nybjtp

Molding Ceramic Circuit Board Substrates: Mekhoa e sebelisoang haholo

Ka poso ena ea blog, re tla sheba mekhoa e atileng haholo e sebelisoang ho bopa li-substrates tsa boto ea potoloho ea ceramic.

Ho bōptjoa ha likaroloana tsa boto ea potoloho ea ceramic ke ts'ebetso ea bohlokoa tlhahisong ea lisebelisoa tsa elektroniki. Li-ceramic substrates li na le botsitso bo botle ba mocheso, matla a phahameng a mochini le katoloso e tlase ea mocheso, e li etsang hore e be tse loketseng lits'ebetso tse kang lisebelisoa tsa motlakase, theknoloji ea LED le lisebelisoa tsa elektroniki tsa likoloi.

Lisebelisoa tsa Ceramic Circuit Board

1. Ho Bopa:

Ho bopa ke e 'ngoe ea mekhoa e sebelisoang haholo ea ho etsa li-substrates tsa ceramic circuit board. E kenyelletsa ho sebelisa mochine oa khatiso oa hydraulic ho hatella phofo ea ceramic hore e be sebopeho se reriloeng esale pele. Phofo e qala ho kopanngoa le li-binders le lisebelisoa tse ling ho ntlafatsa phallo ea eona le polasetiki. Joale motsoako o tšeloa ka mokoting oa hlobo 'me khatello e sebelisoa ho kopanya phofo. Sehlahisoa se hlahisoang se chesoa ka mocheso o phahameng ho tlosa sekontiri le ho kopanya likaroloana tsa ceramic hammoho ho etsa substrate e tiileng.

2. Ho hlahisa:

Tape casting ke mokhoa o mong o tsebahalang oa ho theha substrate ea boto ea potoloho ea ceramic, haholo bakeng sa li-substrate tse tšesaane le tse tenyetsehang. Ka mokhoa ona, slurry ea phofo ea ceramic le solvent e hasana holim'a sebaka se bataletseng, joalo ka filimi ea polasetiki. Joale ho sebelisoa lehare la ngaka kapa rolara ho laola botenya ba slurry. The solvent e fetoha mouoane, e siea tepi e tšesaane e tala, e ka khaolang sebopeho se lakatsehang. Theipi e tala e ntan'o silafatsoa ho tlosa solvent leha e le efe e setseng le binder, e leng se hlahisang substrate e teteaneng ea ceramic.

3. Ho bopa ka ente:

Ente ea ho bopa hangata e sebelisoa bakeng sa ho bopa likarolo tsa polasetiki, empa e ka boela ea sebelisoa bakeng sa likaroloana tsa boto ea potoloho ea ceramic. Mokhoa ona o kenyelletsa ho kenya phofo ea ceramic e kopantsoeng le sekoahelo ka har'a mokopu oa hlobo tlas'a khatello e phahameng. Ka nako eo hlobo e futhumatsoa ho tlosa se tlamang, 'me 'mele o motala o hlahisoang o silafatsoa ho fumana substrate ea ho qetela ea ceramic. Ho bopa ka ente ho fana ka melemo ea lebelo la tlhahiso e potlakileng, li-geometri tsa karolo e rarahaneng le ho nepahala ha maemo a holimo.

4. Extrusion:

Extrusion molding e sebelisoa haholo ho etsa li-substrates tsa ceramic circuit board tse nang le libopeho tse rarahaneng tse nang le likarolo tse fapaneng, tse kang li-tubes kapa li-cylinders. Ts'ebetso e kenyelletsa ho qobella slurry ea polasetiki e entsoeng ka ceramic ka hlobo e nang le sebopeho se batlang. Sehlotšoana se khaola ka bolelele bo lakatsehang ebe se omisoa ho tlosa mongobo leha e le ofe o setseng kapa mokelikeli. Likarolo tse omisitsoeng tse tala li chesoa ho fumana substrate ea ho qetela ea ceramic. Extrusion e nolofalletsa tlhahiso e tsoelang pele ea li-substrates tse nang le litekanyo tse tsitsitseng.

5. Khatiso ea 3D:

Ka ho fihla ha theknoloji ea tlhahiso ea tlatsetso, khatiso ea 3D e fetoha mokhoa o sebetsang oa ho bopa likaroloana tsa boto ea potoloho ea ceramic. Khatisong ea ceramic ea 3D, phofo ea ceramic e kopantsoe le binder ho etsa pente e hatisitsoeng. Joale slurry e behoa lera ka lera, ho latela moralo o entsoeng ke komporo. Ka mor'a ho hatisa, likarolo tse tala li siiloe ho tlosa sekontiri le ho kopanya likaroloana tsa ceramic hammoho ho etsa substrate e tiileng. Khatiso ea 3D e fana ka maemo a bonolo a moralo mme e ka hlahisa li-substrates tse rarahaneng le tse ikhethileng.

Ka bokhutšoane

Ho bōptjoa ha li-substrates tsa boto ea potoloho ea ceramic ho ka phethoa ka mekhoa e fapaneng e kang ho bōpa, ho lahla theipi, ho hlahisa ente, extrusion le khatiso ea 3D. Mokhoa o mong le o mong o na le melemo ea ona, 'me khetho e ipapisitse le lintlha tse kang sebopeho se lakatsehang, sephetho, ho rarahana le litšenyehelo. Khetho ea mokhoa oa ho theha qetellong e etsa qeto ea boleng le ts'ebetso ea substrate ea ceramic, e leng se etsang hore e be mohato oa bohlokoa ts'ebetsong ea tlhahiso ea lisebelisoa tsa elektroniki.


Nako ea poso: Sep-25-2023
  • E fetileng:
  • E 'ngoe:

  • Morao