Tsebisa

A. Profile ea Khampani: lilemo tse 15 tsa phihlelo ho HDI PCB, HDI Flex PCB, HDI e thata-flexible PCB tlhahiso le prototyping

Ka lilemo tse 15 tsa boiphihlelo ba indasteri, k'hamphani ea rona e fetohile moetapele ho High Density Interconnect (HDI) PCB, HDI Flex PCB le HDI Rigid-Flex PCB tlhahiso le prototyping. Boiteko ba rona bo tsoelang pele ba ho qapa le ho fihlela litlhoko tse lulang li fetoha tsa indasteri ea lisebelisoa tsa elektroniki li entse tlhahiso le prototyping ea li-HDI PCB tse nang le mekhahlelo e mengata e le motheo oa botsebi ba rona.

B. Bohlokoa ba ho etsa li-prototyping tse ngata tsa HDI PCB ka lisebelisoa tsa elektroniki

Tlhokahalo ea lisebelisoa tsa elektronike tse nyane, tse bobebe, le tse rarahaneng ho feta e tsamaisa tlhoko ea mahlale a tsoetseng pele a boto ea potoloho (PCB) joalo ka li-multilayer HDI PCB. Liboto tsena li fana ka phetoho e kholo ea moralo, botšepehi bo ntlafetseng ba matšoao le ts'ebetso e ntlafetseng. Ha lisebelisoa tsa elektroniki li ntse li tsoela pele ho fetoha, prototyping ea HDI PCB ea mekhahlelo e mengata e ntse e tsoela pele ho ba bohlokoa ho fihlela litlhoko tsa theknoloji ea sejoale-joale.

Ke engmultilayer HDI PCB?

Multilayer HDI PCB e bua ka boto ea potoloho e hatisitsoeng e nang le likhokahano tse matla haholo le likhoele tse ngata tse hoketsoeng ka li-microvias. Liboto tsena li etselitsoe ho amohela likarolo tsa elektronike tse rarahaneng le tse teteaneng, tse hlahisang sebaka se seholo le ho boloka boima ba 'mele.

Melemo le Melemo ea ho Sebelisa Multilayer HDI PCB Boards in Electronic Applications

Botšepehi bo Ntlafetseng ba Letšoao: Multi-layer HDI PCB e fana ka botšepehi bo phahameng ba pontšo ka lebaka la ho fokotseha ha tahlehelo ea matšoao le tšitiso, e leng se etsang hore e be e loketseng bakeng sa lits'ebetso tsa maqhubu a phahameng.

Miniaturization: Moralo o kopaneng oa li-PCB tsa HDI tse nang le likarolo tse ngata o nolofalletsa lisebelisoa tsa elektroniki tse nyane, ho lumella bahlahisi ho etsa lihlahisoa tse nyane, tse nkehang habonolo.

Botšepehi bo ntlafetseng: Tšebeliso ea microvias le theknoloji e tsoetseng pele ea ho hokahanya e ntlafatsa ho tšepahala ha li-PCB tse ngata tsa HDI, ho thusa ho ntlafatsa tshebetso le bophelo ba tšebeletso ea lisebelisoa tsa elektronike.

Likopo le liindasteri tse ruang molemo ho theknoloji ea boto ea potoloho ea HDI PCB e nang le mefuta e mengata

Li-PCB tsa Multilayer HDI li sebelisoa haholo liindastering tse ngata, ho kenyeletsoa likhokahano tsa mehala, likoloi, sefofane, lisebelisoa tsa bongaka, lisebelisoa tsa elektroniki tsa bareki le tse ling. Liboto tsena li loketse ka ho khetheha bakeng sa lits'ebetso tse potlakileng le tse phahameng haholo moo botšepehi ba matšoao le lithibelo tsa sebaka e leng lintlha tsa bohlokoa.

Multilayer HDI PCB prototyping process

A. Tataiso ea mohato ka mohato bakeng sa ts'ebetso ea prototyping ea HDI PCB ea mekhahlelo e mengata

Ts'ebetso ea prototyping ea multilayer HDI PCB e kenyelletsa mehato e 'maloa ea bohlokoa, ho kenyelletsa netefatso ea moralo, khetho ea thepa, moralo oa li-stackup, ho cheka microvia, le tlhahlobo ea motlakase. Mohato o mong le o mong o na le karolo ea bohlokoa ho netefatseng hore prototype e sebetsa hantle ebile e sebetsa.

