Likarolo tse ka sehloohong tsa Multilayer FPC PCB

Multilayer flexible printed circuit boards (FPC PCBs) ke likarolo tsa bohlokoa tse sebelisoang mefuteng e fapaneng ea lisebelisoa tsa elektroniki, ho tloha ho li-smartphone le matlapa ho ea ho lisebelisoa tsa bongaka le lisebelisoa tsa likoloi. Theknoloji ena e tsoetseng pele e fana ka phetoho e kholo, ho tšoarella le phetisetso ea matšoao e sebetsang hantle, e etsang hore e batloe haholo lefatšeng la kajeno la dijithale le potlakileng.Ka poso ena ea blog, re tla tšohla likarolo tsa mantlha tse etsang multilayer FPC PCB le bohlokoa ba tsona lits'ebetsong tsa elektroniki.

1. Substrate e feto-fetohang:

Flexible substrate ke motheo oa multilayer FPC PCB.E fana ka phetoho e hlokahalang le botšepehi ba mochine ho mamella ho kobeha, ho phutha le ho sotha ntle le ho senya ts'ebetso ea elektronike. Ka tloaelo, lisebelisoa tsa polyimide kapa polyester li sebelisoa e le setsi sa motheo ka lebaka la botsitso ba tsona bo botle ba mocheso, ho kenya motlakase, le bokhoni ba ho sebetsana le motsamao o matla.

2. Lera la conductive:

Li-conductive layers ke likarolo tsa bohlokoa ka ho fetisisa tsa multilayer FPC PCB hobane li thusa ho phalla ha matšoao a motlakase potolohong.Likarolo tsena hangata li entsoe ka koporo, e nang le conductivity e ntle ea motlakase le ho hanyetsa kutu. The foil koporo e laminated ho substrate tenyetsehang sebelisa sekhomaretsi, 'me e latelang etching tshebetso e etsoa ho bopa a lakatsa mokhoa oa potoloho.

3. Insulation layer:

Li-insulating layers, tse tsejoang hape e le li-dielectric layers, li behiloe lipakeng tsa li-conductive layers ho thibela lifupi tsa motlakase le ho fana ka ho itšehla thajana.Li entsoe ka lisebelisoa tse fapaneng tse kang epoxy, polyimide kapa solder mask, 'me li na le matla a phahameng a dielectric le botsitso ba mocheso. Likarolo tsena li bapala karolo ea bohlokoa ho boloka botsitso ba matšoao le ho thibela ho kopana lipakeng tsa mesaletsa e haufi ea conductive.

4. Maske a solder:

Mask ea solder ke lera le sireletsang le kentsoeng ho li-conductive le insulating layers tse thibelang li-circuits tse khuts'oane nakong ea solder le ho sireletsa mesaletsa ea koporo ho tsoa linthong tsa tikoloho joalo ka lerōle, mongobo le oxidation.Hangata li tala ka 'mala empa li ka boela tsa hlaha ka mebala e meng e kang e khubelu, e putsoa kapa e ntšo.

5. Sekoahelo:

Coverlay, eo hape e tsejoang e le filimi ea sekoaelo kapa filimi ea sekoaelo, ke lera le sireletsang le kentsoeng bokaholimong bo kantle ba FPC PCB e nang le likarolo tse ngata.E fana ka tšireletso e eketsehileng, tšireletso ea mechine le ho hanyetsa mongobo le litšila tse ling. Likoahelo hangata li na le menyetla ea ho beha likarolo 'me li lumella ho fihlella habonolo ho li-pads.

6. Ho roala koporo:

Copper plating ke mokhoa oa ho etsa electroplating lesela le tšesaane la koporo holim'a lera la conductive.Ts'ebetso ena e thusa ho ntlafatsa ts'ebetso ea motlakase, ho fokotsa sekhahla, le ho ntlafatsa boleng ba sebopeho sa multilayer FPC PCBs. Copper plating e boetse e thusa mesaletsa ea molumo bakeng sa li-circuits tse nang le methapo e phahameng.

7. Ka tsela:

A via ke lesoba le lenyenyane le phuntsoeng ka har'a likarolo tsa conductive tsa FPC PCB ea multilayer, e hokahanyang lera le le leng kapa ho feta hammoho.Li lumella khokahano e otlolohileng 'me li nolofalletsa ho tsamaisa lipontšo lipakeng tsa likarolo tse fapaneng tsa potoloho. Hangata li-Vias li tlatsitsoe ka koporo kapa paste e tsamaisang ho netefatsa hore ho na le khokahanyo e tšepahalang ea motlakase.

8. Lisebelisoa tsa likarolo:

Likarolo tsa likarolo ke libaka tse ho multilayer FPC PCB e etselitsoeng ho hokahanya likarolo tsa elektroniki joalo ka li-resistors, li-capacitor, li-circuits tse kopaneng le lihokelo.Hangata li-pads tsena li entsoe ka koporo 'me li hokahane le mesaletsa ea conductive e ka tlase ho sebelisoa solder kapa sekhomaretsi sa conductive.

Ka kakaretso:

Multilayer flexible printed circuit board (FPC PCB) ke sebopeho se rarahaneng se entsoeng ka likarolo tse 'maloa tsa motheo.Li-substrates tse feto-fetohang, li-conductive layers, li-insulating layers, limaske tsa solder, li-overlays, copper plating, vias le likaroloana tsa likarolo li sebetsa 'moho ho fana ka khokahanyo e hlokahalang ea motlakase, ho tenyetseha ha mochini le ho tšoarella ho hlokoang ke lisebelisoa tsa sejoale-joale tsa elektroniki. Ho utloisisa likarolo tsena tse kholo ho thusa ho rala le ho etsa li-PCB tsa boleng bo holimo tsa multilayer FPC tse fihlelang litlhoko tse thata tsa liindasteri tse fapaneng.