Delamination ke taba ea bohlokoa tšimong ea liboto tsa potoloho tse hatisitsoeng tse thata-flex (PCBs). E bua ka karohano kapa ho arohana ha likarolo ka har'a PCB, e ka amang ts'ebetso le ts'epahalo ea eona hampe. Delamination e ka bakoa ke lintlha tse fapaneng, ho kenyelletsa le mathata nakong ea tlhahiso ea PCB, mekhoa e sa lokelang ea kopano, le ho ts'oara PCB ka nepo.
Sengoliloeng sena, sepheo sa rona ke ho tebela ka botebo mabaka a entseng hore ho be le delamination ea liboto tse rigid-flex le ho hlahloba mekhoa e sebetsang ea ho thibela bothata bona. Ka ho utloisisa sesosa le ho nka mehato e nepahetseng ea thibelo, bahlahisi le basebelisi ba ka ntlafatsa ts'ebetso ea PCB le ho fokotsa kotsi ea delamination. Ho feta moo, re tla tšohla maano a phokotso ea ho sebetsana le delamination (haeba e etsahala) le ho netefatsa hore PCB e tsoela pele ho sebetsa hantle. Ka tsebo e nepahetseng le katamelo, delamination e ka fokotsoa, ea eketsa ts'ebetso le nako ea bophelo eali-PCB tse thata-flex.
1. Utloisisa mabaka a stratification:
Delamination e ka hlahisoa ke lintlha tse fapaneng, ho kenyelletsa khetho ea thepa, ts'ebetso ea tlhahiso, tikoloho
maemo, le khatello ea mochine. Ho lemoha le ho utloisisa lisosa tsena ke habohlokoa ho phethahatsa ka nepo
mehato ea thibelo. Lisosa tse ling tse tloaelehileng tsa delamination ka liboto tse rigid-flex li kenyelletsa:
Phekolo e sa lekaneng ea holim'a metsi ke e 'ngoe ea mabaka a ka sehloohong a delamination ea mapolanka a rigid-flex. Ho hloekisoa ho sa lekaneng le ho tlosoa ha litšila ho ka thibela maqhama a nepahetseng pakeng tsa lihlopha, ho fella ka litlamo tse fokolang le karohano e ka bang teng. Ka hona, ho lokisoa ka botlalo holim'a metsi, ho kenyelletsa ho hloekisa le ho tlosa litšila, ho bohlokoa ho netefatsa tlamahano e nepahetseng le ho thibela delamination.
Khetho e fosahetseng ea thepa ke ntlha e 'ngoe ea bohlokoa e lebisang ho delamination. Ho khetha lisebelisoa tse sa lumellaneng kapa tsa boleng bo tlaase ho ka baka phapang pakeng tsa li-coefficients tsa ho atolosa mocheso pakeng tsa lihlopha le ho se lumellane ha lintho tse sa lekaneng. Phapang ena ea thepa e baka khatello ea maikutlo le khatello nakong ea libaesekele tse futhumetseng, e leng se etsang hore likarolo li arohane. Ho nahanela ka hloko ha lisebelisoa le thepa ea tsona nakong ea moralo ho bohlokoa ho fokotsa kotsi ea delamination.
Ntle le moo, pheko e sa lekaneng kapa tlamahano nakong ea tlhahiso e ka lebisa ho delamination. Sena se ka etsahala ha li-adhesives tse sebelisoang ts'ebetsong ea lamination li sa phekoloe ka ho lekaneng kapa mekhoa e fosahetseng ea ho kopanya e sebelisoa. Pheko e sa phethehang kapa ho sekama ha li-interlayer tse fokolang ho ka lebisa likhokahanong tse sa tsitsang, tse ka lebisang ho delamination. Ka hona, taolo e nepahetseng ea mocheso, khatello le nako nakong ea lamination ke ea bohlokoa ho tiisa maqhama a matla le a tsitsitseng.
Liphetoho tsa mocheso le mongobo nakong ea tlhahiso, kopano, le ts'ebetso le tsona e ka ba litlatsetso tsa bohlokoa ho delamination. Ho feto-fetoha ho hoholo ha mocheso le mongobo ho ka etsa hore PCB e hole kapa e monye mongobo ka mocheso, e bakang khatello ea maikutlo mme e ka lebisa ho delamination. Ho fokotsa sena, maemo a tikoloho a tlameha ho laoloa le ho ntlafatsoa ho fokotsa litlamorao tsa liphetoho tsa mocheso le mongobo.