B. Mekhoa e metle le menahano bakeng sa prototyping ea HDI PCB ea mekhahlelo e mengata

Ho atleha ha multilayer HDI PCB prototyping ho hloka tlhokomelo e hlokolosi ho litataiso tsa moralo, khetho ea thepa le lits'ebetso tsa tlhahiso. Ho khomarela mekhoa e metle le ho nahana ka lintlha tse kang botšepehi ba matšoao, tsamaiso ea mocheso, le bokhoni ba ho etsa lihlahisoa ho bohlokoa ho finyella li-prototypes tsa boleng bo phahameng.

C. Bohlokoa ba ho Sebelisana le Moetsi ea Hlomphehang bakeng sa Prototyping

Ho sebetsa le moetsi ea nang le boiphihlelo le ea nang le botumo bo botle bakeng sa prototyping ea liboto tse ngata tsa layer HDI ho bohlokoa ho netefatsa katleho ea morero oa hau. Baetsi ba nang le boiphihlelo bo netefalitsoeng ba ka fana ka leseli la bohlokoa, tšehetso ea tekheniki le lits'ebeletso tse sebetsang tsa prototyping ho ntlafatsa ts'ebetso ea sehlahisoa le ho potlakisa nako ea ho rekisa.

Multilayer HDI PCB ts'ebetso ea tlhahiso

A. Kakaretso ea Multilayer HDI PCB Manufacturing Process

Ts'ebetso ea tlhahiso ea liboto tsa potoloho tse hatisitsoeng tsa HDI tse nang le mekhahlelo e mengata e kenyelletsa mekhahlelo e 'maloa ea bohlokoa, ho kenyelletsa le ho kenya moralo, ho lokisoa ha thepa, ho nka litšoantšo, ho phunya, ho penta, ho qoelisoa, ho lamination le tlhahlobo ea ho qetela. Mokhahlelo o mong le o mong o etsoa ka hloko ho latela maemo a thata a boleng le litlhoko tsa moralo.

B. Lintlha tsa bohlokoa tse lokelang ho nahanoa bakeng sa tlhahiso e atlehileng ea li-multi-layer HDI PCB

Lintlha tse kang ho rarahana ha moralo, khetho ea thepa, bokhoni ba ho etsa tlhahiso le taolo ea boleng ke lintlha tsa bohlokoa bakeng sa tlhahiso e atlehileng ea li-PCB tsa HDI tse ngata. Puisano e nepahetseng pakeng tsa baenjiniere ba meralo le litsebi tsa tlhahiso e bohlokoa ho rarolla mathata afe kapa afe a ka bang teng le ho netefatsa hore ts'ebetso ea tlhahiso e tsamaea hantle.

C. Theknoloji le mekhoa e sebelisoang tlhahisong ea li-multi-layer HDI PCB

Li-PCB tsa Multilayer HDI hangata li hlahisoa ho sebelisoa mekhoa e tsoetseng pele ea tlhahiso, ho kenyeletsoa ho cheka ka laser, lamination e latellanang, automated Optical inspection (AOI), le tlhahlobo e laoloang ea impedance. Litheknoloji tsena li nolofalletsa tlhahiso e nepahetseng le mehato e tiileng ea taolo ea boleng.

Khetho e Nepahetseng ea Multilayer HDI Printed Circuit Board Prototyping le Manufacturing Manufacturer

A. Litšobotsi tseo bahlahisi ba li-multi-layer HDI PCB ba lokelang ho ba le tsona

Ho khetha moetsi ea nepahetseng bakeng sa prototyping le tlhahiso ea multilayer HDI PCB ho hloka ho lekola litšoaneleho tsa bohlokoa joalo ka boitseanape ba tekheniki, bokhoni ba tlhahiso, lits'ebetso tsa netefatso ea boleng, le tšehetso ea bareki. Moetsi ea tšepahalang o lokela ho bonts'a rekoto ea merero e atlehileng le bokhoni ba ho fihlela litlhoko tse ikhethang tsa projeke.

