Maboto a Potoloho a Habeli a FR4 a Hatisitsoeng
Matla a Ts'ebetso ea PCB
| Che. | Morero | Lipontšo tsa tekheniki |
| 1 | Lera | 1-60(lera) |
| 2 | Boholo ba sebaka sa ho sebetsa | 545 x 622 limilimithara |
| 3 | Botenya bo fokolang | 4(lera)0.40mm |
| 6(lera) 0.60mm | ||
| 8(lera) 0.8mm | ||
| 10(lera)1.0mm | ||
| 4 | Bophara bo fokolang ba mola | 0.0762 limilimithara |
| 5 | Sebaka se fokolang | 0.0762 limilimithara |
| 6 | Mocheso o fokolang oa ho bula | 0.15 limilimithara |
| 7 | Sekoti lebota botenya ba koporo | 0.015 limilimithara |
| 8 | Metallized aperture tolerance | ± 0.05 limilimithara |
| 9 | Mamello e se nang metale aperture | ± 0.025mm |
| 10 | Ho mamellana le lesoba | ± 0.05 limilimithara |
| 11 | Mamello ya dimensional | ± 0.076 limilimithara |
| 12 | Borokho bo fokolang ba solder | 0.08 limilimithara |
| 13 | Insulation resistance | 1E+12Ω (e tloaelehileng) |
| 14 | Karolelano ea botenya ba poleiti | 1:10 |
| 15 | Tšisinyeho ea mocheso | 288 ℃ (makhetlo a 4 ka metsotsoana e 10) |
| 16 | E khopamisitsoe ebile e kobehile | ≤0.7% |
| 17 | Matla a khahlanong le motlakase | ~1.3KV/mm |
| 18 | Matla a thibelang ho hlobola | 1.4N/mm |
| 19 | Solder hanela boima | ≥6H |
| 20 | Ho lieha ha lelakabe | 94V-0 |
| 21 | Taolo ea impedance | ±5% |
Re etsa Printed Circuit Boards ka boiphihlelo ba lilemo tse 15 ka botsebi ba rona
4 lera Flex-Rigid Boards
8 lera Rigid-Flex PCBs
8 lera HDI Printed Circuit Boards
Lisebelisoa tsa Tlhahlobo le Tlhahlobo
Teko ea microscope
Tlhahlobo ea AOI
Teko ea 2D
Teko ea Impedance
Teko ea RoHS
Flying Probe
Horizontal Tester
Ho Kobeha Teste
Tšebeletso ea rona ea Liboto tsa Potoloho e hatisitsoeng
.Fana ka tšehetso ea tekheniki Pele ho thekiso le ka mor'a thekiso;
.Tloaelo ho fihla ho mekhahlelo e 40, 1-2days Phetoho e potlakileng ea prototyping, Theko ea likarolo, Kopano ea SMT;
.E fana ka lisebelisoa tse peli tsa Bongaka, Taolo ea Liindasteri, Likoloi, Lifofane, Lisebelisoa tsa Bareki, IOT, UAV, Lipuisano joalo-joalo.
.Lihlopha tsa rona tsa baenjiniere le bafuputsi ba ikemiselitse ho phethahatsa litlhoko tsa hau ka ho nepahala le ka botsebi.
Maboto a Potoloho a Habeli a FR4 a kentsoeng matlapeng
1. Kabo ea matla: Kabo ea matla ea PC ea letlapa e amohela likarolo tse peli tsa FR4 PCB.Li-PCB tsena li thusa ho tsamaisa lithapo tsa motlakase hantle ho netefatsa maemo a matle a motlakase le ho ajoa ho likarolo tse fapaneng tsa letlapa, ho kenyeletsoa ponts'o, processor, memori le limojule tsa khokahano.
2. Tsela ea lipontšo: The double-layer FR4 PCB e fana ka wiring e hlokahalang le mokhoa oa ho tsamaisa lipontšo pakeng tsa likarolo tse fapaneng le li-module k'homphieutheng ea letlapa.Ba hokahanya lipotoloho tse fapaneng tse kopaneng (ICs), lihokelo, li-sensor le likarolo tse ling, ho netefatsa puisano e nepahetseng le phetisetso ea data ka har'a lisebelisoa.
