Tšebeletso ea Kopano ea CAPEL SMT
Li-FPC le li-PCB le li-PCB tse Rigid-Flex
Litšebeletso tsa Kopano tsa PCB tse potlakileng
√ matsatsi a 1-2 ka potlako retelehela pcb kopano prototype
√ Matsatsi a 2-5 a lisebelisoa tsa marang-rang ho tsoa ho barekisi ba tšepahalang
√ Karabelo e potlakileng bakeng sa tšehetso ea tekheniki le likeletso
√ Tlhahlobo ea BOM ho netefatsa ho tšoana ha likarolo le botšepehi ba data
KOPANO YA SMT
Quick Turn Prototype
Tlhahiso ea 'Misa
After-Sale Service 24 inthaneteng
Mokhoa oa Tlhahiso ea CAPEL
Tokiso ea lintho tse bonahalang→ Khatiso ea Solder Paste→ SPI→ IPQC→ Surface Mount Technology→ Reflow Soldering
↓
Tshireletso le Packaging ← After Welding ← Wave Soldering ← X-ray ←AOI ← Teko ea Pele ea Artide
CAPEL SMT/DIPmola
● IQC(Taolo ea Boleng e Kenang)
● IPQC(ln-process Quality Control)/FAl teko
● Tlhahlobo ea Pono ka mor'a hore reflow oven / AOl
● Lisebelisoa tsa CT
● Tlhahlobo ea Pono pele ho onto ea ho phalla hape
● QA tlhahlobo e sa reroang
● OQC (Taolo ea Boleng e Tsoang ntle)
CAPELSMT MOKHABANE
● Qotsulo ea Inthaneteng ka Metsotso
● 1-2Days ka potlako fetola pcb kopano prototype
● Karabelo e potlakileng bakeng sa tšehetso ea tekheniki le likeletso
● Tlhahlobo ea BOM ho netefatsa karolo
● ho tšoana le botšepehi ba data
● 7*24 Tšebeletso ea Bareki ba Inthaneteng
● Phatlalatso ea Phepelo e Phahameng ka ho Fetisisa
CAPELTHABELO SETS'ELI
● PCB Fabrication
● Likarolo Souring
● Kopano ea SMT&PTH
● Lenaneo, Teko ea Mosebetsi
● Kopano ea Cable
● Ho Koaheloa ka Mokhoa o Tloaelehileng
● Seboka sa Enclosure joalo-joalo.
CAPEL PCB Seboka sa Ts'ebetso Bokhoni ba Ts'ebetso
| Sehlopha | Lintlha | |
| Lead time | Lihora tse 24 Prototyping, nako ea ho fana ka batch e nyane e ka ba matsatsi a 5. | |
| Bokhoni ba PCBA | SMT patch 2 million points/letsatsi, THT 300,000 points/letsatsi, 30-80 orders/letsatsi. | |
| Tšebeletso ea likarolo | Turnkey | Ka tsamaiso ea thepa ea thepa e hōlileng tsebong le e sebetsang hantle, re sebeletsa merero ea PCBA ka ts'ebetso e theko e phahameng. Sehlopha sa baenjiniere ba litsebo tsa ho reka thepa le basebetsi ba nang le phihlelo ba ho reka thepa ke bona ba ikarabellang bakeng sa ho reka le ho laola likarolo tsa bareki ba rona. |
| E laetsoe kapa e laetsoe | Ka sehlopha se matla sa taolo ea thepa le ketane ea phepelo ea likarolo, Bareki ba re fa likarolo, re etsa mosebetsi oa kopano. | |
| Kopanya | Amohela likarolo kapa likarolo tse khethehileng li fanoa ke bareki. le lisebelisoa tsa lisebelisoa bakeng sa bareki. | |
| Mofuta oa Solder oa PCBA | Litšebeletso tsa thekiso ea SMT, THT, kapa PCBA ka bobeli. | |
| Solder Paste/Tin Wire/Tin Bar | lits'ebeletso tsa ts'ebetso tsa PCBA tse etellang pele le tse se nang lead (RoHS e lumellana). Hape u fane ka pente ea solder e hlophisitsoeng. | |
| Stencil | laser ho itšeha stencil ho etsa bonnete ba hore likarolo tse kang li-ICs tse nyane le BGA li kopana le Sehlopha sa IPC-2 kapa ho feta. | |
| MOQ | 1 sengoathoana, empa re eletsa bareki ba rona ho hlahisa bonyane disampole tse 5 bakeng sa tlhahlobo le liteko tsa bona. | |
