Multi-Layer HDI PCB Circuit Boards Quick Turn Pcb Manufacturers
High Density Interconnect (HDI) Printed Circuit Boards (PCBs) E etselitsoe Haholo Bakeng sa Likopo tsa Sefofane.
-Capel o na le lilemo tse 15 tsa boiphihlelo ba botekgeniki-
Re Tsebisa Li-High Density Interconnect (HDI) Printed Circuit Boards (PCBs) tse etselitsoeng ka ho khetheha lits'ebetso tsa sepakapaka. PCB ena ea 4-layer e hahiloe ka ho nepahala le ho ts'epahala ho fihlela litlhoko tse thata tsa indasteri ea sepakapaka.
PCB ena ea 4-layer e entsoe ho tloha substrate ea FR4 e nang le botenya ba 1.0 mm le mamello ea +/- 10%, e leng se etsang hore e be tharollo e potlakileng ea ho fetola lifofane tse hlokang prototyping le tlhahiso e potlakileng. 18um ka hare le kantle ho koporo botenya e netefatsa conductivity e nepahetseng le phetisetso ea matšoao, ha 'mala o mosoeu oa solder o fana ka pheletso e hloekileng le e hloahloa.
Empa se hlileng se khethollang HDI PCB ena ke ho foufala ha eona le ho patoa ka bokhoni, hammoho le bonyane ba eona ba 0.1mm ka boholo. Sena se etsa hore ho be le meralo e rarahaneng empa e kopane, e leng bohlokoa bakeng sa li-avionics. Ntle le moo, PCB e fana ka kalafo ea bokaholimo ba LF HASL bakeng sa ho tšoarella le ho hanyetsa maemo a tikoloho joalo ka mongobo le kutu.
E 'ngoe ea likarolo tse ka sehloohong tsa setšoantšo sena se phahameng sa 4-layer HDI PCB ke bokhoni ba eona ba ho fana ka ho nepahala ho phahameng, ho etsa hore e tšoanelehe bakeng sa likopo moo ho nepahala le ts'ebetso e leng tsa bohlokoa. E na le mohala o fokolang le sebaka le ho mamellana ha lesoba ho tlase ho 0.05mm, PCB e fana ka ts'episo le botsitso bo hlokahalang ho li-avionics.
Ho feta moo, ho ba sieo ha taolo ea impedance ho nolofalletsa lits'ebetso tse feto-fetohang ho fihlela litlhoko tse fapaneng tsa li-avionics. Ho sa tsotellehe hore na e sebelisoa mekhoeng ea puisano, lisebelisoa tsa ho tsamaea kapa tsamaiso ea lifofane, setšoantšo sena sa HDI PCB se fana ka tharollo e tšepahalang le e fapaneng bakeng sa lifofane tse batlang li-PCB tse sebetsang hantle le tse nepahetseng.
Ka kakaretso, li-prototypes tsa rona tse phahameng tsa 4-layer HDI PCB ke khetho e phethahetseng bakeng sa lihlahisoa tsa avionics tse hlokang tharollo e potlakileng ea phetoho, ho nepahala ho phahameng le ho tšepahala. Likarolo tsa eona tse tsoetseng pele le bokhoni ba eona li etsa hore e be e loketseng bakeng sa lifofane tse batlang ho lula li le ka pele ho indasteri e ntseng e fetoha ka potlako. Tšepa li-PCB tsa rona tsa HDI ho fana ka ts'ebetso le boleng bo holimo bakeng sa lits'ebetso tsa hau tsa sefofane.