3. Ho Kenyelletsoa ha Likarolo: The double-layer FR4 PCB e etselitsoe ho amohela ho hlongoa ha likaroloana tse fapaneng tsa Surface Mount Technology (SMT) letlapeng.Tsena li kenyelletsa li-microprocessors, li-module tsa memori, li-capacitor, li-resistors, li-circuits tse kopantsoeng le li-connectors.Moralo le moralo oa PCB o netefatsa sebaka se nepahetseng le tlhophiso ea likarolo ho ntlafatsa ts'ebetso le ho fokotsa tšitiso ea matšoao.
4. Boholo le compactness: Li-PCB tsa FR4 li tsejoa ka ho tšoarella ha tsona le boemo bo batlang bo le bosesane, bo etsang hore li lokele ho sebelisoa lisebelisoa tse kopanetsoeng tse kang matlapa.Li-PCB tsa FR4 tsa mekhahlelo e 'meli li lumella ho teteana ha likaroloana sebakeng se lekanyelitsoeng, ho nolofalletsa bahlahisi ho rala matlapa a masesaane le a bobebe ntle le ho senya ts'ebetso.
5. Katleho ea litšenyehelo: Ha e bapisoa le li-substrates tsa PCB tse tsoetseng pele, FR4 ke thepa e batlang e le theko e tlaase.Li-PCB tsa FR4 tsa mekhahlelo e 'meli li fana ka tharollo e theko e tlaase bakeng sa baetsi ba li-tablet ba hlokang ho boloka litšenyehelo tsa tlhahiso li le tlase ha ba ntse ba boloka boleng le botšepehi.
Liboto tsa Potoloho tse Hatisitsoeng tsa FR4 tsa Double-layer FR4 li matlafatsa ts'ebetso le ts'ebetso ea matlapa joang?
1. Lifofane tse fatše le tsa matla: Li-PCB tsa FR4 tse nang le mekhahlelo e 'meli hangata li na le lifofane tsa fatše le tsa motlakase tse inehetseng ho thusa ho fokotsa lerata le ho ntlafatsa kabo ea matla.Lifofane tsena li sebetsa e le litšupiso tse tsitsitseng bakeng sa botšepehi ba matšoao le ho fokotsa tšitiso pakeng tsa lipotoloho le likarolo tse fapaneng.
2. Tsela e laoloang ea impedance: E le ho etsa bonnete ba hore phetisetso ea lipontšo e ka tšeptjoang le ho fokotsa ho fokotseha ha pontšo, ho sebelisoa ha mokhoa o laoloang oa impedance ha ho etsoa moralo oa FR4 PCB e habeli.Mesaletsa ena e entsoe ka hloko ka bophara bo itseng le sebaka ho fihlela litlhoko tsa ho thibela mats'oao a lebelo le holimo joalo ka USB, HDMI kapa WiFi.
3. Tšireletso ea EMI / EMC: FR4 PCB e nang le mekhahlelo e 'meli e ka sebelisa theknoloji ea ho sireletsa ho fokotsa ho kena-kenana le motlakase (EMI) le ho netefatsa ho lumellana ha motlakase (EMC).Likarolo tsa koporo kapa ts'ireletso li ka eketsoa moralong oa PCB ho arola li-circuits tse hlokolosi ho tsoa mehloling ea kantle ea EMI le ho thibela mesi e ka sitisang lisebelisoa kapa lits'ebetso tse ling.
4. Maikutlo a moralo o phahameng oa maqhubu: Bakeng sa matlapa a nang le likarolo tse phahameng tsa maqhubu kapa li-modules tse kang khokahanyo ea cellular (LTE/5G), GPS kapa Bluetooth, moqapi oa FR4 PCB ea makhetlo a mabeli e hloka ho nahana ka ts'ebetso ea maqhubu a phahameng.Sena se kenyelletsa ho bapisa ho se sebetse, ho laoleha crosstalk le mekhoa e nepahetseng ea ho tsamaisa RF ho netefatsa hore mats'oao a ts'epahala le tahlehelo e nyane ea phetisetso.
