Smart Grid System PCB Prototyping: Tataiso e Pharalletseng

Tsebisa:

Ha lefatše le ntse le habile bokamosong bo tsitsitseng ba matla, bohlokoa ba litsamaiso tse bohlale tsa grid bo bonahala ho feta neng kapa neng. Litsamaiso tsena li sebelisa theknoloji e tsoetseng pele ho ntlafatsa kabo ea matla, ho beha leihlo tšebeliso ea matla le ho netefatsa taolo e nepahetseng ea matla. Bohareng ba litsamaiso tsena tsa marang-rang tse bohlale ke karolo ea bohlokoa: boto ea potoloho e hatisitsoeng (PCB).Ho blog ena, re tla ikakhela ka setotsoana mehopolong e tšoanang bakeng sa prototyping ea PCB maemong a litsamaiso tse bohlale tsa grid, ho lekola mathata le litlamorao tsa tsona.

1. Moralo oa ho tšepahala le oa ho tšoarella:

Litsamaiso tse bohlale tsa grid hangata li sebetsa khafetsa libakeng tse thata. Ka hona, ho ts'epahala le ho tšoarella e ba lintlha tsa bohlokoa tse lokelang ho nahanoa ha ho etsoa li-prototypes tsa PCB bakeng sa litsamaiso tse joalo. Lisebelisoa li tlameha ho khethoa ka hloko ho mamella khatello ea mocheso, ho thothomela le mongobo. Mekhoa ea soldering, li-coatings tse lumellanang le li-encapsulation le tsona li ka sebelisoa ho eketsa bophelo ba PCB.

2. Matla le botšepehi ba pontšo:

Lits'ebetsong tse bohlale tsa marang-rang, li-PCB li etsa mesebetsi e mengata e kang ho lokisa matla, likhokahano tsa data, le ho utloa. Bakeng sa ts'ebetso e nepahetseng, matla le botšepehi ba matšoao li tlameha ho netefatsoa. Tsela ea ho latela litsela, moralo oa lifofane tse fatše, le mekhoa ea ho fokotsa lerata li tlameha ho nahanoa ka hloko. Ho lokela ho lebisoa tlhokomelo e khethehileng ho fokotsa ho kena-kenana le motlakase (EMI) ho thibela tšitiso ea tsamaiso.

3. Taolo ea mocheso:

Tsamaiso e nepahetseng ea mocheso e bohlokoa bakeng sa prototyping ea PCB lits'ebetsong tse bohlale tsa grid, moo tšebeliso ea matla e ka bang bohlokoa. Lichelete tsa mocheso, li-vents, le ho beha likarolo tse loketseng hantle li thusa ho qhala mocheso hantle. Lisebelisoa tsa tlhahlobo tse joalo ka software ea ketsiso ea mocheso li ka thusa baqapi ho tseba libaka tse ka bang chesang le ho netefatsa litharollo tse nepahetseng tsa ho pholisa.

4. Latela litekanyetso tsa polokeho:

Lisebelisoa tsa marang-rang tse bohlale li sebetsana le motlakase oa motlakase o phahameng, kahoo polokeho ke ntho e tlang pele. Prototypes ea PCB e tlameha ho ipapisa le litekanyetso tse tiileng tsa polokeho, joalo ka litlhoko tsa UL (Underwriters Laboratories). Insulation e nepahetseng, mekhoa ea ho theola fatše, le ts'ireletso ea overcurrent e lokela ho kopanngoa le moralo oa PCB ho thibela likotsi tsa motlakase le ho netefatsa hore ho latela melao.

5. Scalability le upgradeability:

Litsamaiso tse bohlale tsa grid li matla 'me li hloka ho khona ho amohela katoloso le lintlafatso tsa nako e tlang. Ha u rala li-prototypes tsa PCB bakeng sa litsamaiso tsena, bahlahisi ba tlameha ho nahana ka scalability. Sena se kenyelletsa ho siea sebaka se lekaneng bakeng sa li-add-on le ho etsa bonnete ba ho lumellana le mahlale a nakong e tlang. Ho sebelisa moralo oa modular le lihokelo tsa bokahohleng ho nolofatsa lintlafatso tsa nako e tlang mme ho fokotsa litšenyehelo tsa sistimi ka kakaretso.

6. Teko le netefatso:

Teko ka botlalo le netefatso ea li-prototypes tsa PCB li bohlokoa pele li ka romelloa lits'ebetsong tse bohlale tsa grid. Ho etsisa maemo a nnete a lefats'e ka tlhahlobo ea khatello ea tikoloho, tlhahlobo ea ts'ebetso, le tlhahlobo ea ho se atlehe ho ka fana ka leseli la bohlokoa mabapi le ts'epo le ts'ebetso ea PCB. Tšebelisano lipakeng tsa lihlopha tsa meralo le liteko ke ea bohlokoa ho ntlafatsa boleng ba sistimi ka kakaretso.

7. Ho ntlafatsa litšenyehelo:

Le hoja ho le bohlokoa ho finyella lintlha tsohle tse ka holimo, ho ntlafatsa litšenyehelo ho ke ke ha hlokomolohuoa. Litsamaiso tse bohlale tsa grid li hloka matsete a bohlokoa, 'me prototyping ea PCB e lokela ho ikemisetsa ho beha tekano lipakeng tsa ts'ebetso le moruo. Ho lekola mekhoa ea tlhahiso e baballang litšenyehelo le ho nka monyetla ka maemo a moruo ho ka thusa ho fokotsa litšenyehelo tsa tlhahiso.

Ha re phethela:

Prototyping ea PCB ea sistimi e bohlale ea grid e hloka tlhokomelo e hlokolosi ho lintlha le ho latela litlhoko tse ikhethileng. Ho tšepahala, ho tšoarella, matla le botšepehi ba matšoao, tsamaiso ea mocheso, ts'ebetso ea ts'ireletso, scalability, liteko le ho ntlafatsa litšenyehelo ke lintlha tsa bohlokoa ho netefatsa hore prototyping e atlehileng ea grid PCB. Ka ho sebetsana le lintlha tsena ka hloko, bahlahisi ba ka kenya letsoho ho nts'etsopele ea litharollo tsa matla tse sebetsang hantle, tse tsitsitseng le tse tsitsitseng tse tla bopa bokamoso ba marang-rang a rona a kabo.