Ultrasonic PCB-Rigid-Flex Printed Circuit Board Technology Ka Capel

Fumana litharollo tsa PCB tse tsoetseng pele bakeng sa mechini ea ultrasonic. Fetolela theknoloji ea hau ka lihlahisoa tsa rona tse tsoetseng pele. Fumana liphetho tse ntle bakeng sa khoebo ea hau.

1. Innovating Ultrasonic Technology: Karolo ea Litharollo tsa PCB tse Rigid-Flexible

Lefats'eng le ntseng le tsoela pele la theknoloji ea bongaka, tlhokahalo ea mechini e nepahetseng haholo le ea boleng bo holimo e ntse e phahama. Kaha ke mofani ea ka sehloohong oa lisebelisoa tsa PCB tse feto-fetohang le litharollo tse thata tsa PCB, Capel e 'nile ea e-ba ka pele ho phetoho ea theknoloji ea ultrasonic ho tloha 2009. Capel e hatisa ka matla ho iketsetsa le ho rarolla mathata ka mekhoa ea eona ea morao-rao ea PCB. Ho blog ena, re tla shebisisa karolo ea bohlokoa ea liboto tsa potoloho tse hatisitsoeng tse thata-flex ho ntlafatsa bokhoni ba mechini ea ultrasonic, le kamoo boitseanape le boqapi ba Capel bo tsamaisang indasteri pele.

2. Ho sebelisa theknoloji ea ultrasonic ho lokolla matla a li-PCB tse thata-fetohang

Liboto tsa potoloho tse hatisitsoeng tse thata-flex li fetohile phetoho ea papali ho theknoloji ea ultrasonic, e fanang ka phetoho e ke keng ea lekanngoa le ts'ebetso. Li-PCB tsena tse tsoetseng pele li etselitsoe ho hokahana ka mokhoa o ts'oanang le meaho e rarahaneng ea metjhini ea ultrasound, e nolofalletsang khokahano e phahameng haholo le phetisetso e nepahetseng ea matšoao. Motsoako o ikhethang oa li-substrates tse thata le tse feto-fetohang li nolofalletsa mechine ea ultrasound ho finyella ts'ebetso e phahameng le ho tšepahala, ho beha palo e ncha ea theknoloji ea litšoantšo tsa bongaka.

3. Capel: Tharollo e tloaelehileng ea PCB ea Groundbreaking bakeng sa mechine ea ultrasonic

Ho Capel, boiphihlelo ba rona bo pharaletseng le boitseanape ba rona bo totobatsa boitlamo ba rona ba ho fana ka litharollo tsa PCB tsa maemo a holimo bakeng sa mechini ea ultrasonic. Re tsepamisitse maikutlo ho tlhophiso ho fihlela litlhoko tse ikhethang tsa bareki le ho fana ka litharollo tse ikhethileng ho tloha ho 1-30 layer ultrasonic mochini o feto-fetohang oa PCB ho isa ho 2-32 layer ultrasonic mochini o thata-flex PCB. Boinehelo ba rona ho boleng bo bonahala litifikeiting tsa rona, ho kenyelletsa le matšoao a IPC 3, UL le ROHS, hammoho le litifikeiti tsa ISO 14001:2015, ISO 9001:2015 le IATF16949:2016. Boitlamo bona bo sa thekeseleng ba bokhabane bo etsa hore Capel e be molekane ea tšeptjoang bakeng sa lihahi tsa mochini oa ultrasonic tse batlang litharollo tsa boleng bo holimo tsa PCB.

4. Ho senola phello ea phetoho ea li-laminates tse thata-flex ka theknoloji ea ultrasonic

Litabeng tsa morao tjena, phello ea mapolanka a potoloho a hatisitsoeng ka thata-flex ka theknoloji ea ultrasound e hohetse tlhokomelo e ngata. Ho kopanngoa ha li-PCB tse thata-thata ho thusa ho ntlafatsa ts'ebetso le ts'ebetso ea mechine ea ultrasound, ho bula tsela bakeng sa tsoelo-pele ea litšoantšo tsa bongaka. Ha indasteri e ntse e tsoela pele ho hlahloba bokhoni ba li-PCB tse thata-thata, Capel e ntse e le ka pele, ho khanna mekhoa e mecha le ho beha litekanyetso tse ncha tsa theknoloji ea ultrasonic.

5. Capel: E etellang pele Ultrasonic Technology Innovation e nang le Breakthrough PCB Solutions

Katleho ea Capel ea ho fetola theknoloji ea ultrasound ke ka lebaka la ho phehella ha rona bokhabane le mekhoa e mecha. Ka kakaretso ea lipatente tsa mefuta e 36 ea ts'ebeliso le litokelo tsa boqapi, re ntse re tsoela pele ho sutumelletsa meeli ea theknoloji ea PCB le ho qala tharollo ea katleho ho ntlafatsa ts'ebetso ea mechini ea ultrasonic. PCB ea rona ea ka tlung le lifeme tse thata tsa PCB, hammoho le bokhoni bo tsoetseng pele ba ho kopanya, li re thusa ho fana ka litharollo tse felletseng ho fihlela litlhoko tse lulang li fetoha tsa indasteri ea ultrasound.

6. Ho tlisa nako e ncha ea theknoloji ea ultrasound: Boitlamo ba Capel ho boqapi le bokhabane.

Ka bokhutšoanyane, ho kopanngoa ha liboto tsa potoloho tse hatisitsoeng tse thata-flex ho kentse nako e ncha ea boqapi le ts'ebetso ea theknoloji ea ultrasound. Takatso e sa thekeseleng ea Capel ea bokhabane, hammoho le bokhoni ba rona bo tsoetseng pele le boitseanape, ho re entse hore re be matla a ho nts'etsapele metjhini ea ultrasonic. Ha re sheba bokamoso, re lula re ikemiselitse ho sutumelletsa meeli ea theknoloji ea PCB le ho thusa baetsi ba mochini ba ultrasonic ho fihlela maemo a macha a ho nepahala le ts'ebetso. Ka Capel e le molekane oa hau eo u mo tšepang, bokamoso ba theknoloji ea ultrasound bo tla tlisa tsoelo-pele e e-s'o ka e e-ba teng, ho rala motheo oa phello ea phetoho litšoantšong tsa bongaka.