokoa ho khanna mekhoa e mecha le ho theha lisebelisoa tse tsoetseng pele tsa elektroniki.Ho nahana ka ho toba ka Laser, ho aha ka tatellano le theknoloji ea tlhahiso e nyalisitsoeng e fana ka melemo e ikhethang e sutumetsang meeli ea miniaturization, botšepehi ba matšoao le boima ba potoloho.Ka tsoelopele e tsoelang pele ea thekenoloji, nts'etsopele ea mahlale a macha a tlhahiso a tla ntlafatsa le ho feta bokhoni ba HDI theknoloji ea PCB le ho khothaletsa tsoelo-pele e tsoelang pele ea indasteri ea lisebelisoa tsa elektroniki.