Prototyping Service

Tšebeletso ea CAPEL Prototyping

FPCs & PCBs & Rigid-Flex PCBs & SMT Assembly

Bokhoni ba rona ba Tlhahiso:
Matla a tlhahiso ea FPC le Rigid-Flex PCBs a ka fihla ho feta 150000sqm ka khoeli,
Bokhoni ba tlhahiso ea li-PCB bo ka fihla ho 80000sqm ka khoeli, le ho bokella bokhoni ba likarolo tse 150,000,000 ka khoeli.

Quick Turn E tšepahalang PCB Prototyping

√ MOQ 1 sengoathoana
√ Lihora tse 24 ka potlako fetola mohlala oa pcb
√ 24x7 Ts'ebeletso ea thekiso ea tekheniki inthaneteng
√ Gerber faele tlhahlobo pele tlhahiso
√ Ts'ehetso ea lits'ebeletso tsa lisebelisoa tsohle le tse potlakileng
√ Li-microvia tse entsoeng ka laser
√ ka-ka-pad
√ Ho hlahloba Moralo bakeng sa Tlhahiso(DFM) Ho hlahloba
√ ho fihlela ho 60 layers,
√ IPC Class 3 Standard
√ ho kenya tshebetsong maemo a ISO 9001, ISO 14001, 5S le 6Q

Taolo ea Boleng

√ IQC(Taolo ea Boleng e Kenang)
√ IPQC(ln-process Quality Control)/teko ea FAl
√ Tlhahlobo ea Pono ka mor'a ontong ea reflow/AOl
√ Tlhahlobo ea Pono pele ho onto ea phallo
√ QA tlhahlobo e sa reroang
√ OQC (Taolo e Tsoang ya Boleng)
√ Tšebeletso ea Kopano ea PCB ea theknoloji e phahameng
(Mohala oa SMT/DIP)
√ Ho fumana likarolo tsa setsebi
√ Mananeo a macha le teko ya tshebetso

Tšebeletso ea Kopano ea PCB

√ Kopano ya SMT & PTH
√ 1-2days ka potlako fetola pcb kopano mohlala
√ Karabelo e potlakileng bakeng sa tšehetso ea tekheniki le likeletso
√ Tlhahlobo ea BOM ho netefatsa ho tšoana ha likarolo le botšepehi ba data
√ Ka Hole Board Assembly
√ Theknoloji e Kopantsweng(SMT/Thru-hole)
√ Ho beoa ka mahlakoreng a le mong kapa a mabeli
√ Pin count count ya boemo bo phahameng e lekana le matla a Rigid, Flexible PCB le Rigid flex PCB Assembly

Boiphihlelo le Matla a CAPEL

√ Ho etsa li-PCB ho tloha ka 2009
√ Sehlopha se matla sa R&D se nang le boiphihlelo ba lilemo tse 15
√ E etselitsoe liboto tse fihlang ho tse 60
√ Linyeoe tse sebeletsoang tse amehang tšimong ea 100+
√ Sistimi e felletseng ea k'hamphani (fektheri ea eona ea FPC/Rigid-Flex PCB, feme ea PCB, feme ea SMT)
√ Ho tlatsa sebopeho sa lefapha
(Lefapha la R&D, Lefapha la Boenjiniere, Lefapha la Thekiso ea Linaha tsa Maoatle, Lefapha la Theko, Lefapha la Tlhahiso, Lefapha la Ts'ebetso, Lefapha la Boleng, Lefapha la Tsamaiso ea polokelo ea thepa, Lefapha la Tsamaiso ea Lisebelisuoa, Lefapha la Ts'ebeletso ea Ka mor'a Thekiso ea Overseas)
√ Sistimi ea taolo ea boleng e thata ebile e ntlafalitsoe hantle

Sistimi e Matla ea Taolo ea Boleng ea CAPEL

Sehlahisoa se seng le se seng se hlahisoang ke k'hamphani se tlameha ho hlahlojoa ka thata ho netefatsa boleng

CAPEL PCB Kopano Prototyping

Tokiso ea lintho tse bonahalang→ Khatiso ea Solder Paste→ SPI→ IPQC→ Surface Mount Technology→ Reflow Soldering
↓
Tshireletso le Packaging ← After Welding ← Wave Soldering ← X-ray ←AOI ← Teko ea Pele ea Artide