Capel Flexible PCB & Rigid-Flex PCB Mokhoa oa Ts'ebetso ea Matla
| Sehlopha | Bokhoni ba Ts'ebetso | Sehlopha | Bokhoni ba Ts'ebetso |
| Mofuta oa Tlhahiso | FPC e le 'ngoe / Mekhahlelo e habeli FPC Multi-layer FPC / Aluminium PCBs Regid-Flex PCB | Layer Number | 1-30likarolo FPC 2-32likarolo Rigid-FlexPCB1-60likarolo Rigid PCB HDIMaboto |
| Max Manufacture size | FPC e le 'ngoe ea 4000mm Mekhahlelo e habeli FPC 1200mm Mefuta e mengata ea FPC 750mm Regid-Flex PCB 750mm | Insulating Layer Botenya | 27.5um / 37.5/ 50um / 65/ 75um / 100um / 125um / 150um |
| Botenya ba Boto | FPC 0.06mm - 0.4mm Rigid-Flex PCB 0.25 - 6.0mm | Mamello ea PTH Boholo | ± 0.075mm |
| Surface Finish | Ho qoelisoa ka Khauta/ Ho qoelisoa Silver/Gold Plating/Tin Plating/OSP | Stiffener | FR4 / PI / PET / SUS / PSA/Alu |
| Semicircle Orifice Size | Ka tlase ho 0.4mm | Min Line Space/ bophara | 0.045mm/0.045mm |
| Botenya Mamello | ± 0.03 limilimithara | Tšitiso | 50Ω-120Ω |
| Botenya ba Koporo ea Foil | 9um/12um/18um/35um/70um/100um | Tšitiso Laolwa Mamello | ±10% |
| Mamello ea NPTH Boholo | ± 0.05 limilimithara | The Min Flush Width | 0.80 limilimithara |
| Min Via Hole | 0.1 limilimithara | Phethahatsa Standard | GB / IPC-650 / IPC-6012 / IPC-6013II / IPC-6013III |
Capel e etsa Boto ea Potoloho ea Rigid Flexible / Flexible PCB / HDI PCB e nang le boiphihlelo ba lilemo tse 15 ka botsebi ba rona.
2 Layer Flexible PCB Boards Stackup
4 Layer Rigid-Flex PCB Stackup
8 lera HDI PCBs
Lisebelisoa tsa Teko le Tlhahlobo
Teko ea microscope
Tlhahlobo ea AOI
Teko ea 2D
Teko ea Impedance
Teko ea RoHS
Flying Probe
Horizontal Tester
Ho Kobeha Teste
Capel e fa bareki tšebeletso ea PCB e hlophisitsoeng ka lilemo tse 15 tsa boiphihlelo
- Ho rua 3lifeme bakeng sa Flexible PCB&Rigid-Flex PCB, Rigid PCB, DIP/SMT Assembly;
- 300+Baenjiniere ba Fana ka tšehetso ea tekheniki bakeng sa thekiso ea pele le ka mor'a thekiso inthaneteng;
- 1-30likarolo tsa FPC,2-32likarolo Rigid-FlexPCB,1-60likarolo Rigid PCB
- HDI Boards, Flexible PCB (FPC), Rigid-Flex PCBs, Multilayer PCBs, Single-sided PCB, Double-Sided Circuit Boards, Hollow Boards, Rogers PCB, rf PCB, Metal Core PCB, Special Process Boards, Ceramic PCB, Aluminium PCB , Kopano ea SMT & PTH, Tšebeletso ea Prototype ea PCB.
- Fana ka24-horaTs'ebeletso ea Prototyping ea PCB, Lihlopha tse Nyenyane tsa liboto tsa potoloho li tla tlisoa ka hareMatsatsi a 5-7, Tlhahiso ea 'Misa ea liboto tsa PCB e tla fanoa kaLibeke tse 2-3;
- Liindasteri tseo re li sebeletsang:Lisebelisoa tsa Bongaka, IOT, TUT, UAV, Lifofane, Likoloi, Khokahano ea Mohala, Consumer Electronics, Sesole, Sefofane, Taolo ea Liindasteri, Intelligence ea Maiketsetso, EV, joalo-joalo…
- Bokhoni ba rona ba Tlhahiso:
Matla a tlhahiso ea FPC le Rigid-Flex PCB a ka fihla ho feta150000sqmka khoeli,
Bokhoni ba tlhahiso ea PCB bo ka fihla80000sqmka khoeli,
PCB Ho bokella bokhoni ho150,000,000likarolo ka khoeli.
- Lihlopha tsa rona tsa baenjiniere le bafuputsi ba ikemiselitse ho phethahatsa litlhoko tsa hau ka ho nepahala le ka botsebi.