B. Liphuputso le lipale tsa katleho ea ho sebetsa le bahlahisi ba hlomphehang

Lithuto le lipale tsa katleho tsa ho sebetsa le bahlahisi ba nang le botumo bo botle ba multilayer HDI PCB li fana ka lintlha tsa bohlokoa mabapi le bokhoni le ts'ebetso ea moetsi. Mehlala ea 'nete ea lefats'e e ka bonts'a bokhoni ba moetsi ba ho hlola mathata, ho fana ka lihlahisoa tsa boleng bo holimo, le ho tšehetsa katleho ea projeke ea bareki.

C. Mokhoa oa ho hlahloba le ho khetha moetsi ea molemo ka ho fetisisa bakeng sa litlhoko tsa hau tsa multilayer HDI PCB

Ha ho lekoa bao e ka bang bahlahisi ba prototyping le tlhahiso ea multilayer HDI PCB, lintlha tse joalo ka botsebi ba tekheniki, maemo a boleng, bokhoni ba tlhahiso, linako tse etellang pele, le mecha ea puisano li tlameha ho nahanoa. Ho etsa tlhahlobo e felletseng le ho kopa likhothaletso tse felletseng ho ka thusa ho tseba hore na moetsi o loketse hantle litlhoko tse itseng tsa projeke.

Multilayer HDI Printed Circuit Board Fabrication Process

Ka kakaretso

K. Tlhahlobo ea Bohlokoa ba Multilayer HDI PCBs le Prototyping/Manufacturing Processes Bohlokoa ba multilayer HDI PCBs le mekhoa ea bona ea ho etsa prototyping/tlhahiso mabapi le ho fihlela litlhoko tse lulang li fetoha tsa lisebelisoa tsa sejoale-joale tsa elektroniki. Liboto tsena li fana ka motheo oa boiqapelo le ho thusa ho nts'etsapele lihlahisoa tsa elektroniki tse tsoetseng pele.

B. Mehopolo ea ho Qetela ka Tšusumetso ea ho Sebelisana le Moetsi ea nang le Boiphihlelo Tšusumetso ea ho sebetsa le moetsi ea nang le phihlelo bakeng sa mefuta e mengata ea li-prototyping tsa HDI PCB le tlhahiso e tebileng. E nolofalletsa moralo oa sehlahisoa o atlehileng, ts'ebetso e ntlafetseng le nako e potlakileng ea ho rekisa.

C. Ho letsetsa babali ho tseba haholoanyane ka lits'ebeletso tsa prototyping le tlhahiso ea HDI PCB ea mefuta-futa e fanoang ke k'hamphani Re memela babali ho hlahloba lits'ebeletso tsa rona tsa ho etsa litšoantšo tsa HDI PCB tse nang le likarolo tse ngata, tse tšehelitsoeng ke boiphihlelo ba lilemo tsa rona, boitseanape, le Boitlamo ba bokgabane.

Ka ho sebelisana le rona, o ka sebelisa matla a theknoloji e tsoetseng pele ea PCB ho tlisa hau

liqapi tse ncha tsa elektroniki bophelong.

Ka bokhuts'oane, bohlokoa ba multilayer HDI PCB prototyping le tlhahiso 'marakeng oa kajeno oa lisebelisoa tsa elektroniki bo ke ke ba fetisoa. Ha lisebelisoa li ntse li fokola, li fokola, 'me li rarahana le ho feta, tlhoko ea mahlale a tsoetseng pele a PCB joalo ka li-multilayer HDI PCB e ntse e hola. Ka ho utloisisa ho rarahana ha prototyping le mokhoa oa ho etsa le ho khetha moetsi ea tšepahalang, lik'hamphani li ka sebelisa melemo ea li-PCB tsa HDI tse ngata ho tsamaisa tlhahiso ea lihlahisoa le monyetla oa tlholisano indastering ea lisebelisoa tsa elektroniki. Re mema babali ho hlahloba mefuta ea rona e felletseng ea lits'ebeletso tsa prototyping le tlhahiso ea HDI PCB ea mekhahlelo e mengata, e tšehelitsoeng ke boiphihlelo ba rona ba lilemo, boiphihlelo ba botekgeniki le boitlamo ba ho sebetsa hantle. Ka ho sebelisana 'moho le rona, u ka sebelisa matla a theknoloji e tsoetseng pele ea PCB ho etsa hore meralo ea hau e ncha ea elektroniki e phele.