Qetellong, khatello ea maikutlo nakong ea ho ts'oaroa kapa ho bokana e ka fokolisa maqhama lipakeng tsa mekhahlelo mme ea lebisa ho delamination. Ho ts'oaroa ka mokhoa o sa nepahalang, ho kobeha, kapa ho feta meeli ea moralo oa PCB ho ka beha PCB khatellong ea mochini e fetang matla a bond ea interlayer. Ho thibela delamination, mekhoa e nepahetseng ea ho sebetsana le eona e lokela ho lateloa mme PCB ha ea lokela ho ba tlas'a khatello e feteletseng kapa khatello ea maikutlo ho feta meeli e reriloeng.
ho utloisisa mabaka a delamination kapa delamination ea rigid-flex board ho bohlokoa ho kenya ts'ebetsong mehato e nepahetseng ea thibelo. Ho se lokisetsoe hantle ka holim'a metsi, khetho e mpe ea thepa, ho folisa kapa ho tlamahanngoa ho sa lekaneng, ho fetoha ha mocheso le mongobo, le khatello ea mochine nakong ea ho tšoara kapa ho kopanya ke lisosa tse ling tse tloaelehileng tsa delamination. Ka ho sebetsana le lisosa tsena le ho sebelisa mekhoa e nepahetseng nakong ea ho etsa, ho bokana le ho sebetsana le mekhahlelo, kotsi ea delamination e ka fokotsoa, ka hona ea ntlafatsa ts'ebetso le ts'epahalo ea li-PCB tse thata-thata.
2.Mekhoa ea ho thibela lera:
Ho thibela delamination ea mapolanka rigid-flex ho hloka mokhoa o nang le likarolo tse ngata, ho kenyelletsa le ho nahana ka moralo, thepa
khetho,mekhoa ea tlhahiso, le ho tshwara hantle. Mekhoa e meng e atlehang ea thibelo e kenyelletsa
Lintlha tsa moralo li phetha karolo ea bohlokoa ho thibela delamination. Mohaho o hlophisitsoeng hantle oa PCB o fokotsa khatello ea maikutlo libakeng tse bobebe mme o ts'ehetsa radii e nepahetseng ea bend, ho fokotsa monyetla oa delamination. Ho bohlokoa ho nahana ka likhatello tsa mochini le tsa mocheso tseo PCB e ka bang le tsona nakong ea bophelo ba eona. Ho sebelisa li-vias tse thekeselang kapa tse thekeselang lipakeng tsa mekhahlelo e haufi ho ka fana ka botsitso bo eketsehileng ba mochini le ho fokotsa lintlha tsa khatello ea maikutlo. Mokhoa ona o tsamaisa khatello ea maikutlo ka mokhoa o ts'oanang ho PCB, ho fokotsa kotsi ea delamination. Ho feta moo, ho sebelisa lifofane tsa koporo moralong ho ka thusa ho ntlafatsa ho khomarela le ho qhala mocheso, ka katleho ho fokotsa monyetla oa ho senya.
Khetho ea thepa ke ntlha e 'ngoe ea bohlokoa ea ho thibela delamination. Ho bohlokoa ho khetha lisebelisoa tse nang le li-coefficients tse ts'oanang tsa katoloso ea mocheso (CTE) bakeng sa likarolo tsa mantlha le tse flex. Lisebelisoa tse nang le li-CTE tse sa lumellaneng li ka ba le khatello ea maikutlo nakong ea liphetoho tsa mocheso, tse lebisang ho delamination. Ka hona, ho khetha lisebelisoa tse bontšang ho lumellana ho ea ka litšobotsi tsa ho atolosa mocheso ho ka thusa ho fokotsa khatello ea kelello le ho fokotsa kotsi ea delamination. Ho phaella moo, ho khetha li-adhesives tsa boleng bo phahameng le li-laminate tse etselitsoeng ka ho khetheha bakeng sa mapolanka a thata-thata ho tiisa maqhama a matla le botsitso bo thibelang delamination ka nako.
Ts'ebetso ea tlhahiso e phetha karolo ea bohlokoa ho thibela delamination. Ho boloka mocheso o nepahetseng le taolo ea khatello nakong ea lamination ke habohlokoa ho finyella maqhama a lekaneng pakeng tsa lihlopha. Ho kheloha ho tloha linakong le maemo a khothaletsoang ho ka senya matla a bonto ea PCB le bots'epehi, 'me ho eketsa monyetla oa delamination. Ka hona, ho khomarela ka tieo mokhoa o khothaletsoang oa ho folisa ho bohlokoa. Ho etsa li-automation ho thusa ho ntlafatsa ho tsitsisa le ho fokotsa kotsi ea phoso ea motho, ho netefatsa hore mokhoa oa lamination o etsoa ka nepo.
