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Tataiso ea mohato ka mohato ho 4-layer FPC prototyping

4 sekhahla sa FPC

Sengoliloeng sena se akaretsang se fana ka tataiso ea mohato ka mohato ho prototyping ea 4-layer flexible printed circuit (FPC). Ho tloha ho utloisisa menahano ea moralo ho ea ho tataiso e qaqileng mabapi le khetho ea thepa, lits'ebetso tsa khatiso, le tlhahlobo ea ho qetela, tataiso ena e akaretsa lintlha tsa bohlokoa tsa nts'etsopele ea 4-layer FPC, e fanang ka kutloisiso ea mekhoa e metle, liphoso tse tloaelehileng tse lokelang ho qojoa, le bohlokoa ba tlhahlobo le netefatso. . maikutlo.

Selelekela

Li-circuits tse hatisitsoeng tse feto-fetohang (FPCs) ke tharollo ea khokahanyo ea elektronike e feto-fetohang le e matla. Prototyping ea FPC e bapala karolo ea bohlokoa ho nts'etsopele ea li-FPC tsa 4-layer, tse batloang haholo ka lebaka la boholo ba tsona bo kopaneng le boholo ba likarolo. Sengoliloeng sena se fana ka tataiso e felletseng ea mohato ka mohato ho prototyping ea 4-layer FPC, e totobatsang bohlokoa ba mohato ka mong ts'ebetsong.

Ithute ka moralo oa FPC oa mekato e 4

4 lera fpc moralo

FPC, eo hape e tsejoang e le li-circuits tse hatisitsoeng tse feto-fetohang kapa lisebelisoa tsa elektroniki tse feto-fetohang, ke theknoloji ea ho kopanya lipotoloho tsa elektroniki ka ho kenya lisebelisoa tsa elektroniki ho li-substrates tsa polasetiki tse tenyetsehang. Ho latela 4-layer FPC, e bua ka moralo o nang le mekhahlelo e mene ea mesaletsa ea conductive le thepa e sireletsang. Li-FPC tsa 4-layer li rarahane 'me li hloka kutloisiso e tebileng ea menahano ea moralo joalo ka botšepehi ba matšoao, taolo ea impedance, le lithibelo tsa tlhahiso.

Tataiso ea Mohato ka Mohato ho4-Layer FPC Prototyping

A. Mohato oa 1: Moralo oa Potoloho ea Moralo

Mohato oa pele o kenyelletsa ho sebelisa lisebelisoa tsa software ho theha sebopeho sa potoloho bakeng sa ho beha likarolo hantle le ho tsamaisa litselana. Mothating ona, ho bohlokoa ho ela hloko ts'ebetso ea motlakase le mathata a mochini ho netefatsa moralo o matla.

B. Mohato oa 2: Khetha boitsebiso bo nepahetseng

Ho khetha thepa e nepahetseng ho bohlokoa ho fihlela thepa e hlokahalang ea motlakase le mochini. Lintlha tse kang ho feto-fetoha ha maemo, botsitso ba mocheso, le dielectric constant li tlameha ho hlahlojoa ka hloko ho fihlela litlhoko tse khethehileng tsa kopo.

C. Mohato oa 3: Hatisa lera le ka hare

Lera le ka hare le sebelisa theknoloji e tsoetseng pele ea tlhahiso ho hatisa mekhoa ea potoloho. Likarolo tsena hangata li na le mesaletsa ea koporo le lisebelisoa tse sireletsang tšireletso, 'me ho nepahala ha ts'ebetso ena ho bohlokoa ts'ebetsong ea kakaretso ea FPC.

D. Mohato oa 4: Khomarela 'me u hatelle lihlopha hammoho

Ka mor'a ho hatisa likarolo tse ka hare, li phutheloa 'me li entsoe ka laminated hammoho ho sebelisoa li-adhesives tse khethehileng le thepa ea ho hatisa. Mokhahlelo ona ke oa bohlokoa ho netefatsa botšepehi le ho khomarela lihlopha.

E. Mohato oa 5: Etching le Drilling

Etch ho tlosa koporo e feteletseng, e siea feela mekhoa e hlokahalang ea potoloho. Ho cheka ka mokhoa o nepahetseng ho etsoa ho etsa masoba le masoba. Ho nepahala ho babatsehang ho bohlokoa ho boloka botšepehi ba lipontšo le botsitso ba mechine.

