Ho tseba Lipontšo tsa Digital tsa lebelo le phahameng HDI PCB Prototyping

Tsebisa:

Rea u amohela ho Capel's blog, moo sepheo sa rona e leng ho fana ka tataiso e felletseng ea ho etsa li-PCB tsa HDI ka lebelo le holimo. Ka lilemo tse 15 tsa boiphihlelo ba tlhahiso ea boto ea potoloho, sehlopha sa rona se inehetseng sa litsebi se ka u thusa ho tsamaisana le mathata a prototyping le tlhahiso. Re fana ka litšebeletso tsa tekheniki tsa pele ho thekiso le kamora thekiso ho netefatsa khotsofalo e felletseng ea bareki.Sehloohong sena, re tla hlahloba mathata a HDI PCB prototyping, re totobatsa bohlokoa ba matshwao a dijithale a lebelo le phahameng, mme re fane ka lintlha tsa bohlokoa ho u thusa ho ipabola tšimong.

Karolo ea 1: Ho utloisisa Liphello tsa HDI PCB Prototyping

Ho fihlela ts'ebetso le ts'ebetso e nepahetseng, ho bohlokoa ho utloisisa bohlokoa ba prototyping ea HDI PCB lits'ebetsong tse potlakileng tsa dijithale. Li-PCB tsa High-density interconnect (HDI) li etselitsoe ho amohela mekhahlelo e mengata le li-circuits tse rarahaneng, ka tsela eo li matlafatsa botšepehi ba matšoao, ho fokotsa tšitiso, le ho ntlafatsa ts'ebetso ea motlakase. Thepa ena e ba ea bohlokoa le ho feta ha o sebetsana le matshwao a dijithale a lebelo le phahameng, moo esita le meedance e nyane e sa tsamaisaneng kapa ho sotha matshwao ho ka lebisang bobodung kapa tahlehelong ya data.

Karolo ea 2: Lintlha tsa bohlokoa bakeng sa Prototyping HDI PCBs

2.1 Moralo oa Tlhahiso bakeng sa Tlhahiso (DfM)
Design for Manufacturability (DfM) e bapala karolo ea bohlokoa ho prototyping ea HDI PCB. Ho sebetsa haufi-ufi le baqapi ba boto nakong ea mohopolo oa pele ho lumella ho kopanngoa ho se nang moeli ha litlhaloso tsa moralo le bokhoni ba tlhahiso. Ka ho kenyelletsa melao-motheo ea DfM joalo ka ho ntlafatsa bophara ba ho latella, ho khetha lisebelisoa tse nepahetseng, le ho nahana ka ho beoa ha likaroloana, o ka fokotsa mathata a ka bang teng a tlhahiso le ho fokotsa litšenyehelo ka kakaretso.

2.2 Khetho ea thepa
Ho khetha lisebelisoa tse nepahetseng bakeng sa prototypes tsa HDI PCB ho bohlokoa ho fihlela ts'ebetso e nepahetseng ea motlakase le ho ts'epahala. Lisebelisoa tse nang le dielectric tse tlase, thepa e laoloang ea impedance, le litšobotsi tse ntle tsa phatlalatso ea mats'oao li lokela ho batloa. Ho phaella moo, nahana ka ho sebelisa li-laminates tse khethehileng tsa lebelo le phahameng ho laola ka thata botšepehi ba matšoao le ho fokotsa tahlehelo ea matšoao.

2.3 Moralo oa li-stackup le botšepehi ba matšoao
Moralo o nepahetseng oa stackup o ka ama haholo botšepehi ba matšoao le ts'ebetso ka kakaretso. Ho beoa ka lera, botenya ba koporo, le botenya ba dielectric li lokela ho reroa ka hloko ho fokotsa crosstalk, tahlehelo ea matšoao le tšitiso ea motlakase. Ho sebelisa thekenoloji e laoloang ea tsamaiso ea impedance ha u ntse u khomarela litekanyetso tsa indasteri ho thusa ho boloka botšepehi ba matšoao le ho fokotsa maikutlo.

Karolo ea 3: HDI PCB Prototyping Technology

3.1 Ho cheka laser ea Microhole
Li-Microvias li bohlokoa bakeng sa ho fihlella lipotoloho tse phahameng haholo ho li-PCB tsa HDI mme li ka etsoa ka mokhoa o atlehileng ho sebelisoa theknoloji ea ho phunya laser. Ho cheka ka laser ho nolofalletsa taolo e nepahetseng ea boholo, karo-karolelano le boholo ba pad, ho netefatsa likhokahano tse tšepahalang esita le maemong a manyane. Ho sebetsa le moetsi oa PCB ea nang le boiphihlelo joalo ka Capel ho netefatsa ts'ebetso e nepahetseng ea ts'ebetso e rarahaneng ea ho phunya laser.
3.2 Lamination e latellanang
Sequential lamination ke theknoloji ea bohlokoa e sebelisoang ho HDI PCB prototyping process mme e kenyelletsa ho kopanya likarolo tse ngata hammoho. Sena se fana ka monyetla oa hore ho be le tsela e thata, ho fokotsa bolelele ba likhokahano, le ho fokotsa likokoana-hloko. Ka ho sebelisa theknoloji e ncha ea lamination e kang Build-Up Process (BUP), u ka finyella maemo a phahameng ntle le ho senya botšepehi ba matšoao.

Karolo ea 4: Mekhoa e Molemo ka ho Fetisisa ea Botšepehi ba Letšoao la Digithale le Phahameng

4.1 Taolo ea impedance le tlhahlobo ea botšepehi ba matšoao
Ho kenya ts'ebetsong mekhoa ea taolo ea impedance joalo ka mekhoa e laoloang ea impedance le ho tsamaisana le impedance ho bohlokoa ho boloka botšepehi ba matšoao ho meralo e phahameng ea dijithale. Lisebelisoa tse tsoetseng pele tsa ketsiso li ka u thusa ho sekaseka litaba tsa botšepehi ba matšoao, ho tseba liphetoho tse ka bang teng tsa ho sitisa, le ho ntlafatsa sebopeho sa PCB ka nepo.

4.2 Litaelo tsa Tlhahiso ea Pontšo ea Pontšo
Ho latela litataiso tsa moralo oa maemo a indasteri bakeng sa mats'oao a dijithale a lebelo le holimo ho ka ntlafatsa ts'ebetso e akaretsang ea prototype ea hau ea HDI PCB. Mekhoa e meng eo u lokelang ho e hopola ke ho fokotsa li-discontinuities, ho ntlafatsa litsela tsa ho khutla, le ho fokotsa palo ea li-vias libakeng tse lebelo le phahameng. Ho sebetsa le sehlopha sa rona sa lipatlisiso le nts'etsopele se nang le boiphihlelo ho ka u thusa ho latela litataiso tsena ka nepo.

Ha re phethela:

Ho etsa li-PCB tsa HDI tse sebelisang mats'oao a dijithale a lebelo le phahameng ho hloka tlhokomelo e hlokolosi ho lintlha.Ka ho sebelisa tsebo le boiphihlelo ba Capel, o ka nolofatsa lits'ebetso, oa fokotsa likotsi tsa tlhahiso le ho fumana litholoana tse holimo. Hore na o hloka prototyping e potlakileng kapa tlhahiso ea molumo, lisebelisoa tsa rona tsa tlhahiso ea boto ea potoloho li ka fihlela litlhoko tsa hau. Ikopanye le sehlopha sa rona sa litsebi kajeno ho fumana sebaka sa tlholisano lefatšeng le potlakileng la tlhahiso ea matshwao a dijithale a HDI PCB.