Taolo ea tikoloho ke ntlha e 'ngoe ea bohlokoa ho thibela delamination. Ho theha tikoloho e laoloang nakong ea tlhahiso e thata-flex, ho boloka le ho ts'oaroa ho ka fokotsa liphetoho tsa mocheso le mongobo tse ka lebisang ho delamination. Li-PCB li tsotella maemo a tikoloho, 'me ho fetoha ha mocheso le mongobo ho baka khatello ea maikutlo le khatello e ka lebisang ho delamination. Ho boloka tikoloho e laoloang le e tsitsitseng nakong ea tlhahiso le polokelo ea PCB ho fokotsa kotsi ea delamination. Maemo a nepahetseng a polokelo, joalo ka ho laola maemo a mocheso le mongobo, le ona a bohlokoa ho boloka botšepehi ba PCB.
Ho sebetsana hantle le ho laola khatello ea kelello ho bohlokoa ho thibela delamination. Basebeletsi ba amehang ts'ebetsong ea PCB ba lokela ho fumana koetliso e nepahetseng le ho latela mekhoa e nepahetseng ea ho fokotsa kotsi ea delamination ka lebaka la khatello ea kelello ea mochine. Qoba ho kobeha kapa ho kobeha ho feteletseng nakong ea kopano, ho kenya kapa ho lokisa. Khatello ea mechine e fetang meeli ea moralo oa PCB e ka fokolisa maqhama pakeng tsa lihlopha, e leng se lebisang ho delamination. Ho kenya ts'ebetsong mehato ea ts'ireletso, joalo ka ho sebelisa mekotla ea anti-static kapa lipalete tse patiloeng nakong ea polokelo le lipalangoang, ho ka fokotsa kotsi ea tšenyo le delamination.
Ho thibela delamination ea liboto tse rigid-flex ho hloka mokhoa o felletseng o kenyelletsang menahano ea moralo, khetho ea thepa, lits'ebetso tsa tlhahiso, le ts'ebetso e nepahetseng. Ho theha sebopeho sa PCB ho fokotsa khatello ea maikutlo, ho khetha lisebelisoa tse lumellanang le li-CTE tse tšoanang, ho boloka mocheso o nepahetseng le taolo ea khatello nakong ea tlhahiso, ho theha tikoloho e laoloang, le ho kenya ts'ebetsong mekhoa e nepahetseng ea ho sebetsana le khatello ea kelello kaofela ke mekhoa e sebetsang ea thibelo. Ka ho sebelisa mekhoa ena, kotsi ea delamination e ka fokotsoa haholo, ho netefatsa ts'epo le ts'ebetso ea nako e telele ea li-PCB tse thata-flex.
3.Leano la ho Fokotsa Layered:
Leha ho na le mehato ea boits'ireletso, ka linako tse ling li-PCB li ba le delamination. Leha ho le joalo, ho na le mekhoa e mengata ea ho fokotsa
e ka sebelisoang ho rarolla bothata le ho fokotsa phello ea eona. Mekhoa ena e kenyelletsa ho tsebahatsa le ho hlahloba,
mekhoa ea ho lokisa delamination, liphetoho tsa moralo, le tšebelisano 'moho le baetsi ba PCB.
Ho tsebahatsa le ho hlahloba ho bapala karolo ea bohlokoa ho fokotseng delamination. Ho hlahlojoa khafetsa le liteko ho ka thusa ho lemoha delamination kapele e le hore mehato e ka nkuoa ka nako. Mekhoa ea tlhahlobo e sa senyeheng joalo ka x-ray kapa thermography e ka fana ka tlhahlobo e qaqileng ea libaka tse ka bang teng delamination, e nolofaletsa ho lokisa mathata pele e ka ba bothata. Ka ho lemoha delamination pele ho nako, mehato e ka nkoa ho thibela tšenyo e eketsehileng le ho netefatsa botšepehi ba PCB.