F. Mohato oa 6: Ho Eketsa Surface Finish

Sebelisa mokhoa oa ho phekola holim'a metsi joalo ka khauta e qoelisoang kapa koae ea tlhaho ho sireletsa koporo e pepesitsoeng le ho netefatsa ts'ebetso e tšepahalang ea motlakase. Lisebelisoa tsena li hanana le maemo a tikoloho 'me li thusa ho cheseletsa nakong ea kopano.

G. Mohato oa 7: Tlhahlobo ea ho Qetela le Teko

Etsa lenaneo le felletseng la tlhahlobo le tlhahlobo ho netefatsa ts'ebetso, boleng le boikamahanyo ba FPC ea mekato e 4. Karolo ena e thata e kenyelletsa tlhahlobo ea motlakase, tlhahlobo ea pono le tlhahlobo ea khatello ea mochini ho netefatsa ts'ebetso le ts'epahalo ea mohlala.

4 layer fpc AOI teko

Malebela a ho Atleha ha 4-Layer FPC Prototyping

A. Mekhoa e Molemo ka ho Fetisisa ea Moralo oa Sebopeho sa FPC

Ho kenya ts'ebetsong mekhoa e metle, joalo ka ho boloka ts'ireletso e laoloang, ho fokotsa matšoao, le ho ntlafatsa topology ea routing, ho bohlokoa molemong oa moralo o atlehileng oa sebopeho sa FPC. Tšebelisano pakeng tsa lihlopha tsa moralo, tlhahiso le kopano e bohlokoa ho rarolla liphephetso tse ka bang teng tsa tlhahiso pele ho ts'ebetso.

B. Liphoso Tse Tloaelehileng Tsa ho Qoba Nakong ea Prototyping

Liphoso tse tloaelehileng, tse kang moralo o sa lekaneng oa li-stackup, sebaka se sa lekaneng sa ho fumana sebaka, kapa khetho ea thepa e hlokomolohuoang, e ka lebisa ho theko e boima hape le tieho ea linako tsa tlhahiso. Ho tsebahatsa le ho fokotsa maraba ana ka nepo hoa hlokahala ho tsamaisa tšebetso ea prototyping.

C. Bohlokoa ba ho etsa liteko le ho netefatsa

Lenaneo le felletseng la tlhahlobo le netefatso le bohlokoa ho netefatsa ts'ebetso le ts'epahalo ea prototype ea 4-layer FPC. Ho ikamahanya le maemo a indasteri le litlhaloso tsa bareki ho bohlokoa bakeng sa ho kenya kholiseho ts'ebetsong le ho tšoarella ha sehlahisoa sa ho qetela.

4 layer fpc prototyping bakeng sa Bluetooth Hearing Aid

4 Layer FPC Prototyping and Production Process

Qetello

A. Tlhahlobo ea Tataiso ea Mohato ka Mohato Tataiso ea mohato ka mohato bakeng sa prototyping ea mekhahlelo e 4 ea FPC e totobatsa tlhokomelo e hlokolosi e hlokahalang mothating o mong le o mong ho fihlela sephetho se atlehileng. Ho tloha mehopolong ea pele ea moralo ho isa tlhahlobong ea ho qetela le tlhahlobo, ts'ebetso e hloka ho nepahala le boiphihlelo.
B. Mehopolo ea ho Qetela ka 4-Layer FPC Prototyping Tsoelo-pele ea 4-layer FPC ke mosebetsi o rarahaneng o hlokang kutloisiso e tebileng ea theknoloji ea potoloho e feto-fetohang, saense ea thepa, le mekhoa ea tlhahiso. Ka ho latela litataiso tse qaqileng le boitseanape bo ntlafatsang, lik'hamphani li ka khona ho bona mathata a 4-layer FPC prototyping.

C. Bohlokoa ba ho Latela Litaelo Tse Hlakileng Bakeng sa Katleho ea ho Etsa Litšoantšiso Ho latela litaelo tse qaqileng le mekhoa e metle ea indasteri ho bohlokoa ho finyella bokhabane ho prototyping ea FPC. Likhamphani tse etelletsang pele ho nepahala, boleng, le boqapi lits'ebetsong tsa bona tsa prototyping li khona ho fana ka litharollo tsa 4-layer FPC tse fihlelang litlhoko tsa lits'ebetso tsa sejoale-joale tsa elektroniki.


Nako ea poso: Mar-05-2024
  • E fetileng:
  • E 'ngoe:

  • Morao