Thibelo ea Rigid-Flex PCB Delamination: Maano a Sebetsang a ho netefatsa Boleng le ho Tšepahala.

Selelekela

Ka poso ena ea blog, re tla tšohla maano a sebetsang le mekhoa e metle ea indasteri ea ho thibela delamination ea PCB e thata, ka ho etsa joalo e sireletse lisebelisoa tsa hau tsa elektroniki ho se atleheng.

Delamination ke taba e mahlonoko eo hangata e hlaselang liboto tsa potoloho tse hatisitsoeng tse thata-flex (PCBs) nakong ea bophelo ba bona ba ts'ebeletso.Ketsahalo ena e bua ka karohano ea likarolo ho PCB, e bakang likhokahano tse fokolang le ho hloleha ha likarolo tse ka bang teng.Joaloka moetsi kapa moqapi, ho bohlokoa ho utloisisa lisosa tsa delamination le ho nka mehato ea thibelo ho netefatsa botsitso le ts'epahalo ea nako e telele ea PCB ea hau.

I. Utloisisa delamination ka rigid-flex PCB

Delamination e bakoa ke lintlha tse fapaneng nakong ea ho etsa, ho bokana le ho sebetsana le mekhahlelo ea li-PCB tse thata-flex.Khatello ea mocheso, ho monya mongobo le khetho e sa lokelang ea thepa ke lisosa tse tloaelehileng tsa delamination.Ho lemoha le ho utloisisa lisosa tsena ke habohlokoa ho theha mekhoa e sebetsang ea thibelo.

1. Khatello ea mocheso: Coefficient of thermal expansion (CTE) ho se lumellane pakeng tsa lisebelisoa tse fapaneng ho ka lebisa khatellong e feteletseng nakong ea libaesekele tse futhumetseng, tse lebisang ho delamination.Ha PCB e e-na le liphetoho tsa mocheso, lihlopha li atoloha 'me li konteraka ka litekanyetso tse fapaneng, li baka tsitsipano pakeng tsa bona.

2. Ho monya mongobo: PCB e tenyetsehang e thata e atisa ho pepesehela maemo a mongobo o phahameng 'me e monya mongobo habonolo.Limolek'hule tsa metsi li ka kenella ka holim'a boto ka li-microcracks, li-voids, kapa liphaephe tse koetsoeng hantle, tse bakang keketseho ea lehae, ho ruruha, 'me qetellong ho putlama.

3. Khetho ea Lintho: Ho ela hloko thepa ea thepa ho bohlokoa ho thibela delamination.Ho bohlokoa ho khetha laminate e nepahetseng, sekhomaretsi le kalafo ea holim'a metsi ho fana ka monyetla o tlase oa mongobo le botsitso bo nepahetseng ba mocheso.

2. Mekhoa ea ho thibela delamination

Kaha joale rea utloisisa hore na hobaneng, ha re hlahlobeng maano a bohlokoa a ho thibela delamination ea PCB e thata:

1. Lintlha tse nepahetseng tsa moralo:
a) Fokotsa botenya ba koporo:Botenya bo feteletseng ba koporo bo baka khatello e kholo nakong ea libaesekele tse futhumetseng.Ka hona, ho sebelisa bonyane bo hlokahalang koporo botenya eketsa PCB tenyetsehang le ho fokotsa kotsi ea delamination.

b) Sebopeho sa lera le leka-lekaneng:Ikitlaelletse kabo e tšoanang ea likarolo tsa koporo ka har'a likarolo tse thata le tse tenyetsehang tsa PCB.Ho leka-lekana ho nepahetseng ho thusa ho boloka ho atolosoa ha mocheso oa symmetrical le ho fokotseha, ho fokotsa monyetla oa delamination.

c) Maikutlo a Laolang:Kenya ts'ebetsong mamello e laoloang ka boholo ba lesoba, ka bophara le bophara ba trace ho netefatsa hore likhatello nakong ea liphetoho tsa mocheso li ajoa ka ho lekana ho pholletsa le PCB.

d) Lithapa le likhoele:Li-fillet li fokotsa lintlha tsa khatello ea maikutlo, li thusa ho fihlela phetoho e bonolo le ho fokotsa monyetla oa delamination.

2. Khetho ea lintho tse bonahalang:
a) High Tg Laminates:Khetha li-laminate tse nang le mocheso o phahameng oa phetoho ea likhalase (Tg) kaha li fana ka khanyetso e ntle ea mocheso, li fokotsa ho se lumellane ha CTE lipakeng tsa lisebelisoa, 'me li fokotsa ts'ebetso ea ho palama libaesekele tse futhumatsang kotsi.

b) Lisebelisoa tsa CTE tse tlase:Khetha lisebelisoa tse nang le boleng bo tlase ba CTE ho fokotsa ho se lumellane ha katoloso ea mocheso lipakeng tsa likarolo tse fapaneng, ka hona ho fokotsa khatello ea maikutlo le ho ntlafatsa ts'epo ka kakaretso ea li-PCB tse thata-flex.

c) Lisebelisoa tse thibelang mongobo:Khetha lisebelisoa tse nang le mongobo o tlase ho fokotsa kotsi ea delamination ka lebaka la ho monya mongobo.Nahana ka ho sebelisa lirafshoa tse khethehileng kapa li-sealants ho sireletsa libaka tse tlokotsing tsa PCB ho kenella ha mongobo.

3. Mekhoa e Matla ea Tlhahiso:
a) Tšitiso e Laolehileng:Kenya ts'ebetso ea ho etsa ts'ebetso e laoloang ho fokotsa liphetoho tsa khatello ea maikutlo ho PCB nakong ea ts'ebetso, ka hona ho fokotsa kotsi ea delamination.

b) Polokelo e Nepahetseng le Tšoaro:Boloka le ho tšoara li-PCB sebakeng se laoloang se nang le mongobo o laoloang ho thibela ho monya mongobo le litaba tse amanang le delamination.

c) Teko le Tlhahlobo:Liteko tse matla le lits'ebetso tsa tlhahlobo li etsoa ho bona bofokoli bofe kapa bofe bo ka hlahang bo ka bakang delamination.Ho kenya ts'ebetsong mekhoa ea tlhahlobo e sa senyeheng joalo ka ho palama baesekele e futhumatsang, microsectioning, le scanning acoustic microscopy ho ka thusa ho lemoha delaminations e patiloeng esale pele.

Qetello

Ho thibela delamination ea li-PCB tse thata-thata ho bohlokoa ho netefatsa hore li phela nako e telele le ts'ebetso e tšepahalang.O ka fokotsa kotsi ea delamination ka ho utloisisa lisosa le ho nka mehato e nepahetseng nakong ea moralo, khetho ea thepa le tlhahiso.Ho kenya ts'ebetsong tsamaiso e nepahetseng ea mocheso, ho sebelisa thepa e nang le thepa e nepahetseng, ho sebelisa mekhoa e matla ea tlhahiso, le ho etsa liteko tse phethahetseng ho ka ntlafatsa haholo boleng le botšepehi ba li-PCB tse thata-thata.Ka ho latela maqheka ana le ho lula u le morao-rao mabapi le tsoelo-pele ea morao-rao ea thepa le theknoloji ea tlhahiso, u ka etsa bonnete ba tsoelo-pele e atlehileng ea li-PCB tse tšoarellang le tse tšepahalang tse tlatsetsang botsitso le botšepehi ba lisebelisoa tsa hau tsa elektroniki.