Ho itšetlehile ka tekanyo ea delamination, mekhoa ea ho lokisa delamination e ka sebelisoa. Mekhoa ena e etselitsoe ho matlafatsa libaka tse fokolang le ho tsosolosa botšepehi ba PCB. Khetho e ncha e kenyelletsa ho tlosoa ka hloko le ho nkela likarolo tse senyehileng tsa PCB ho felisa delamination. Ente ea sekhomaretsi ke mokhoa o mong moo likhomaretsi tse khethehileng li kenngoeng libakeng tse senyehileng ho ntlafatsa maqhama le ho khutlisa botsitso ba sebopeho. Surface soldering e ka boela ea sebelisoa ho kopanya delaminations, ka hona ho matlafatsa PCB. Mekhoa ena ea ho lokisa e sebetsa hantle ho sebetsana le delamination le ho thibela tšenyo e eketsehileng.
Haeba delamination e fetoha bothata bo iphetang, ho ka etsoa liphetoho tsa moralo ho fokotsa bothata. Ho fetola moralo oa PCB ke mokhoa o sebetsang oa ho thibela delamination hore e se ke ea etsahala pele. Sena se kanna sa kenyelletsa ho fetola sebopeho sa "stack" ka ho sebelisa lisebelisoa kapa lipina tse fapaneng, ho lokisa botenya ba lera ho fokotsa khatello ea maikutlo le khatello ea maikutlo, kapa ho kenyelletsa lisebelisoa tse ling tse matlafatsang libakeng tse mahlonoko tseo ho leng bonolo ho li etsa. Liphetoho tsa moralo li lokela ho etsoa ka tšebelisano 'moho le litsebi ho netefatsa tharollo e molemohali ea ho thibela delamination.
Tšebelisano 'moho le moetsi oa PCB ke ea bohlokoa ho fokotsa delamination. Ho theha puisano e bulehileng le ho arolelana lintlha mabapi le lits'ebetso tse ikhethileng, tikoloho le litlhoko tsa ts'ebetso ho ka thusa bahlahisi ho ntlafatsa lits'ebetso le lisebelisoa tsa bona ka nepo. Ho sebetsa le bahlahisi ba nang le tsebo e tebileng le botsebi mabapi le tlhahiso ea PCB, litaba tsa delamination li ka rarolloa ka katleho. Ba ka fana ka leseli la bohlokoa, ba fana ka maikutlo a liphetoho, ba khothaletsa lisebelisoa tse nepahetseng, 'me ba sebelisa mekhoa e ikhethang ea tlhahiso ho thibela delamination.
Maano a phokotso ea delamination a ka thusa ho rarolla mathata a delamination ho li-PCB. Ho tsebahatsa le ho hlahloba ka liteko tse tloaelehileng le mekhoa e sa senyeheng ho bohlokoa bakeng sa ho lemoha kapele. Mekhoa ea ho lokisa delamination joalo ka ho khetha bocha, ente ea sekhomaretsi, le solder ea holim'a metsi e ka sebelisoa ho matlafatsa libaka tse fokolang le ho khutlisa botšepehi ba PCB. Liphetoho tsa moralo le tsona li ka etsoa ka ts'ebelisano 'moho le litsebi ho thibela delamination hore e se ke ea etsahala. Qetellong, ho sebetsa le moetsi oa PCB ho ka fana ka tlhahiso ea bohlokoa le ho ntlafatsa lits'ebetso le lisebelisoa ho rarolla mathata a delamination ka nepo. Ka ho kenya ts'ebetsong maano ana, litlamorao tsa delamination li ka fokotsoa, ho netefatsa ts'epo le ts'ebetso ea PCB.
Delamination ea rigid-flex boards e ka ba le litlamorao tse tebileng bakeng sa ts'ebetso le ts'epahalo ea lisebelisoa tsa elektroniki. Ho utloisisa sesosa le ho kenya ts'ebetsong mekhoa e sebetsang ea thibelo ho bohlokoa ho boloka botšepehi ba PCB.Lintlha tse joalo ka khetho ea thepa, lits'ebetso tsa tlhahiso, taolo ea tikoloho le ts'ebetso e nepahetseng kaofela li phetha karolo ea bohlokoa ho fokotsa likotsi tse amanang le delamination. Kotsi ea delamination e ka fokotsoa haholo ka ho nahana ka litataiso tsa moralo, ho khetha lisebelisoa tse nepahetseng, le ho kenya tšebetsong ts'ebetso e laoloang ea tlhahiso. Ho feta moo, litlhahlobo tse sebetsang hantle, litokiso tse nakong, le tšebelisano 'moho le litsebi li ka thusa ho rarolla mathata a delamination le ho netefatsa ts'ebetso e tšepahalang ea li-PCB tse sa fetoheng tse fapaneng lits'ebetsong tse fapaneng tsa elektroniki.
Nako ea poso: Aug-31-2023
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