| Boholo ba Karolo | • Likarolo tse sa sisinyeheng: re hantle ho lumellana le inch 01005 (0.4mm * 0.2mm), 0201 likaroloana tse joalo tse nyenyane. | |
| • Li-IC tse nepahetseng haholo tse kang BGA: Re ka lemoha likarolo tsa BGA ka sebaka sa Min 0.25mm ka X-ray. | ||
| Sephutheloana sa Karolo | reel, theipi e sehang, li-tubing, le liphalete bakeng sa likarolo tsa SMT. | |
| Boholo bo Nepahetseng ba Mount of Components (100FP) | Ho nepahala ke 0.0375mm. | |
| Mofuta oa PCB o rekisoang | PCB (FR-4, tšepe substrate), FPC, Rigid-flex PCB, Aluminium PCB, HDI PCB. | |
| Lera | 1 (60) | |
| Boholo ba sebaka sa ho sebetsa | 545 x 622 limilimithara | |
| Botenya bo fokolang | 4(lera)0.40mm | |
| 6(lera) 0.60mm | ||
| 8(lera) 0.8mm | ||
| 10(lera)1.0mm | ||
| Bophara bo fokolang ba mola | 0.0762 limilimithara | |
| Sebaka se fokolang | 0.0762 limilimithara | |
| Mocheso o fokolang oa ho bula | 0.15 limilimithara | |
| Sekoti lebota botenya ba koporo | 0.015 limilimithara | |
| Metallized aperture tolerance | ± 0.05 limilimithara | |
| Sekoti se senang tšepe | ± 0.025mm | |
| Ho mamellana le lesoba | ± 0.05 limilimithara | |
| Mamello ya dimensional | ± 0.076 limilimithara | |
| Borokho bo fokolang ba solder | 0.08 limilimithara | |
| Insulation resistance | 1E+12Ω (e tloaelehileng) | |
| Karolelano ea botenya ba poleiti | 1:10 | |
| Tšisinyeho ea mocheso | 288 ℃ (makhetlo a 4 ka metsotsoana e 10) | |
| E khopamisitsoe ebile e kobehile | ≤0.7% | |
| Matla a khahlanong le motlakase | ~1.3KV/mm | |
| Matla a thibelang ho hlobola | 1.4N/mm | |
| Solder hanela boima | ≥6H | |
| Ho lieha ha lelakabe | 94V-0 | |
| Taolo ea impedance | ±5% | |
| Sebopeho sa faele | BOM, PCB Gerber, Khetha le Sebaka. | |
| Teko | Pele ho pepa, re tla sebelisa mekhoa e fapaneng ea liteko ho PCBA e lutseng thabeng kapa e seng e ntse e le teng: | |
| • IQC: tlhahlobo e kenang; | ||
| • IPQC: tlhahlobo ea tlhahiso-pele, tlhahlobo ea LCR bakeng sa sengoathoana sa pele; | ||
| • QC e bonahalang: tlhahlobo ea boleng bo tloaelehileng; | ||
| • AOI: phello ea soldering ea likarolo tsa patch, likarolo tse nyenyane kapa polarity ea likarolo; | ||
| • X-Ray: hlahloba BGA, QFN le tse ling tse nepahetseng tse phahameng ke likarolo tse patiloeng tsa PAD; | ||
| • Teko ea Ts'ebetso: Mosebetsi oa teko le ts'ebetso ho latela mekhoa ea liteko le mekhoa ea bareki ho netefatsa hore ho latela melao. | ||
| Lokisa & Rework | Tšebeletso ea rona ea ho lokisa ea BGA e ka tlosa ka mokhoa o sireletsehileng BGA e lahlehileng, e sieo, le BGA e fosahetseng, 'me ea li hokela hape ho PCB ka mokhoa o phethahetseng. | |
CAPEL FPC & Flex-Rigid PCB Tshebetso ea Matla
| Sehlahisoa | Boima bo phahameng | |||
| Khokahano (HDI) | ||||
| Li-circuits tse tloaelehileng tsa Flex | Lipotoloho tsa Flat Flexible | Potoloho e thata ea Flex | Liphetoho tsa Membrane | |
| Standard Panel Size | 250mm X 400mm | Sebopeho sa roll | 250mmX400mm | 250mmX400mm |
| bophara ba mola le Sebaka | 0.035 limilimithara 0.035 limilimithara | 0 .010"(0.24mm) | 0.003"(0.076mm) | 0.10"(.254mm) |
| Botenya ba Koporo | 9um/12um/18um/35um/70um/100um/140um | 0.028mm-.01mm | 1/2 oz.le ho feta | 0.005"-.0010" |
| Layer Count | 32 | Motho a le mong | 32 | Ho fihlela ho 40 |
| VIA / BOKOLO BA BOIKO | ||||
| Bonyane Bonyane (Mechanical) Hole Diameter | 0.0004" ( 0.1 mm ) 0.006" ( 0.15 mm ) | N/A | 0.006" ( 0.15 limilimithara) | 10 mil (0.25 limilimithara) |
| Bonyane ka (Laser) Boholo | 4 mil (0.1mm) 1 mil (0.025 mm) | N/A | 6 mil (0.15 limilimithara) | N/A |
| Bonyane ba Micro Via ( Laser ) Boholo | 3 mil (0.076 mm) 1 mil (0.025 mm) | N/A | 3 mil (0.076 limilimithara) | N/A |
| Lintho tse Stiffener | Polyimide / FR4 / Metal /SUS /Alu | PET | FR-4 / Poyimide | PET / Metal/FR-4 |
| Thepa e Sireletsang | Koporo / silevera Lnk / Tatsuta / Carbon | Silver Foil/Tatsuta | Koporo / Silver Ink/Tattuta / Carbon | Silver Foil |
| Lisebelisoa | 2 mil (0.051 mm) 2 mil (0.051 mm) | 10 limilimithara (0.25mm) | 2 mil (0.51 limilimithara) | 5 mil (0.13 limilimithara) |
| Mamello ea Zif | 2 mil ( .051 mm) 1 mil ( 0.025 mm) | 10 limilimithara (0.25mm) | 2 mil (0.51 limilimithara) | 5 mil (0.13 limilimithara) |
| MOHLAKOLA MASOLE | ||||
| Solder Mask Bridge Pakeng tsa Letamo | 5 mil ( .013 mm) 4 mil (0 .01mm) | N/A | 5 mil (0.13 limilimithara) | 10 limilimithara (0.25mm) |
| Mamello ea Ngoliso ea Mask ea Solder | 4 mil ( .010 mm) 4 mil( 0.01mm) | N/A | 5 mil (0.13 limilimithara) | 5 mil (0.13 limilimithara) |
| SEKOAHELO | ||||
| Ngoliso ea Coverlay | 8 limilione tse 5 | 10 mil | 8 mil | 10 mil |
| Ngoliso ea PIC | 7 limilione tse 4 | N/A | 7 mil | N/A |
| Ngoliso ea Mask ea Solder | 5 limilione tse 4 | N/A | 5 mil | 5 mil |
| Surface Finish | ENIG/Ho qoelisoa silevera/Tin ea ho qoelisoa/Ho qoelisoa ka Tin/Gouta | |||
| Tšōmo | ||||
| Bonyane Bophahamo | 35 mil 25 mil | 35 mil | 35 mil | Sekoahelo sa Grafiken |
| Bophara bo fokolang | 8 limilione tse 6 | 8 mil | 8 mil | |
| Bonyane Sebaka | 8 limilione tse 6 | 8 mil | 8 mil | |
| Ngodiso | ±5mil ±5mil | ±5mil | ±5mil | |
| Tšitiso | ±10% ±10% | ±20% | ±10% | NA |
| SRD ( Steel Rule Die ) | ||||
| Hlalosa Mamello | 5 mil (0.13 mm) 2 mil (0.051 mm) | N/A | 5 mil (0.13 limilimithara) | 5 mil (0.13 limilimithara) |
| Bonyane radius | 5 mil (0.13 mm) 4 mil (0.10 mm) | N/A | 5 mil (0.13 limilimithara) | 5 mil (0.13 limilimithara) |
| Ka hare ho Radius | 20 mil (0.51 mm) 10 mil (0.25 mm) | N/A | 31 mil | 20 mil (0.51 limilimithara) |
| Hlakola bonyane ba Lesoba | 40 mil (10.2 mm) 31.5 mil (0.80 mm) | N/A | N/A | 40 mil (1.02 limilimithara) |
| Mamello ea Punch Hole Size | ± 2mil (0.051 mm) ± 1 mil | N/A | N/A | ± 2 mil (0.051 limilimithara) |
| Sekotjana Bophara | 20 mil (0.51 mm) 15 mil (0.38 mm) | N/A | 31 mil | 20 mil (0.51 limilimithara) |
| Toleranc ea lesoba ho hlalosa | ± 3 mil ± 2 mil | N/A | ± 4 mil | 10 mil |
| Mamello ea lesoba la lesoba ho outline | ± 4 mil ± 3 mil | N/A | ± 5 mil | 10 mil |
| Bonyane ba Trace ho hlalosa | 8 limilione tse 5 | N/A | 10 mil | 10 mil |
